Abstract: The disclosure provides a local stretch packaging structure, including a substrate, a flexible electronic element, a plurality of light-emitting display elements, and a packaging layer. The flexible electronic element is disposed on the substrate. These light-emitting display elements are disposed on the flexible electronic element. The packaging layer includes a packaging area and a non-packaging area. The packaging area covers the upper surface and sidewalls of these light-emitting display elements. The non-packaging area is directly covered the flexible electronic element that is not disposed with these light-emitting display elements.

Abstract: An electronic package is provided, in which a mesh structure is disposed between a circuit structure and an electronic element to increase the shunt path of current. Therefore, when the electronic element is used as an electrode pad of a power contact, the current can be passed through a conductive sheet of the circuit structure via the mesh structure, such that the power loss can be reduced and the IR drop of the electronic element can meet the requirements.

Abstract: An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

Abstract: An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.

Abstract: An electronic device including a panel is provided. The panel includes a first substrate, a second substrate opposite to the first substrate, a medium layer disposed between the first substrate and the second substrate, a sealant disposed between the first substrate and the second substrate and surrounding the medium layer, a plurality of first electrodes disposed between the first substrate and the medium layer, and a plurality of connecting lines disposed between the second substrate and the first electrodes. The sealant includes a plurality of conductive particles. The first electrodes are electrically connected to the connection lines through the conductive particles. There is a first space S1 between two adjacent connecting lines of the connecting lines. One of the conductive particles has a width of W. The first space S1 and the width W conform to the following formula: 3<S1/W<20.

Abstract: An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shielding structure includes a concave portion formed on the plate body and a dielectric material formed between the concave portion and the antenna structure to generate different impedance characteristics, thereby improving the antenna isolation.

Abstract: An electronic package is provided and includes a first carrier structure having a plurality of antenna feed lines, and an antenna module disposed on the first carrier structure. The antenna module includes a substrate body having a plurality of recesses with different depths. Further, antenna layers are formed in the plurality of recesses and electromagnetically coupled to the antenna feed lines so as to improve the overall radiation efficiency of the antenna assembly.

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

Abstract: A method for Bluetooth inquiry/paging and a communication device therefor are provided. The method includes transmitting a plurality of inquiry/paging messages in a transmission time slot to inquire/page a peer device, wherein, the number of inquiry/paging messages is greater than two; and activating a plurality reception windows in a reception time slot to receive response messages from the peer device. The invention also provides a corresponding communication device. The invention reduces the time required for inquiry/paging to the peer device, thereby reducing the time it takes to establish a Bluetooth connection between the two devices.

Abstract: A solar cell module is provided. The solar cell module includes a first substrate, a second substrate opposite the first substrate, a cell unit disposed between the first and second substrates, a first thermosetting resin layer disposed between the cell unit and the first substrate, a first thermoplastic resin layer disposed between the cell unit and the first thermosetting resin layer, a second thermosetting resin layer disposed between the cell unit and the second substrate, and a second thermoplastic resin layer disposed between the cell unit and the second thermosetting resin layer.

Abstract: An electronic package is provided and includes a first carrier structure having a plurality of antenna feed lines, and an antenna module disposed on the first carrier structure. The antenna module includes a substrate body having a plurality of recesses with different depths. Further, antenna layers are formed in the plurality of recesses and electromagnetically coupled to the antenna feed lines so as to improve the overall radiation efficiency of the antenna assembly.

Abstract: An electronic package is provided, including at least an electronic element and at least an antenna structure disposed on a carrier structure. The antenna structure includes a base portion configured with an antenna body and a plurality of support portions disposed on the base portion. As such, the base portion is disposed over the carrier structure through the support portions and a plurality of open areas are formed between the base portion and the carrier structure to serve as an air gap, thereby effectively improving the performance gain and efficiency of the antenna body.

Abstract: A method for Bluetooth inquiry/paging and a communication device therefor are provided. The method includes transmitting a plurality of inquiry/paging messages in a transmission time slot to inquire/page a peer device, wherein, the number of inquiry/paging messages is greater than two; and activating a plurality reception windows in a reception time slot to receive response messages from the peer device. The invention also provides a corresponding communication device. The invention reduces the time required for inquiry/paging to the peer device, thereby reducing the time it takes to establish a Bluetooth connection between the two devices.

Abstract: A portable chopstick including two-piece square chopsticks is provided. The two-piece square chopsticks include an upper chopstick body, a lower chopstick body and a chopstick body aligning structure. The upper chopstick body has a lower end joint block; the lower chopstick body has an opposite upper end joint groove. The chopstick body aligning structure can be separated into two parts, which are precisely positioned in the upper chopstick body and the lower chopstick bod respectively, wherein the upper chopstick body and the lower chopstick body can be made of different materials. When the lower end joint block of the upper chopstick body is locked with the upper end joint groove of the lower chopstick body, the upper chopstick body is aligned with the lower chopstick body through the chopstick body aligning structure at their four sides.

Abstract: An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

Abstract: An electronic package is provided, in which a ground layer is arranged on one side of an insulator, and a first antenna portion and a second antenna portion embedded in the insulator are vertically disposed on the ground layer, where a gap is formed between the first antenna portion and the second antenna portion, such that the first antenna portion and the second antenna portion are electrically matched with each other, and the ground layer is electrically connected to the second antenna portion but free from being electrically connected to the first antenna portion.