Patents Examined by Yong K. Kim
  • Patent number: 5547389
    Abstract: A socket for receiving an IC chip having ball-shaped pins is disclosed. The socket includes a base having a plurality of through holes defined therein, a sliding cover housing the base and having a central opening for permitting the IC chip to be inserted therethrough, and an actuating rod located between the base and the cover for causing a sliding movement of the cover relative to the base. Each of said through holes has a contacting leg disposed therein and said leg has a first end extending beyond an upper face of the base and a second end extending through a bottom of the base. Said first end has an arcuate surface which is perpendicular to the sliding movement of the IC chip and has a curvature equal to that of the ball-shaped pin of the IC chip so as to make an electrical surface contact with the ball-shaped pin when the IC chip is moved to be fastened on the base.
    Type: Grant
    Filed: May 23, 1995
    Date of Patent: August 20, 1996
    Inventor: Feng-chien Hsu
  • Patent number: 5538437
    Abstract: A connector assembly is disclosed having a latching mechanism for locking the assembly to the rear of an IC (integrated circuit) card. The assembly incorporates an actuator for operating the latching mechanism. The actuator is rotatably mounted at the rear portion of the housing of the connector assembly, which allows the assembly to have a short profile. The cable for the assembly is connected to one side of the housing.
    Type: Grant
    Filed: March 3, 1995
    Date of Patent: July 23, 1996
    Assignee: ITT Industries, Inc.
    Inventors: Charles L. Bates, III, Gary C. Bethurum