Patents by Inventor Aarthi SRIDHARAN

Aarthi SRIDHARAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Overhang model for reducing passivation stress and method for producing the same
    Patent number: 11031358
    Abstract: A method for forming a sensor with increased overhang to prevent passivation stress fractures is provided. Embodiments include forming a first passivation layer over a dielectric layer patterned over a first top metal layer of a logic region of a sensor and a second top metal layer of an array region of the sensor; planarizing the first passivation layer and the dielectric layer to form a level surface above the first top metal layer and the second top metal layer; etching the dielectric layer to form a pad opening in the array region of the sensor based on a predetermined overhang value, the pad opening exposing a portion of the surface of the second top metal layer; and forming a second passivation layer over the level surface and the pad opening in the array region.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: June 8, 2021
    Assignee: MARVELL ASIA PTE, LTD.
    Inventors: Aarthi Sridharan, Gong Cheng, Premachandran Chirayarikathuveedu, Fahad Mirza, Carole Graas, Sricharan Tubati, Nurul Islam Mohd
  • OVERHANG MODEL FOR REDUCING PASSIVATION STRESS AND METHOD FOR PRODUCING THE SAME
    Publication number: 20190273051
    Abstract: A method for forming a sensor with increased overhang to prevent passivation stress fractures is provided. Embodiments include forming a first passivation layer over a dielectric layer patterned over a first top metal layer of a logic region of a sensor and a second top metal layer of an array region of the sensor; planarizing the first passivation layer and the dielectric layer to form a level surface above the first top metal layer and the second top metal layer; etching the dielectric layer to form a pad opening in the array region of the sensor based on a predetermined overhang value, the pad opening exposing a portion of the surface of the second top metal layer; and forming a second passivation layer over the level surface and the pad opening in the array region.
    Type: Application
    Filed: March 1, 2018
    Publication date: September 5, 2019
    Inventors: Aarthi SRIDHARAN, Gong CHENG, Premachandran CHIRAYARIKATHUVEEDU, Fahad MIRZA, Carole GRAAS, Sricharan TUBATI, Nurul Islam MOHD