Abstract: A power module assembly (400) with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate (410) with passageways or openings (414) for coolant that extend through the plate from a lower surface (411) to an upper surface (412). A circuit substrate (420) is provided and positioned on the spreader plate (410) to cover the coolant passageways. The circuit substrate (420) includes a bonding layer (422) configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer (422) may be solder material which bonds to the upper surface (412) of the plate to provide a continuous seal around the upper edge of each opening (414) in the plate. The assembly includes power modules (430) mounted on the circuit substrate (420) on a surface opposite the bonding layer (422). The power modules (430) are positioned over or proximal to the coolant passageways.

Abstract: A power module assembly (400) with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate (410) with passageways or openings (414) for coolant that extend through the plate from a lower surface (411) to an upper surface (412). A circuit substrate (420) is provided and positioned on the spreader plate (410) to cover the coolant passageways. The circuit substrate (420) includes a bonding layer (422) configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer (422) may be solder material which bonds to the upper surface (412) of the plate to provide a continuous seal around the upper edge of each opening (414) in the plate. The assembly includes power modules (430) mounted on the circuit substrate (420) on a surface opposite the bonding layer (422). The power modules (430) are positioned over or proximal to the coolant passageways.

Abstract: A stratified vapor generator (110) comprises a first heating section (H1) and a second heating section (H2). The first and second heating sections (H1, H2) are arranged so that the inlet of the second heating section (H2) is operatively associated with the outlet of the first heating section (H1). A moisture separator (126) having a vapor outlet (164) and a liquid outlet (144) is operatively associated with the outlet (124) of the second heating section (H2). A cooling section (C1) is operatively associated with the liquid outlet (144) of the moisture separator (126) and includes an outlet that is operatively associated with the inlet of the second heating section (H2).

Abstract: A power module assembly with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate with passageways or openings for coolant that extend through the plate from a lower surface to an upper surface. A circuit substrate is provided and positioned on the spreader plate to cover the coolant passageways. The circuit substrate includes a bonding layer configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer may be solder material which bonds to the upper surface of the plate to provide a continuous seal around the upper edge of each opening in the plate. The assembly includes power modules mounted on the circuit substrate on a surface opposite the bonding layer. The power modules are positioned over or proximal to the coolant passageways.

Abstract: A power generating system (110) comprising a heat source (116) and an incremental vapor generator system (112) operatively associated with the heat source (116). The incremental vapor generator system (112) includes a first heating section (136) and a second heating section (138). The first heating section (136) receives a mixed working fluid (114) and generates a first heated working fluid stream comprising a vapor portion (120) and a liquid portion. The second heating section (138) is operatively associated with the first heating section (136) and receives the liquid portion from the first heated working fluid stream. The second heating section (138) generates a second heated working fluid stream comprising a vapor portion (122). An energy conversion device (126) operatively associated with the incremental vapor generator system (112) converts into useful work heat energy contained in the vapor portions (120, 122) of the first and second heated working fluid streams.

Abstract: A stratified vapor generator (110) comprises a first heating section (H1) and a second heating section (H2). The first and second heating sections (H1, H2) are arranged so that the inlet of the second heating section (H2) is operatively associated with the outlet of the first heating section (H1). A moisture separator (126) having a vapor outlet (164) and a liquid outlet (144) is operatively associated with the outlet (124) of the second heating section (H2). A cooling section (C1) is operatively associated with the liquid outlet (144) of the moisture separator (126) and includes an outlet that is operatively associated with the inlet of the second heating section (H2).

Abstract: A computational modeling method for predicting the chemical, physical, and thermodynamic performance of a condenser using calculations based on equations of physics for heat, momentum and mass transfer and equations of equilibrium thermodynamics to determine steady state profiles of parameters throughout the condenser. The method includes providing a set of input values relating to a condenser including liquid loading, vapor loading, and geometric characteristics of the contact medium in the condenser. The geometric and packing characteristics of the contact medium include the dimensions and orientation of a channel in the contact medium. The method further includes simulating performance of the condenser using the set of input values to determine a related set of output values such as outlet liquid temperature, outlet flow rates, pressures, and the concentration(s) of one or more dissolved noncondensable gas species in the outlet liquid.

Abstract: A direct contact condenser having a downward vapor flow chamber and an upward vapor flow chamber, wherein each of the vapor flow chambers includes a plurality of cooling liquid supplying pipes and a vapor-liquid contact medium disposed thereunder to facilitate contact and direct heat exchange between the vapor and cooling liquid. The contact medium includes a plurality of sheets arranged to form vertical interleaved channels or passageways for the vapor and cooling liquid streams. The upward vapor flow chamber also includes a second set of cooling liquid supplying pipes disposed beneath the vapor-liquid contact medium which operate intermittently in response to a pressure differential within the upward vapor flow chamber. The condenser further includes separate wells for collecting condensate and cooling liquid from each of the vapor flow chambers.

Abstract: The present invention is a system and method for simulating the performance of a cooling tower. More precisely, the simulator of the present invention predicts values related to the heat and mass transfer from a liquid (e.g., water) to a gas (e.g., air) when provided with input data related to a cooling tower design. In particular, the simulator accepts input data regarding: (a) cooling tower site environmental characteristics; (b) cooling tower operational characteristics; and (c) geometric characteristics of the packing used to increase the surface area within the cooling tower upon which the heat and mass transfer interactions occur. In providing such performance predictions, the simulator performs computations related to the physics of heat and mass transfer within the packing.