Abstract: Mixtures essentially comprising compounds of formula I or II ##STR1## wherein X is a hydrogen atom or vinyl, A is a divalent aromatic radical which is unsubstituted or substituted by one or more C.sub.1 -C.sub.20 alkyl groups, halogen atoms or halogen-substituted C.sub.1 -C.sub.20 alkyl groups, R.sub.1, R.sub.1 ', R.sub.2, R.sub.2 ', R.sub.3 and R.sub.3 ' are each a hydrogen atom, or R.sub.1 and R.sub.1 ', R.sub.2 and R.sub.2 ' and R.sub.3 and R.sub.3 ' are each together ethylene, R.sub.4 is C.sub.1 -C.sub.6 alkyl, phenylalkyl containing 1 to 6 carbon atoms in the alkyl moiety or is trialkylsilyl containing 1 to 6 carbon atoms in each alkyl moiety, m is 0, 1 or 2, n is 0 or an average number from 1 to 200, p is an average number from 1 to 100 and q is 0 or an average number from 1 to 100, can be cured by heating and are suitable for making laminates, especially for fabricating copper-clad circuit boards.

Abstract: Compositions comprisingA) compounds of formula I ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are identical or different and each is hydrogen or methyl, and X is a divalent organic radical comprising from 2 to 60 carbon atoms, andB) compounds of formula II ##STR2## wherein R.sub.5 and R.sub.6 are identical or different and each, independently of the other, is C.sub.1 -C.sub.8 alkyl, and Y is hydrogen or an allyl radical, are distinguished by a favorable processing behaviour and high glass transition temperatures.

Abstract: Storage-stable heat-curable mixtures are described which contain(A) a polyimide which contains in the molecule at least two radicals of formula I ##STR1## wherein D is a divalent radical with a C.dbd.C double bond, (B) an alkenylphenol,(C) an epoxide group-free adduct of an epoxy resin with excess alkenylphenol or(D) a polyimide which is soluble in organic solvents or a mixture of (C) and (D).These mixtures are employed for example as laminating resins or electro-resins, as adhesives or adhesive films for application at high temperatures, or for the preparation of coatings.

Abstract: Compounds of formula I or II ##STR1## wherein R.sup.1 and R.sup.2 are hydrogen, alkyl, cyclohexyl, phenyl, benzyl or tolyl, or are a --CH.sub.2 --CHR.sup.3 --CH.sub.2 --S--CO--R.sup.4 radical, R.sup.3 is hydrogen or methyl, R.sup.4 is alkyl, cyclohexyl, phenyl, benzyl or tolyl, X is alkylene, --S--, --SO--, --SO.sub.2 -- or substituted alkylene, in which R.sup.5 and R.sup.6 are hydrogen or alkyl, and n is an integer from 1 to 10, can be used as latent hardeners for epoxy resins.The compositions containing epoxy resins and these hardeners are particularly suitable for use as single component adhesive formulations. The cured products have good hot water resistance.

Abstract: Compounds of formula I or II ##STR1## in which formulae R.sup.1 and R.sup.2 are each independently of the other hydrogen, alkyl, alkenylmethyl, cyclohexyl, phenyl, benzyl or tolyl, or are a --CH.sub.2 --CHR.sup.3 --CH.sub.2 --S--H group, R.sup.3 and R.sup.4 are each independently of the other hydrogen or methyl, X is alkylene, --S--, --SO--, --SO.sub.2 -- or substituted alkylene, R.sup.5 and R.sup.6 are each independently of the other hydrogen or alkyl, R.sup.8 is hydrogen, alkyl, alkenylmethyl or phenyl, and wherein n is an integer from 1 to 10, can be used as hardeners for epoxy resins.The compositions containing epoxy resins and these hardeners are particularly suitable for use as adhesive formulations. The cured products have good moisture resistance.

Abstract: 2,6-Disubstituted 4-epoxypropyl glycidyl ethers of the formula ##STR1## wherein X is a group R' or X is a group of the formula ##STR2## and each of R and R' independently of the other is C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.4 alkoxy, a halogen atom or C.sub.6 -C.sub.10 aryl, can be used, together with customary epoxy resin hardeners, for the preparation of cured products, in particular for application in the electronics industry, or as adhesives. Compounds of the formula are also valuable reactive diluents for curable epoxy resin mixtures.

