Patents by Inventor A.K.M. Kamruzzaman Mollah

A.K.M. Kamruzzaman Mollah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Architecture of spare wiring structures for improved engineering change orders
    Patent number: 9236343
    Abstract: An integrated circuit includes a substrate having a plurality of electronic devices, a plurality of interconnect layers disposed on one or both sides of the substrate, and a plurality of active electrically conductive interconnect layer structures. The plurality of interconnect layers include horizontal interconnect and vertical-interconnect-access (VIA) layers. The plurality of active electrically conductive interconnect layer structures are disposed on at least one of the plurality of interconnect layers and electrically coupled with at least one of the plurality of electronic devices. The integrated circuit also includes a plurality of spare electrically conductive interconnect layer structures disposed on at least one of the plurality of interconnect layers and electrically isolated from the plurality of active electrically conductive interconnect layer structures.
    Type: Grant
    Filed: May 5, 2014
    Date of Patent: January 12, 2016
    Assignee: BLACKCOMB DESIGN AUTOMATION INC.
    Inventors: James Cicalo, Peter Hallschmid, A. K. M. Kamruzzaman Mollah
  • Architecture of Spare Wiring Structures for Improved Engineering Change Orders
    Publication number: 20140332979
    Abstract: An integrated circuit includes a substrate having a plurality of electronic devices, a plurality of interconnect layers disposed on one or both sides of the substrate, and a plurality of active electrically conductive interconnect layer structures. The plurality of interconnect layers include horizontal interconnect and vertical-interconnect-access (VIA) layers. The plurality of active electrically conductive interconnect layer structures are disposed on at least one of the plurality of interconnect layers and electrically coupled with at least one of the plurality of electronic devices. The integrated circuit also includes a plurality of spare electrically conductive interconnect layer structures disposed on at least one of the plurality of interconnect layers and electrically isolated from the plurality of active electrically conductive interconnect layer structures.
    Type: Application
    Filed: May 5, 2014
    Publication date: November 13, 2014
    Applicant: BLACKCOMB DESIGN AUTOMATION INC.
    Inventors: James Cicalo, Peter Hallschmid, A.K.M. Kamruzzaman Mollah