Abstract: The invention, in another form thereof, comprises a method of laser shock peening the surface of a solid material with or without the use of a transparent overlay material. An energy absorbing coating is applied to a portion of the surface of a solid material. An ultraviolet-curable resin coating is applied to the energy absorbing coating and the curable resin is exposed to an ultraviolet light and forms a pellicle over the energy absorbing coating. A pulse of coherent energy is directed to the energy absorbing coating of the solid material to create a shock wave.

Abstract: A positioning device in which an operating member is solid with a mechanical touching member and is displaced together with it by computer controlled displacement devices; both the operating and the touching members are mounted on a common supporting member, thus forming a touching and operating unit on which act the computer controlled displacement devices. The computer is programmed in order to determine by means of the touching member, and to memorize, the positions of a plurality of points on which the operating member should perform its operation, then determining by interpolation the entire work trajectory of the operating member, which may particularly be a welding head; in this case, several touching and operating units form part of a welding apparatus, and particularly of a so-called coupler, intended to automatically perform the inner weldings between the sections of a piping, such as an oil pipeline or the like.

Abstract: In a wire-bonding process, a chip is provided with at least a first contact pad. A chip carrier is further provided with at least a second contact pad. A plurality of stacked conductive bumps are formed on the first contact pad. A conductive wire is formed by a reverse bonding process. The conductive wire electrically connects the second contact pad of the chip carrier to the stacked conductive bumps over the first contact pad of the chip.

Abstract: Electrode for use in a non-aqueous battery, which electrode comprises at least a microporous sheet, consisting of inorganic, optionally electroconductive particles, a polymer having a high molecular weight, and a hydrocarbon-containing compound. The electrode can be used as a cathode, an anode and a separator in a battery built up of one or more layers of a current collector, an anode, a separator, a cathode, a current collector and an electrolyte, in particular a rechargeable Li-ion battery.

Abstract: In one aspect the invention provided a friction welded component comprising at least two structural support members spaced apart and connected by a plurality of first and second studs. Each of the first studs are friction welded at one end to a first of the support members and at the opposite end thereof to one end of a respective second stud. Each of the second studs are friction welded to a respective first stud and a second of the support members along a continuous annular friction welded joint having a frusto-conical configuration.

Abstract: A laser welding apparatus includes a laser welding head and a laser welding head position-controlling apparatus. The laser welding head includes a laser irradiating body with an inert gas nozzle to blow off an inert gas for welding parts of members to be welded and at least one shielding gas nozzle, at the outside of the inert gas nozzle, to blow off a shielding gas for the surrounding area of the welding parts, and plural semiconductor lasers to oscillate plural linear laser beams for measuring the welding state of the members to be welded. The laser welding head position-controlling apparatus includes an imaging apparatus with a band-pass filter therein to pass through only the reflected linear laser beams to take in, as an image, the measured welding state by the reflected linear laser beams, and an image processor to process the image of the measured welding state.

Abstract: A pin attachment method for mounting the pins on a wiring substrate for fabricating a pin grid array package is disclosed. There is provided an organic wiring board including a surface bearing electrical circuitry which includes at least one contact pad for receiving a pin. A solder mask layer which is placed on the board surface and patterned to expose the pad. The solder mask layer which does not cover any portion of the pad and forms a well by the perimeter of the solder mask layer around the pad. Subsequently, a pin and a solder material which are placed over said pad in the well. The pin which is soldered to the pad by a temperature sufficient to melt the solder material.

Abstract: In a bonding tool which bonds a component to a substrate by urging and vibration, a through hole is formed in the horn. An adhesion section is fit into a lower section of the hole and an engaging section is fit into an upper section of the hole, so that a sealed inner space is formed inside the hole by tightening an outer screw. An adhesion hole open to a bonding section communicates with a sucking hole of the horn via the inner space, so that a simply structured vacuum-adhesion-system can be formed. This mechanics does not loose replaceablility of the adhesion section detachable to the horn. As a result, the adhesion section can be replaceable as an independent part (urging terminal), and a bonding apparatus as well as a bonding tool having the simply structured vacuum-adhesion-system can be provided.

Abstract: The clamping band manufacturing machine is capable of full-automatically manufacturing the clamping bands and highly increasing the manufacturing efficiency. The machine comprises a main machine part and parts feeding mechanisms. In the main machine part, a band shaping stage welds a clasp on a band section, bends the band section in an arc, and overlaps both end portions of the band section. A lever welding stage welds a lever and the overlapped portion of the band section. An examination stage measures a length of an overlapped portion of the band section and the lever material. An arc shaping stage bends the lever in an arc. A circular shaping stage expands the bent portion of the band section. A conveying mechanism synchronously conveying the band section to each of the sages, which are serially arranged. The feeding mechanisms feed the parts, e.g., the clasp, to the main machine part.

Abstract: An apparatus and method for manufacturing solder balls used for an electrical and/or mechanical connection between a semiconductor chip and a substrate are provided. The apparatus includes a melting furnace having a nozzle through which a molten solder paste flows and drops, for producing solder balls; a vibrating mechanism attached to the nozzle of the melting furnace, for applying vibration to the nozzle; and a vibration controlling mechanism for controlling the vibration frequency of the vibrating mechanism to adjust the size of the solder balls dropped from the nozzle. The method includes the steps of setting a vibration frequency according to a desired solder ball size, applying vibration to a nozzle with the set vibration frequency, making the molten solder paste flow through the nozzle to manufacture solder balls of a predetermined size according to the vibration frequency, and measuring the size of the manufactured solder balls.