Abstract: Compounds of formula I or II ##STR1## wherein R.sup.1 and R.sup.2 are hydrogen, alkyl, cyclohexyl, phenyl, benzyl or tolyl, or are a --CH.sub.2 --CHR.sup.3 --CH.sub.2 --S--CO--R.sup.4 radical, R.sup.3 is hydrogen or methyl, R.varies.is alkyl, cyclohexyl, phenyl, benzyl or tolyl, X is alkylene, --S--, --SO--, --SO.sub.2 -- or substituted alkylene, in which R.sup.5 and R.sup.6 are hydrogen or alkyl, and n is an integer from 1 to 10, can be used as latent hardeners for epoxy resins.The compositions containing epoxy resins and these hardeners are particularly suitable for use as single component adhesive formulations. The cured products have good hot water resistance.

Abstract: The invention relates to polyepoxides which are obtainable by reacting compounds of formula I ##STR1## wherein n is 1 or 2, and X, if n is 1, is a group R.sub.3, or, if n is 2, X is a group of the formula ##STR2## each of R.sub.1 and R.sub.3 independently of the other is C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.4 alkoxy, allyl, a halogen atom or C.sub.6 -C.sub.10 aryl and R.sub.2 is allyl, 1-propenyl or 2-propenyl, with compounds containing phenolic OH groups, and subsequently epoxidizing the resultant adducts in the presence of a peracid. Said polyepoxides can be used, together with customary epoxy resin hardeners, for the preparation of cured products, in particular for coating electronic components, or as adhesives.

Abstract: Triglycidyl compounds of the formula I ##STR1## and epoxy resin mixtures containing a triglycidyl compound of the formula I and a tetraglycidyl compound of the formula II ##STR2## in which formulae each of R and R' independently is a hydrogen atom, C.sub.1 -C.sub.6 alkyl, phenyl, cyclohexyl or cyclopentyl, and each of R.sub.1, R.sub.2, R.sub.3 and R.sub.4 independently is a hydrogen atom, a halogen atom, or C.sub.1 -C.sub.6 alkyl.Thses compounds are valuable epoxy resins which are also suitable for the preparation of B-stage resins.

Abstract: A mixture consisting of a polymaleimide and a copolymerizable monomer or a prepolymer formed from these two compounds contains, as the polymerization catalyst, an ethane which is substituted by aromatic groups and hydroxyl groups or halogen (cf. formula II), such as benzpinacol. The mixture is stable on storage and heat-curable. It can be cured, while at the same time being shaped to give mouldings, sheet-like structures, laminates, adhesive bonds or foams, for example by casting or compression moulding.

Abstract: The invention relates to a polymerizable and self-crosslinkable composition of monomers having olefinic unsaturation and, if desired, conventional additives, said composition containing(a) 1 to 99.9% by weight of at least one ethylene or propylene monomer which is substituted by polar groups or aromatic hydrocarbon groups, and(b) 99 to 0.1% by weight of an acrylate or methacrylate of monohydric or dihydric, mononuclear or binuclear phenols which are substituted by allyl, methallyl or 1-propenyl groups, or hydroxyalkyl ethers thereof. The composition of the invention can be used as a casting or impregnating resin, adhesive, lacquer and binder, and it can be cured by irradiation and/or heat.

Abstract: Curable mixtures of(a) maleimides of the general formula I ##STR1## wherein R is an n-valent aliphatic or aromatic radical, and n is the number 1, 2 or 3; and(b) mono- or polyvalent phenols which contain in the molecule at least one 1-propenyl group in the ortho- or para-position with respect to the hydroxyl group, or isomeric mixtures of mono- or polyvalent phenols which are propenyl-substituted in the ortho- or para-position and mono- or polyvalent phenols which are allyl-substituted in the ortho- or para-position, the proportion of propenyl groups in the isomeric mixture having to be at least 5 equivalent-%, relative to the sum of the equivalents of propenyl and allyl groups.The novel mixtures cure at elevated temperatures relatively rapidly, and produce molded materials having valuable mechanical properties.

Abstract: Polymerizable compositions comprise(a) a compound containing in the same molecule both at least one phenolic hydroxyl group and at least two groups chosen from allyl, methallyl, and 1-propenyl groups, e.g., 2,2-bis(3-allyl-4-hydroxyphenyl)propane or bis(3-(1-propenyl)-4-hydroxyphenyl)methane,(b) a compound containing at least two mercaptan groups per molecule, e.g., pentaerythritol tetrathioglycollate, and(c) a heat-activated crosslinking agent for phenol-aldehyde novolac resins.The compositions are caused to polymerize by the action of irradiation of free-radical catalysts. The polymers so obtained, containing more than one phenolic hydroxyl group, can be subsequently crosslinked in situ by heating. The compositions are useful in various two-stage operations, such as the production of multilayer printed circuits.Polymerizable compositions may also comprise(d) a compound as (a) but containing at least two phenolic hydroxyl groups,(e) a compound containing more than two mercaptan groups per molecule.

