Abstract: An apparatus for and methods of repairing and manufacturing integrated circuits using the apparatus. The apparatus, comprising: a vacuum chamber containing: a movable stage configured to hold a substrate; an inspection and analysis probe; a heat source; a gas injector; and a gas manifold connecting multiple gas sources to the gas injector.

Abstract: A bimanual arm trainer that provides therapeutic bimanual repetitive exercise to improve upper body movement and flexibility has a top support that is elevated relative to a ground surface. The trainer further includes: (a) first and second arm holders that are pivotable relative to the top support; and (b) first and second arm holder housings that are pivotably coupled to the top support and can be moved into a plurality of different positions and locked in place in one of the plurality of different positions relative to the top support. The first arm holder is pivotably coupled to the first arm holder and the second arm holder is pivotably coupled to the second arm holder. A reciprocating translation mechanism operatively connects the first and second arm holders such that the motion of one of the first and second arm holders is mirrored in the other of the first and second arm holders.

Abstract: A medical imaging device mountable on a support structure having a horizontal surface and at least one substantially vertical surface. The imaging device includes a frame and a gantry having a radiation source and a radiation detector. The gantry is rotatable with respect to the frame. The imaging device includes a first vertical adjustment element and a second vertical adjustment element. The first vertical adjustment element has a first end couplable to the horizontal surface and a second end coupled to the frame, the first end is located a first distance from the second end, and adjustable over a first range. The second vertical adjustment element has a third end coupled to the frame and a fourth end coupled to the gantry. The third end is located a second distance from the fourth end, and is adjustable over a second range, and the fourth end is rotatable with respect to the third end.

Abstract: An apparatus and method comprising an access tube which is insertable into a duct via a flange once an insulator of the ISO Bus system is removed. The access tube is configured so one end connects to the surface of the conductor and the second end remains open to the outside of the duct. The method comprises removing at least one insulator from the ISO Bus system and inserting the access tube through a flange and accessing the damaged conductor with one or more repair tools via an open end of the access tool. Any debris generated during the repair is contained in the access tube and can be easily vacuumed before removing the access tube.

Abstract: A replacement lamp assembly for replacing a vehicle lamp that has been broken out leaving at least one cylindrical lamp flange is provided. The replacement lamp assembly includes a vehicle lamp having a housing with a base, a lens and an interior portion with at least one light source positioned therein and an attachment member. The attachment member includes an upper lamp retaining section having a first cylindrical wall with an inner surface and an outer surface, a second cylindrical wall with an inner surface and an outer surface spaced apart from the first cylindrical wall and connected thereto by an upper edge, wherein a lower end of second cylindrical wall abuts the at least one flange. A mounting section is formed integral with the lamp retaining section and includes a third cylindrical wall with an inner surface and an outer surface.

Abstract: An apparatus for and methods of repairing and manufacturing integrated circuits using the apparatus. The apparatus, comprising: a vacuum chamber containing: a movable stage configured to hold a substrate; an inspection and analysis probe; a heat source; a gas injector; and a gas manifold connecting multiple gas sources to the gas injector.

Abstract: An apparatus for and methods of repairing and manufacturing integrated circuits using the apparatus. The apparatus, comprising: a vacuum chamber containing: a movable stage configured to hold a substrate; an inspection and analysis probe; a heat source; a gas injector; and a gas manifold connecting multiple gas sources to the gas injector.

Abstract: The present disclosure provides for an apparatus and method for repairing a damaged conductor of an ISO Bus system. The apparatus comprises an access tube which is insertable into a duct via a flange once an insulator of the ISO Bus system is removed. The access tube is configured so one end connects to the surface of the conductor and the second end remains open to the outside of the duct. The method comprises removing at least one insulator from the ISO Bus system and inserting the access tube through a flange and accessing the damaged conductor with one or more repair tools via an open end of the access tool. Any debris generated during the repair is contained in the access tube and can be easily vacuumed before removing the access tube providing a safe and efficient means for repairing conductors as compared to the prior art.

Abstract: Aspects of the present invention relate to a controlled metal extrusion opening in a semiconductor structure. Various embodiments include a semiconductor structure. The structure includes an aluminum layer. The aluminum layer includes an aluminum island within the aluminum layer, and a lateral extrusion receiving opening extending through the aluminum layer adjacent the aluminum island. The opening includes a lateral extrusion of the aluminum layer of the semiconductor structure. Additional embodiments include a method of forming a semiconductor structure. The method can include forming an aluminum layer over a titanium layer. The aluminum layer includes an aluminum island within the aluminum layer. The method can also include forming an opening extending through the aluminum layer adjacent the aluminum island within the aluminum layer. The opening includes a lateral extrusion of the aluminum layer of the semiconductor layer.

Abstract: A bimanual arm trainer that provides therapeutic bimanual repetitive exercise to improve upper body movement and flexibility has a top support that is elevated relative to a ground surface. The trainer further includes: (a) first and second arm holders that are pivotable relative to the top support; and (b) first and second arm holder housings that are pivotably coupled to the top support and can be moved into a plurality of different positions and locked in place in one of the plurality of different positions relative to the top support. The first arm holder is pivotably coupled to the first arm holder and the second arm holder is pivotably coupled to the second arm holder. A reciprocating translation mechanism operatively connects the first and second arm holders such that the motion of one of the first and second arm holders is mirrored in the other of the first and second arm holders.

