Patents by Inventor Aaron Partridge
Aaron Partridge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220360218Abstract: One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).Type: ApplicationFiled: May 25, 2022Publication date: November 10, 2022Inventors: Carl Arft, Aaron Partridge, Markus Lutz, Charles I. Grosjean
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Patent number: 11444600Abstract: A microelectromechanical system (MEMS) resonator includes a resonant semiconductor structure, drive electrode, sense electrode and electrically conductive shielding structure. The first drive electrode generates a time-varying electrostatic force that causes the resonant semiconductor structure to resonate mechanically, and the first sense electrode generates a timing signal in response to the mechanical resonance of the resonant semiconductor structure. The electrically conductive shielding structure is disposed between the first drive electrode and the first sense electrode to shield the first sense electrode from electric field lines emanating from the first drive electrode.Type: GrantFiled: March 11, 2021Date of Patent: September 13, 2022Assignee: SiTime CorporationInventors: David Raymond Pedersen, Aaron Partridge, Thor Juneau
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Patent number: 11374535Abstract: One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).Type: GrantFiled: November 29, 2019Date of Patent: June 28, 2022Assignee: SiTime CorporationInventors: Carl Arft, Aaron Partridge, Markus Lutz, Charles I. Grosjean
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Patent number: 11370656Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.Type: GrantFiled: January 6, 2021Date of Patent: June 28, 2022Assignee: SiTime CorporationInventors: Pavan Gupta, Aaron Partridge, Markus Lutz
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Patent number: 11323071Abstract: An oscillator includes a resonator, sustaining circuit and detector circuit. The sustaining circuit receives a sense signal indicative of mechanically resonant motion of the resonator generates an amplified output signal in response. The detector circuit asserts, at a predetermined phase of the amplified output signal, one or more control signals that enable an offset-reducing operation with respect to the sustaining amplifier circuit.Type: GrantFiled: March 12, 2021Date of Patent: May 3, 2022Assignee: SiTime CorporationInventors: Aaron Partridge, Sassan Tabatabaei, Lijun Chen, Kamran Souri
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Patent number: 11312622Abstract: A semiconductor device includes first and second exposed electrical contacts and a cavity having a microelectromechanical system (MEMS) structure therein. A conductive path extends from the first exposed electrical contact to the cavity and an over-voltage protection element electrically is coupled between the first and second exposed electrical contacts.Type: GrantFiled: June 29, 2020Date of Patent: April 26, 2022Assignee: SiTime CorporationInventors: Nicholas Miller, Ginel C. Hill, Charles I. Grosjean, Michael Julian Daneman, Paul M. Hagelin, Aaron Partridge
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Patent number: 11218984Abstract: In various time-transfer systems, one or more fixed-position time beacons broadcast radio-frequency (RF) time-transfer messages to time-keeping modules disposed in remote radio heads and other strategic locations to achieve highly reliable and accurate synchronized time, phase, and frequency transfer over a metropolitan or other wide-field area.Type: GrantFiled: October 17, 2019Date of Patent: January 4, 2022Assignee: SiTime CorporationInventors: Markus Lutz, Sassan Tabatabaei, Charles I. Grosjean, Paul M. Hagelin, Aaron Partridge
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Patent number: 11146228Abstract: A continuous or distributed resonator geometry is defined such that the fabrication process used to form a spring mechanism also forms an effective mass of the resonator structure. Proportional design of the spring mechanism and/or mass element geometries in relation to the fabrication process allows for compensation of process-tolerance-induced fabrication variances. As a result, a resonator having increased frequency accuracy is achieved.Type: GrantFiled: April 30, 2018Date of Patent: October 12, 2021Assignee: Robert Bosch GmbHInventors: Markus Lutz, Aaron Partridge
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Publication number: 20210221678Abstract: A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.Type: ApplicationFiled: August 3, 2020Publication date: July 22, 2021Inventors: Aaron Partridge, Markus Lutz, Pavan Gupta
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Publication number: 20210179421Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.Type: ApplicationFiled: January 6, 2021Publication date: June 17, 2021Inventors: Pavan Gupta, Aaron Partridge, Markus Lutz
