Abstract: A shock-absorbing claw hammer includes a handle, a claw and a striking head. Vibrations in the handle caused by the striking head striking an object are at least partially reduced by shock-absorbing means. In one embodiment, the head includes a top surface and a lower surface, with the lower surface of the head coupled to the handle. The claw includes a first slit for pulling nails, and the head further defines a second slit extending from the top surface of the head towards the lower surface of the head situated generally between the striking head and the claw. In another embodiment, tension and compression rebars are positioned within the handle, with the striking head coupled to the compression rebar and the claw coupled to the tension rebar such that the striking head and the claw move relative to one another upon striking an object.

Abstract: In semiconductor wafer polishing, a backing pad is sized smaller than the wafer being polished so as to produce a desired backset, allowing the wafer to bend, thereby reducing over-polish at the wafer edge.