Abstract: A medical imaging device mountable on a support structure having a horizontal surface and at least one substantially vertical surface. The imaging device includes a frame and a gantry having a radiation source and a radiation detector. The gantry is rotatable with respect to the frame. The imaging device includes a first vertical adjustment element and a second vertical adjustment element. The first vertical adjustment element has a first end couplable to the horizontal surface and a second end coupled to the frame, the first end is located a first distance from the second end, and adjustable over a first range. The second vertical adjustment element has a third end coupled to the frame and a fourth end coupled to the gantry. The third end is located a second distance from the fourth end, and is adjustable over a second range, and the fourth end is rotatable with respect to the third end.

Abstract: A medical imaging device mountable on a support structure having a horizontal surface and at least one substantially vertical surface. The imaging device includes a frame and a gantry having a radiation source and a radiation detector. The gantry is rotatable with respect to the frame. The imaging device includes a first vertical adjustment element and a second vertical adjustment element. The first vertical adjustment element has a first end couplable to the horizontal surface and a second end coupled to the frame, the first end is located a first distance from the second end, and adjustable over a first range. The second vertical adjustment element has a third end coupled to the frame and a fourth end coupled to the gantry. The third end is located a second distance from the fourth end, and is adjustable over a second range, and the fourth end is rotatable with respect to the third end.

Abstract: Aspects of the present invention relate to a controlled metal extrusion opening in a semiconductor structure. Various embodiments include a semiconductor structure. The structure includes an aluminum layer. The aluminum layer includes an aluminum island within the aluminum layer, and a lateral extrusion receiving opening extending through the aluminum layer adjacent the aluminum island. The opening includes a lateral extrusion of the aluminum layer of the semiconductor structure. Additional embodiments include a method of forming a semiconductor structure. The method can include forming an aluminum layer over a titanium layer. The aluminum layer includes an aluminum island within the aluminum layer. The method can also include forming an opening extending through the aluminum layer adjacent the aluminum island within the aluminum layer. The opening includes a lateral extrusion of the aluminum layer of the semiconductor layer.

Abstract: An apparatus for and methods of repairing and manufacturing integrated circuits using the apparatus. The apparatus, comprising: a vacuum chamber containing: a movable stage configured to hold a substrate; an inspection and analysis probe; a heat source; a gas injector; and a gas manifold connecting multiple gas sources to the gas injector.

Abstract: An alignment frame for use in weight bearing imaging of a knee or knees, the alignment frame includes a base with a support extending upward from a base. A thigh positioner is attached to the support. The thigh positioner includes a panel portion for contact by a user's thigh, and an imaging portion located below the panel portion. The imaging portion is made from material that does not interfere with imaging transmissions, such as x-rays and MRI transmissions (e.g., made from x-ray compatible and/or MRI compatible materials). At least one foot alignment device is on the base. The foot alignment device includes at least one foot positioner with an inner wall and a toe wall, the inner wall extending medially away from the toe wall.

Abstract: Disclosed are semiconductor structures with metal lines and methods of manufacture which reduce or eliminate extrusion formation. The method includes forming a metal wiring comprising a layered structure of metal materials with an upper constraining layer. The method further includes forming a film on the metal wiring which prevents metal extrusion during an annealing process.

Abstract: Aspects of the present invention relate to a controlled metal extrusion opening in a semiconductor structure. Various embodiments include a semiconductor structure. The structure includes an aluminum layer. The aluminum layer includes an aluminum island within the aluminum layer, and a lateral extrusion receiving opening extending through the aluminum layer adjacent the aluminum island. The opening includes a lateral extrusion of the aluminum layer of the semiconductor structure. Additional embodiments include a method of forming a semiconductor structure. The method can include forming an aluminum layer over a titanium layer. The aluminum layer includes an aluminum island within the aluminum layer. The method can also include forming an opening extending through the aluminum layer adjacent the aluminum island within the aluminum layer. The opening includes a lateral extrusion of the aluminum layer of the semiconductor layer.

Abstract: Disclosed are semiconductor structures with metal lines and methods of manufacture which reduce or eliminate extrusion formation. The method includes forming a metal wiring comprising a layered structure of metal materials with an upper constraining layer. The method further includes forming a film on the metal wiring which prevents metal extrusion during an annealing process.

Abstract: A medical imaging device mountable on a support structure having a horizontal surface and at least one substantially vertical surface. The imaging device includes a frame and a gantry having a radiation source and a radiation detector. The gantry is rotatable with respect to the frame. The imaging device includes a first vertical adjustment element and a second vertical adjustment element. The first vertical adjustment element has a first end couplable to the horizontal surface and a second end coupled to the frame, the first end is located a first distance from the second end, and adjustable over a first range. The second vertical adjustment element has a third end coupled to the frame and a fourth end coupled to the gantry. The third end is located a second distance from the fourth end, and is adjustable over a second range, and the fourth end is rotatable with respect to the third end.

Abstract: Aspects of the present invention relate to a controlled metal extrusion opening in a semiconductor structure. Various embodiments include a semiconductor structure. The structure includes an aluminum layer. The aluminum layer includes an aluminum island within the aluminum layer, and a lateral extrusion receiving opening extending through the aluminum layer adjacent the aluminum island. The opening includes a lateral extrusion of the aluminum layer of the semiconductor structure. Additional embodiments include a method of forming a semiconductor structure. The method can include forming an aluminum layer over a titanium layer. The aluminum layer includes an aluminum island within the aluminum layer. The method can also include forming an opening extending through the aluminum layer adjacent the aluminum island within the aluminum layer. The opening includes a lateral extrusion of the aluminum layer of the semiconductor layer.