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Patent number: 11012049Abstract: A microelectromechanical system (MEMS) resonator includes a resonant semiconductor structure, drive electrode, sense electrode and electrically conductive shielding structure. The first drive electrode generates a time-varying electrostatic force that causes the resonant semiconductor structure to resonate mechanically, and the first sense electrode generates a timing signal in response to the mechanical resonance of the resonant semiconductor structure. The electrically conductive shielding structure is disposed between the first drive electrode and the first sense electrode to shield the first sense electrode from electric field lines emanating from the first drive electrode.Type: GrantFiled: September 11, 2019Date of Patent: May 18, 2021Assignee: SiTime CorporationInventors: David Raymond Pedersen, Aaron Partridge, Thor Juneau
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Patent number: 11005422Abstract: An oscillator includes a resonator, sustaining circuit and detector circuit. The sustaining circuit receives a sense signal indicative of mechanically resonant motion of the resonator generates an amplified output signal in response. The detector circuit asserts, at a predetermined phase of the amplified output signal, one or more control signals that enable an offset-reducing operation with respect to the sustaining amplifier circuit.Type: GrantFiled: March 3, 2020Date of Patent: May 11, 2021Assignee: SiTime CorporationInventors: Aaron Partridge, Sassan Tabatabaei, Lijun Chen, Kamran Souri
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Patent number: 10913655Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.Type: GrantFiled: June 16, 2020Date of Patent: February 9, 2021Assignee: SiTime CorporationInventors: Pavan Gupta, Aaron Partridge, Markus Lutz
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Publication number: 20200385261Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.Type: ApplicationFiled: June 16, 2020Publication date: December 10, 2020Inventors: Pavan Gupta, Aaron Partridge, Markus Lutz
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Patent number: 10800650Abstract: A MEMS element within a semiconductor device is enclosed within a cavity bounded at least in part by hydrogen-permeable material. A hydrogen barrier is formed within the semiconductor device to block propagation of hydrogen into the cavity via the hydrogen-permeable material.Type: GrantFiled: February 2, 2018Date of Patent: October 13, 2020Assignee: SiTime CorporationInventors: Charles I. Grosjean, Paul M. Hagelin, Michael Julian Daneman, Ginel C. Hill, Aaron Partridge
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Patent number: 10766768Abstract: A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.Type: GrantFiled: September 10, 2019Date of Patent: September 8, 2020Assignee: SiTime CorporationInventors: Aaron Partridge, Markus Lutz, Pavan Gupta
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Patent number: 10737934Abstract: A semiconductor device includes first and second exposed electrical contacts and a cavity having a microelectromechanical system (MEMS) structure therein. A conductive path extends from the first exposed electrical contact to the cavity and an over-voltage protection element electrically is coupled between the first and second exposed electrical contacts.Type: GrantFiled: March 2, 2018Date of Patent: August 11, 2020Assignee: SiTime CorporationInventors: Nicholas Miller, Ginel C. Hill, Charles I. Grosjean, Michael Julian Daneman, Paul M. Hagelin, Aaron Partridge
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Patent number: 10723617Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.Type: GrantFiled: April 2, 2019Date of Patent: July 28, 2020Assignee: SiTime CorporationInventors: Pavan Gupta, Aaron Partridge, Markus Lutz
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Publication number: 20200186084Abstract: One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).Type: ApplicationFiled: November 29, 2019Publication date: June 11, 2020Inventors: Carl Arft, Aaron Partridge, Markus Lutz, Charles I. Grosjean
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Patent number: 10622945Abstract: An oscillator includes a resonator, sustaining circuit and detector circuit. The sustaining circuit receives a sense signal indicative of mechanically resonant motion of the resonator generates an amplified output signal in response. The detector circuit asserts, at a predetermined phase of the amplified output signal, one or more control signals that enable an offset-reducing operation with respect to the sustaining amplifier circuit.Type: GrantFiled: July 26, 2018Date of Patent: April 14, 2020Assignee: SiTime CorporationInventors: Aaron Partridge, Sassan Tabatabaei, Lijun Chen, Kamran Souri