Patents by Inventor Aaron R. Castro

Aaron R. Castro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate for an integrated circuit package
    Patent number: 6501168
    Abstract: An enhanced ball grid array substrate package and method for manufacturing the same, where the substrate package includes a metal core having a first surface and a second surface opposite the first surface. The metal core further includes at least one cavity in which at least one integrated circuit is positioned. A dielectric layer is secured to the first surface of the metal core and includes at least one die cavity formed therein. Thereafter, a conductive seed layer is chemically deposited to exposed portions of the dielectric layer and the first surface of the metal core. Adjacent to the conductive seed layer, a circuit is electrolytically and selectively formed within a first circuit pattern.
    Type: Grant
    Filed: September 1, 1999
    Date of Patent: December 31, 2002
    Assignee: Substrate Technologies, Incorporated
    Inventors: Abram M. Castro, Aaron R. Castro
  • Method for making a substrate for an integrated circuit package
    Patent number: 6248612
    Abstract: An enhanced ball grid array substrate package and method for manufacturing the same, where the substrate package includes a metal core having a first surface and a second surface opposite the first surface. The metal core further includes at least one cavity in which at least one integrated circuit is positioned. A dielectric layer is secured to the first surface of the metal core and includes at least one die cavity formed therein. Thereafter, a conductive seed layer is chemically deposited to exposed portions of the dielectric layer and the first surface of the metal core. Adjacent to the conductive seed layer, a circuit is electrolytically and selectively formed within a first circuit pattern.
    Type: Grant
    Filed: August 18, 1999
    Date of Patent: June 19, 2001
    Assignee: Substrate Technologies, Inc.
    Inventors: Abram M. Castro, Aaron R. Castro
  • Sequentially built integrated circuit package
    Patent number: 6107683
    Abstract: An enhanced ball grid array substrate package and method for manufacturing the same, where the substrate package includes a metal core having a first surface and a second surface opposite the first surface. The metal core further includes at least one cavity in which at least one integrated circuit is positioned. A dielectric layer is secured to the first surface of the metal core and includes at least one die cavity formed therein. Thereafter, a conductive seed layer is chemically deposited to exposed portions of the dielectric layer and the first surface of the metal core. Adjacent to the conductive seed layer, a circuit is electrolytically and selectively formed within a first circuit pattern.
    Type: Grant
    Filed: May 8, 1998
    Date of Patent: August 22, 2000
    Assignee: Substrate Technologies Incorporated
    Inventors: Abram M. Castro, Aaron R. Castro