Patents Examined by Zachary Pape
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Patent number: 11716831Abstract: A electronic device includes: a plurality of substrates each including a substrate main body and a heat generating element, the plurality of substrates being provided side by side in a plate thickness direction; a cooler which is provided between the substrates adjacent to each other, and configured to cool the heat generating element; and a piping which is made of metal, and is connected to the cooler. The piping includes: an inner piping portion which is arranged in an inter-substrate region, and is connected to the cooler; an inner piping extending portion provided so as to extend from the inner piping portion to an outer side of the inter-substrate region; and an outer piping portion which is arranged to be shifted from the inter-substrate region, and is connected to the inner piping extending portion. The outer piping portion includes a movable piping portion that is deformable.Type: GrantFiled: April 22, 2019Date of Patent: August 1, 2023Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Koji Kise, Hiroaki Ishikawa, Takashi Moriyama, Yuki Sakata
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Patent number: 11706904Abstract: An electronic device is provided, which may include a first housing; a second housing configured to accommodate at least a portion of the first housing and guide a sliding movement of the first housing; a display including a first display area disposed on the first housing and a second display area extending from the first display area; a PCB configured to accommodate at least one electronic component; a support member configured to support the PCB; a side wall member connected to the support member and facing at least a portion of the first housing; a heat dissipation sheet configured to receive heat from the at least one electronic component, the heat dissipation sheet being disposed on the support member and the side wall member; and a heat dissipation member disposed on the side wall member and facing the heat dissipation sheet.Type: GrantFiled: October 27, 2021Date of Patent: July 18, 2023Inventors: Jooyoung Kang, Myunghoon Kwak, Baekeun Cho, Hyunsuk Kim, Sanghyuk Park, Soohyun Seo, Nakhyun Choi, Yangwook Kim, Hyunju Hong
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Patent number: 11706902Abstract: A cold plate may include a plate body having a thermal conductive side; a plurality of parallel hollow fluid channels running inside the plate body; at least one fluid inlet in direct fluid communication with a first subset of the plurality of parallel hollow fluid channels; at least one fluid outlet in direct fluid communication with a second subset of the plurality of parallel hollow fluid channels; and a porous thermal conductive structure which fluidly connect the first subset of the plurality of parallel hollow fluid channels to the second subset of the plurality of parallel hollow fluid channels, and which is in thermal contact with the thermal conductive side of the plate body. The porous thermal conductive structure may include a plurality of elongate fluid contact surface regions, each may be extending continuously lengthwise along a longitudinal side of respective fluid channel to serve as a fluid interface.Type: GrantFiled: August 19, 2021Date of Patent: July 18, 2023Assignee: AEM SINGAPORE PTE. LTD.Inventors: See Jean Chan, Zhaomeng Wang
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Patent number: 11690202Abstract: An electronic rack includes one or more servers, where each server is contained within a respective server container, and each server is at least partially submerged in two-phase liquid coolant, where, while the server generates heat that is transferred to the two phase liquid coolant thereby causing some of the two phase liquid coolant to turn into a vapor. The electronic rack includes a condenser container and condensing coils mounted at a top portion of the electronic rack to condense the vapor into the two-phase liquid coolant. The electronic rack includes a vapor manifold along a length of the electronic rack, the vapor manifold coupling the condenser container to a respective server, where the vapor manifold carries the vapor from the servers to the condensing coils. The electronic rack includes a first return line coupled to the condenser container, to return the two-phase liquid coolant to a coolant unit.Type: GrantFiled: June 22, 2021Date of Patent: June 27, 2023Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 11690195Abstract: A cooling system for power semiconductor switches is provided. The cooling system includes a heat sink that is pressed against the power semiconductor switch. A plenum is also provided with an opening through a wall thereof which is aligned with the heat sink. A fan draws air through or around the heat sink and through the plenum wall opening and the plenum in order to cool the power semiconductor switch.Type: GrantFiled: September 11, 2020Date of Patent: June 27, 2023Assignee: ABB SCHWEIZ AGInventors: Thomas Kendzia, III, Christopher Alan Belcastro, Taylor Miller
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Patent number: 11690204Abstract: The present disclosure provides a heat dissipation module, a display device and an assembling method of the display device. In order to avoid the second windowing area from forming a sealed space during the defoaming treatment, an exhaust passage is formed between the second windowing area B and an edge of a heat dissipation film, and hot air formed in the second windowing area in a defoaming technology can be effectively released to the outside of the heat dissipation module through the exhaust passage, so that defects of the second windowing area can be effectively overcome, and increasing the attachment yield is facilitated.Type: GrantFiled: September 7, 2020Date of Patent: June 27, 2023Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.Inventors: Feng Xiao, Hongqiang Luo, Lixiang Yi, Xun Yao