Abstract: A one-step bumping/bonding process for forming a semiconductor package is disclosed. In the method, a first electronic substrate which has either a plurality of conductive pads or a plurality of recessed openings formed on top of a plurality of apertures through the substrate is first provided and aligned with a second electronic substrate that has a plurality of conductive pads with each aperture aligned to a conductive pad on the second substrate. A plurality of solder balls is then planted on top of the plurality of conductive pads or the plurality of recessed openings on the surface of the first electronic substrate by a pick-and-place technique. Alternatively, a plurality of solder paste may be printed by a thick film stencil printing process similarly in place of the plurality of solder balls.

Abstract: An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. A ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.

Abstract: A strap for a wrist-wearable electronic device facilitates battery charging and the supply of electrical power to external devices. A housing for a battery is removably mounted to the center of a resin strap, and one or more batteries are lined up next to each other within the housing. The batteries and housing are curved to conform to the curvature of a user's wrist. A charging terminal for charging the batteries is provided and one or more output terminals for supplying electrical power to external devices are provided at four corners of the housing. The output voltages and diameters of the terminals are different and each terminal is provided with detachable resin covers. An overcharging prevention circuit is disposed between the charging terminal and an output terminal.

Abstract: An exfoliation corrosion detection method which enables rapid detection and evaluation of hidden exfoliation corrosion on aircraft with related cost savings. Pressure exerted on the surface by the laser created plasma generates a pressure pulse or shock wave that propagates into the part. When the stress in the shock wave is above the dynamic elastic limit of the material, the surface material yields plastically. This plastic strain creates compressive residual stresses in the surface, thereby enabling detection of exfoliation corrosion, if present.

Abstract: A method and apparatus of making an electrical bobbin including applying to the wire/terminal assembly fusing pressure and heat. Sensing the temperature of an electrode zone near one of its fusing surfaces, and controlling the application and cessation of fusing power in response to the zone temperature values. Power application can cycle on and off for a set time period, number of set cycles, or stopped in response to another event such as sensed electrode displacement reaching a set value. Various other control parameters are or can be employed. The electrodes are preferably high resistant material and no significant current flows between upper and lower electrodes.

Abstract: A method of making bondable contacts on a microelectronic element includes providing a microelectronic element having one or more die pads on a first face thereof and depositing conductive bonding material, such as gold, atop each die pad. The conductive bonding material is then shaped using a contact forming tool to form bondable contacts. The bondable contact has a substantially flat region and a second region projecting above the substantially flat region. The second region includes an apex adapted to abut against an opposing electrically conductive element. The bondable contacts may be formed one at a time or a plurality of the bondable contacts may be formed simultaneously. In one preferred embodiment, the projecting region of the contact defines a wedge-shaped projection that is bounded by the substantially flat region thereof. Each wedge-shaped projection may include an apex and side-walls extending between the apex and the substantially flat region of the contact.

Abstract: A controlled attenuation bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section having a substantially uniform first diameter; a second cylindrical section having a first end coupled to an end of the first cylindrical section, the second cylindrical section having a substantially uniform second diameter less than the first diameter; and a third section having a predetermined taper, a first end of the third section coupled to an end of the second cylindrical section.

Abstract: A protective circuit having an electronic circuit constructed on a circuit board is built into a sealing member that seals the open end of a battery case accommodating electricity generating elements. The circuit board is attached to the outer end of the sealing member. A positive terminal plate that becomes the positive terminal of the secondary battery and an S pole terminal plate that controls the operation of the electronic circuit by an external connection are provided on the outer surface of the circuit board. Thereby, a protective circuit that prevents over-discharging and overcharging is arranged inside the sealing member. A secondary battery is thereby constructed with a protective circuit without resorting to a construction of a battery pack.

Abstract: An apparatus for ultrasonically welding workpieces that reduces sonotrode adhesion during the ultrasonic welding process. The sonotrode tip has a specific surface configuration, including a curvilinear shaped outer surface combined with a plurality of grooves and lands. Due to the curvilinear surface, the depth of the grooves gradually decreases near the outer edge or periphery of a contact surface of the sonotrode tip. Further, such a groove and land combination also provides a sharp edge or corner that reduces sliding of the tip on the workpiece and correspondingly reduces sticking. In addition, various types of coatings or inserts may also be used to reduce sticking of the sonotrode tip to the workpiece.

Abstract: Concentric, tubular sections are assembled by first securing annular centralizers and insulation about the external surface of the smaller diameter tube while the tube is horizontally disposed. The larger tube is then vertically aligned and lowered into a recessed area formed below the assembly area work level. A lifting cable, secured at one end to a lifting device, is extended through the smaller diameter tube and attached to a hoisting arrangement that vertically orients the tube concentrically over the larger diameter tube. Spring-loaded legs on the lifting device are manually retracted radially to permit the smaller tube to be lowered concentrically through the larger tube. The inner tube is lowered until the legs spring radially outwardly to engage the base of the larger tube. The entire assembly may then be lifted as a unit by the hoist with the lifting device, establishing the axial positions of the two tubes relative to each other.