Abstract: Curable mixtures of(a) maleimides of the general formula I ##STR1## wherein R is an n-valent aliphatic or aromatic radical, and n is the number 1,2 or 3; and(b) mono- or polyvalent phenols which contain in the molecule at least one 1-propenyl group in the ortho- or para-position with respect to the hydroxyl group, or isomeric mixtures of mono- or polyvalent phenols which are propenyl-substituted in the ortho- or para-position and mono- or polyvalent phenols which are allyl-substituted in the ortho- or para-position, the proportion of propenyl groups in the isomeric mixture having to be at least 5 equivalent-%, relative to the sum of the equivalents of propenyl and allyl groups.The novel mixtures cure at elevated temperatures relatively rapidly, and produce moulded materials having valuable mechanical properties.

Abstract: The adhesive or adhesive component according to the invention, which contains a vinyl monomer, a vinyl polymer, a compound producing free radicals, and, as an adhesion promoter, an acid amide or imide which is substituted on the nitrogen atom by a chlorosulfonated alkyl, aryl or aralkyl group, forms, together with an amine accelerator, an adhesive with which heat-, oil- and water-resistant bonds, for example of metals, polymeric materials, glass and ceramics, having very high tensile shearing strength can be obtained. The adhesive can also be converted into the form of a dried sheet, with or without carrier, and in this form can be used for bonding.

Abstract: Mixtures which can be cured to give moulded materials having technically very valuable mechanical and dielectric properties, characterised in that they contain(a) mono-, bis- or tris-maleimides and/or maleimide prepolymers of the maleimides with an aliphatic, cycloaliphatic or aromatic diprimary diamine,(b) acetone-anil, and optionally(c) a copolymerisable compound containing at least one olefinic C.dbd.C double bond in the molecule.

Abstract: Polymerizable compositions comprise(a) a compound containing in the same molecule both at least one 1,2-epoxide group and at least two groups chosen from allyl, methallyl, and 1-propenyl groups, e.g., 2,2-bis(3-allyl-4-(glycidyloxy)phenyl)propane or bis(3-(1-propenyl)-4-(glycidyloxy)phenyl)methane, and(b) a compound containing at least two mercaptan groups per molecule, e.g., pentaerythritol tetrathioglycollate.The compositions are caused to polymerize by the action of irradiation or free-radical catalysts. They may, if desired, also contain a heat-curing crosslinking agent for epoxide resins; the epoxide-containing polymers so obtained can be subsequently crosslinked in situ. The compositions are useful in various two-stage operations, such as the production of multilayer printed circuits.

Abstract: Mixtures which can be cured to give moulded materials having technically very valuable mechanical and dielectric properties, characterized in that they contain(a) mono-, bis- or tris-maleimides and/or maleimide prepolymers of the maleimides with an aliphatic, cycloaliphatic or aromatic diprimary diamine,(b) acetone-anil, and optionally(c) a copolymerizable compound containing at least one olefinic C.dbd.C double bond in the molecule.

Abstract: The invention relates to solutions which are stable on storage and which contain curable mixtures of polymaleimides, comonomers for these polymaleimides and, optionally, polymerization catalysts and compounds which contain at least one furyl radical, preferably furfuryl alcohol. The solutions are used for the manufacture of crosslinked polymers containing imide groups. Usually a substrate is impregnated with the solution. After drying, curing is carried out at 100 to 300.degree. C. Using a known method, for example, glass fibre fabric is subjected to hot pressing together with a copper foil, curing being effected. This gives correspondingly copper-coated laminated sheets which are outstandingly suitable for the manufacture of printed circuits.

Abstract: The invention relates to storage-stable, thermosetting mixtures which contain polymaleimides, epoxide compounds having at least one allyl group, and optionally, curing agents for epoxide compounds, and/or curing accelerators for epoxide resin mixtures. These mixtures can be converted by curing into high-polymers which have excellent electrical properties (especially at high temperatures) and very good thermal properties.