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Patent number: 11678468Abstract: Methods and systems are provided for a power module. In one example, the power module may have a half-bridge configuration with electrical terminals arranged at opposite side of the power module, semiconductor chips arranged in a printed circuit board (PCB), a capacitor electrically coupled to the electrical terminals and arranged above and in contact with a top plate of the power module, and one or more connectors coupled to the PCB to couple the power module to external circuits. The power module may be directly cooled by flowing a coolant over the semiconductor chips.Type: GrantFiled: September 24, 2020Date of Patent: June 13, 2023Assignee: DANA TM4 INC.Inventors: Benoit Blanchard St-Jacques, Francois Dube, Marc-Antoine Beaupre
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Patent number: 11672107Abstract: A control cabinet for at least one electrical drive controller includes a control cabinet housing a first cabinet compartment formed in the control cabinet housing and having at least one inlet opening for fresh air, at least one first transfer opening and a fresh air duct flow-connecting the inlet opening to the first transfer opening. A second cabinet compartment is formed in the control cabinet housing and has at least one outlet opening for exhaust air, at least one second transfer opening, and an exhaust air duct flow-connecting the outlet opening to the second transfer opening. A third cabinet compartment is formed in the control cabinet housing and is sealed off in terms of flow from the first cabinet compartment, the second cabinet compartment, and the environment outside the control cabinet.Type: GrantFiled: June 23, 2020Date of Patent: June 6, 2023Assignee: KUKA Deutschland GmbHInventor: Dietmar Steidl
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Patent number: 11669131Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.Type: GrantFiled: November 12, 2021Date of Patent: June 6, 2023Assignee: APPLE INC.Inventors: Scott Myers, Matthew Theobald, Richard Heley, Adam Stagnaro, Richard Hung Minh Dinh, David Pakula, Tang Yew Tan
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Patent number: 11672105Abstract: In one example, a heat pipe is configured to absorb and transfer heat away from ambient air of a data center to cool the ambient air circulating in the data center to cool devices of the data center, and a fluid interface is thermally coupled to the heat pipe and configured to cool the heat pipe via a coolant fluid circulating in the data center. In another example, a heat pipe configured to release transferred heat to air, and a fluid interface is thermally coupled to the heat pipe and configured to exchange heat to the heat pipe to cool a coolant fluid circulating in a data center to cool devices of the data center.Type: GrantFiled: December 18, 2020Date of Patent: June 6, 2023Assignee: Meta Platforms, Inc.Inventors: Seung H. Park, Marco Antonio Magarelli, Veerendra Prakash Mulay, David Abad Cenizal, Jacob Na, Sarah E. Hanna
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Patent number: 11672106Abstract: A chassis includes top rails extending along a top side of the chassis, bottom rails extending along a bottom side of the chassis, a fluid inlet connected to the chassis that is configured to receive a thermal transfer fluid, and a fluid outlet connected to the chassis that is configured to discharge the thermal transfer fluid. The chassis further includes a thermal transfer fluid path extending between and fluidly coupled to the fluid inlet and the fluid outlet, wherein the thermal transfer fluid is configured to flow through the thermal transfer fluid path, and wherein the thermal transfer fluid path extends in a serpentine pattern through at least one of the top rails and through at least one of the bottom rails.Type: GrantFiled: June 28, 2021Date of Patent: June 6, 2023Assignee: Hamilton Sundstrand CorporationInventors: Jason C. Duffy, Kenneth J. Trotman
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Patent number: 11665867Abstract: Thermal structures and, more particularly, improved thermal structures for heat transfer devices and spatial power-combining devices are disclosed. A spatial power-combining device may include a plurality of amplifier assemblies and each amplifier assembly includes a body structure that supports an input antenna structure, an amplifier, and an output antenna structure. One or more heat sinks may be partially or completely embedded within a body structure of such amplifier assemblies to provide effective heat dissipation paths away from amplifiers. Heat sinks may include single-phase or two-phase materials and may include pre-fabricated complex thermal structures. Embedded heat sinks may be provided by progressively forming unitary body structures around heat sinks by additive manufacturing techniques.Type: GrantFiled: May 18, 2022Date of Patent: May 30, 2023Assignee: Qorvo US, Inc.Inventor: Dylan Murdock
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Patent number: 11665856Abstract: An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat sink body, and a heat transfer assembly between the heat generating component and the heat sink body. The heat transfer assembly may include a flexible, heat conductive layer having a first portion in thermal contact with the heat generating component and a second portion in thermal contact with the heat sink body. The first and second portions are thermally coupled, and a compressible layer is between the first and second portions of the flexible, heat conductive layer.Type: GrantFiled: October 26, 2021Date of Patent: May 30, 2023Assignee: EAGLE TECHNOLOGY, LLCInventors: Jason Thompson, Marcus Ni, Voi Nguyen
