Abstract: An electrical component housing for the powerhead of an outboard motor in which the housing is mounted to the engine between oppositely slanted cylinder banks, which provide a V-shaped engine. The engine is mounted to an adaptor plate, and the electrical component housing is interconnected with the adaptor plate through projections provided on the housing which are received within recesses formed in the adaptor plate. Mounting flanges are provided at the upper portion of the electrical component housing, and are secured in mounting surfaces associated with the engine.

Abstract: A radial type of parallel system bus structure used bus wire-printed disks each having printed signal conductors of equal length extending radially from a common contact center. Each printed signal conductor comprises two twisted conductor lines, and each conductor line consists of many segments disposed alternately on opposite surfaces of the disk, the successive segments of each line being connected by plating in through-holes in the disk. The radial arrangement of signal conductors permits connection of selected CPU boards via equal length of signal path. Also, the use of twisted conductor lines improves the signal transmission characteristics of the bus in high-frequency ranges.

Abstract: An improved DC to DC converter apparatus including a metal-backed PC board which serves as the base plate of the device and has the principal power consuming components affixed thereto, and a conventional circuit board having the relatively lower power consuming electronic components affixed to it, the latter board being secured in closely spaced relationship to the metal-backed board using connecting elements which provide both electrical and thermal interconnection between the two boards. All device connect pins extend from the conventional board, and the entire device is potted in a thermally conductive potting material.

Abstract: An electronic packaging module in which the inactive sides of integrated circuit chips are held in compression against a heat spreader by an elastomer pressed thereagainst by a multilayer flexible printed circuit board. A TAB frame, which may be demountable, interconnects integrated circuit chips to a multilayer flexible printed circuit board. A backing plate is fastened to a heat spreader so that it presses against the multilayer flexible printed circuit board. Contacts are compressed against the motherboard to interconnect the multilayer flexible printed circuit board thereto. Coaxial power connectors provide power and ground connections between non-peripheral portions of the multilayer flexible printed circuit board and the motherboard.

Abstract: An electronic assembly (e.g., a supercomputer) wherein different levels of substrates, each having a plurality of heat-generating electronic components (e.g., resistors, capacitors, power supplies, VLSI modules) thereon, is described. The assembly includes a cooling structure centrally disposed therein for providing cooling fluid to each of the heat generating components to cool same. In a preferred embodiment, the cooling structure comprises a plurality of concentrically disposed duct members (e.g., of thermoplastic), which each in turn include a longitudinal chamber portion and a flared end portion. The flared end portion is particularly designed to direct the cooling fluid in a plurality of directions, depending on the requirements of the assembly. Diffusing structure (e.g., an apertured plate) may also be used to assure passage of turbulent, even fluid flow through each duct member.

Abstract: A conformable, gel-like pad, preferably of silicone, with a thermally conductive additive conducts heat away from a packaged electronic power device with which it is in contact. Formed by adding particles of a thermally conductive material such as aluminum powder, nickel, aluminum oxide, iron oxide, beryllium oxide, silver, etc., to a mixture of silicone resins and curing agents poured into a mold, the molded pad can be formed to accommodate virtually any geometry and size of electronic component to provide a custom-fit at little cost. A thin, solid sheet of a thermally conductive metal such as aluminum positioned in contact with a surface of the conformable pad further increases heat removal. Another embodiment contemplates a metallic foil disposed in contact with a surface of or within the conformable pad and extending therefrom which can be coupled to a heat sink or to neutral ground potential for radiation shielding.

Abstract: An assembly is provided for holding a printed circuit board between spaced surfaces. The assembly comprises a plurality of wedge-shaped members slidably mounted end-to-end on a rod, with at least one of those members being movable in a transverse direction relative to the rod and to its respective adjacent members upon effective shortening of the rod to thereby bring a clamping surface of the transversely movable member into contact with a printed circuit board and to apply a clamping force thereto. The retainer is disposed in a recess of a base structure which includes an abutment formed at one end of the recess. The retainer is activated by rotating the rod thereby urging the slidably mounted members towards one another. Bevelled washers are disposed on the rod between the abutment and one of the end-most members which, when compressed upon tightening of the retainer, provide a force tending to urge the members away from the abutment.

Abstract: A high density integrated circuit module is comprised of a plurality of integrated circuit chips; each of the chips has top and bottom surfaces and thin sides; and all of the chips are arranged in a stack in which the sides of the chips form multiple faces of the stack. Also, in accordance with the invention, a selected face of the stack has a zigzag shape which exposes a portion of the top surface of each chip on that face; and, bonding pads for carrying input/output signals to/from the chips are located on the exposed top surface portion of the chips. This zigzag shape is produced by (a) providing an indentation in the side of each of the chips which lie along the selected stack face; or (b) by offsetting the sides of the chps from each other as they lie along the selected stack face; or (c) by providing respective spacers between the chips and indenting them from the chips along the selected stack face.