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Patent number: 11665857Abstract: A receptacle assembly includes a heat sink assembly for a receptacle cage for dissipating heat from a pluggable module plugged into the receptacle cage. The heat sink assembly includes fin plates and spacer plates arranged in a plate stack independently movable for engaging and conforming to the pluggable module. Each spacer plate includes a thermal interface at a bottom of the spacer plate engaging the pluggable module. Each fin plate includes a thermal interface at a bottom of the fin plate engaging the pluggable module. The fin plates include branched fin plates and unbranched fin plates. Each of the unbranched fin plates are planar between the bottom and the distal end thereof. Each of the branched fin plates are non-planar and include at least one bend between the bottom and the distal end thereof.Type: GrantFiled: September 17, 2020Date of Patent: May 30, 2023Assignee: TE CONNECTIVITY SOLUTIONS GmbHInventors: Alex Michael Sharf, Steven M. Will
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Patent number: 11659699Abstract: A power electronics unit may include a circuit board and a cooling device. The circuit board may include at least one electronic component which, in a heat transfer region, is disposed flat against an electronics side of the circuit board. The cooling device may include at least one impingement jet chamber through which a cooling fluid is flowable from an inlet to an outlet. The cooling device may further include at least one nozzle plate having at least one flow nozzle. The at least one nozzle plate may be arranged in and divide the at least one impingement jet chamber into an inlet chamber and an outlet chamber, which may be fluidically connected to one another via the at least one flow nozzle. The at least one flow nozzle may accelerate and conduct the cooling fluid towards the heat transfer region of the at least one electronic component.Type: GrantFiled: May 24, 2019Date of Patent: May 23, 2023Inventors: Sebastian Egger, Matthias Ganz, Janko Horvat, Niklas Kull, Peter Sever
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Patent number: 11659698Abstract: A power module for electric drives is provided which comprises at least one exciter circuit with at least one power semiconductor, wherein the power module is molded and the exciter circuit with the at least one power semiconductor is integrated in the molded power module. A traction inverter is also provided which comprises a water-cooled main cooler, wherein the main cooler comprises a bearing surface which is configured to receive power modules, wherein the traction inverter comprises at least one molded power module, and wherein the main cooler forms a cooling connection which is configured to receive the molded power module on the main cooler.Type: GrantFiled: September 24, 2020Date of Patent: May 23, 2023Assignee: AUDI AGInventor: Daniel Ruppert
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Patent number: 11653472Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.Type: GrantFiled: February 23, 2022Date of Patent: May 16, 2023Assignee: ICEOTOPE GROUP LIMITEDInventors: David Amos, Neil Edmunds, Andrew Young, Jasper Kidger, Nathan Longhurst
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Patent number: 11650640Abstract: A display device includes a display panel, and a heat-dissipating member disposed on the display panel and including a conductive metal. The display device further includes a sound generator disposed on the heat-dissipating member and generating sound by vibrating the display panel and the heat-dissipating member. The display device additionally includes a display circuit board disposed on the heat-dissipating member. The heat-dissipating member includes openings and a first line formed in the openings, and the first line electrically connects the sound generator with the display circuit board.Type: GrantFiled: December 26, 2019Date of Patent: May 16, 2023Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Byeong Hee Won, Jung Hun Noh, Yi Joon Ahn
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Patent number: 11653479Abstract: A rack cooling system includes a primary cooling condenser and a secondary cooling condenser. The primary cooling condenser is positioned above servers of a server rack and the secondary cooling condenser is position above the primary cooling condenser. Each of the severs, the primary cooling condenser, and the secondary cooling condenser is connected to a liquid manifold via one of a plurality of liquid ports on the liquid manifold, and to the vapor manifold via one of a plurality of vapor ports on the vapor manifold. A cooling capacity of the rack cooling system can be extended by switching on a vapor flow between the secondary cooling condenser and the primary cooling condenser using a first valve on the vapor manifold. Further, a second valve on a primary cooling loop can be used to control cooling fluid flowing into the secondary cooling condenser after the first valve is trigged open.Type: GrantFiled: May 10, 2021Date of Patent: May 16, 2023Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 11653476Abstract: The embodiments herein describe technologies of cryogenic digital systems with a first component located in a first non-cryogenic temperature domain, a second component located in a second temperature domain that is lower in temperature than the first cryogenic temperature domain, and a third component located in a cryogenic temperature domain that is lower in temperature than the second cryogenic temperature domain.Type: GrantFiled: August 27, 2021Date of Patent: May 16, 2023Assignee: Rambus Inc.Inventors: Frederick A. Ware, John Eric Linstadt, Thomas Vogelsang