Patents by Inventor Abdul-Hamid Kayal
Abdul-Hamid Kayal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8566588Abstract: Authentication and secure wireless data exchange is provided between a chip with an identification code and a dedicated server via a read unit, which carries out contactless read and/or write operations on the chip. The read unit connects to a computer terminal connected to a communication network. A first connection is first established to the communication network from the computer terminal connected to the read unit to the dedicated server using a defined secure data communication protocol. A second connection to the communication network from the read unit to the dedicated server is then established using the computer terminal as a secure data transmission tunnel to directly exchange encrypted data between the read unit and the server invisibly to the computer terminal. Finally, wireless personalized communication is carried out between the read unit and the chip once the chip is identified upon request of the dedicated server.Type: GrantFiled: May 16, 2007Date of Patent: October 22, 2013Assignee: EM Microelectric-Mann S.A.Inventors: Eric Lugt, Jean-Claude Rais, Abdul-Hamid Kayal
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Patent number: 8183521Abstract: The optoelectronic module includes a photoreceptor circuit for picking up light from a light source by reflection on an external surface. The photoreceptor circuit and the light source circuit are mounted on a substrate, and contact pads of the circuits are electrically connected to pads of the substrate. The substrate pads are connected to conductive paths of the substrate. The flexible substrate includes a first portion on which the photoreceptor circuit and light source circuit are mounted and electrically connected, a second portion including electrical connection terminals and a connecting portion between the first portion and the second portion. This connecting portion connects some conductive paths of the first portion to the connection terminals of the second portion. The connecting portion allows the height and/or spacing of the second portion to be adjusted relative to the first portion when the module is mounted, particularly in a computer mouse.Type: GrantFiled: February 14, 2008Date of Patent: May 22, 2012Assignee: EM Microelectronic-Marin S.A.Inventors: Victorio Quercia, André Grandjean, Abdul-Hamid Kayal
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Patent number: 7957448Abstract: The optoelectronic circuit includes a photoreceptor (1) made in a silicon semiconductor substrate (4), and a monomode VCSEL laser diode (2) made in a gallium arsenide substrate. The photoreceptor includes at least one photosensitive area with a pixel array for picking up light and an area with a control and processing unit for the signals supplied by the pixels. The laser diode is mounted and electrically connected directly on one part of the photoreceptor. The laser diode is connected by a conductive terminal (12) to a first contact pad (3) at the bottom of a cavity (13) made through a passivation layer (5) of the photoreceptor. An electrode (17) on the top of the diode is connected by a metal wire (15) to a second contact pad (3) of the photoreceptor. The photoreceptor controls the diode directly via the electrode and the conductive terminal to generate a laser beam (L).Type: GrantFiled: August 18, 2008Date of Patent: June 7, 2011Assignee: EM Microelectronic-Marin S.A.Inventors: Michel Willemin, André Grandjean, Victorio Quercia, Abdul-Hamid Kayal, Steve Tanner
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Patent number: 7750288Abstract: The method of making an optoelectronic module (10, 20), which includes a first light source circuit (5) and a second photoreceptor circuit (6) for picking up light from the first light source circuit reflected on an external surface. A first moulding (20) with an encapsulation material is made on one part of a lead frame (10) having several conductive paths (12) and an external frame (11) connecting all of the conductive paths. A first light source circuit (5) is placed on one portion of a first conductive path (13) of the lead frame that is not covered by the first moulding. A second photoreceptor circuit (6) is placed on one portion of a second conductive path (14) of the lead frame not covered by the first moulding. A through opening (21) is also made in the first moulding (20) between the external frame (11) and the location of the first light source circuit (5) to give access to the first connecting path (13) and to a third connecting path (15) for the first light source circuit.Type: GrantFiled: December 19, 2007Date of Patent: July 6, 2010Assignee: EM Microelectronic-Marin S.A.Inventors: André Grandjean, Abdul-Hamid Kayal
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Publication number: 20090302123Abstract: The method is for coded marking of a product of small size, such as horological or jewelry product (10). The method consists in carrying out a first mathematical operation of encrypting an identifier (13), such as a serial number of the product to be marked using a specific security algorithm key to obtain a first authenticator. The first authenticator includes a first data length defined by a first large number of alphanumerical characters. This first authenticator is encrypted using a second mathematical operation using a Hash type function into a second authenticator. This second authenticator includes a second data length defined by a second reduced number of alphanumerical characters shorter than the first number of characters. The second authenticator is converted into a coded image, which is preferably a two dimensional barcode (11) so as to be placed on the product as the coded mark in order to allow said product to be authenticated.Type: ApplicationFiled: December 22, 2006Publication date: December 10, 2009Applicant: MONTRES BREGUET SAInventors: Eric Lugt, Abdul-Hamid Kayal
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Patent number: 7579579Abstract: The integrated photoreceptor circuit includes a photosensitive area for picking up light and a processing unit area for processing the signals provided by the photosensitive area. This photoreceptor circuit includes electric contact pads, which are arranged symmetrically solely on the side of the processing unit area, which is juxtaposed with the photosensitive area. The integrated photoreceptor circuit is mounted on a first portion of a flexible substrate. The contact pads of the integrated photoreceptor circuit are electrically connected to electrical connection pads of the printed circuit of the flexible substrate. A second portion of the flexible substrate carries electrical connection terminals, which are connected to the connection pads via conductive paths, arranged in part on a connecting portion between the first and second portions. A through aperture in the first portion may be provided opposite the photosensitive area only of the photoreceptor circuit.Type: GrantFiled: March 6, 2008Date of Patent: August 25, 2009Assignee: EM Microelectronic-Marin S.A.Inventors: Victorio Quercia, André Grandjean, Abdul-Hamid Kayal
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Publication number: 20090059989Abstract: The optoelectronic circuit includes a photoreceptor (1) made in a silicon semiconductor substrate (4), and a monomode VCSEL laser diode (2) made in particular in a gallium arsenide substrate. The photoreceptor includes at least one photosensitive area with a pixel array for picking up light and an area with a control and processing unit for the signals supplied by the pixels. The laser diode (2) is mounted and electrically connected directly on one part of the photoreceptor. This laser diode may be housed in a cavity (13) made through a passivation layer (5) of the photoreceptor, and connected by a conductive terminal (12) to a first contact pad (3) at the bottom of the cavity. An electrode (17) on the top of the diode can be connected by a metal wire (15) to a second neighbouring accessible contact pad (3) of the photoreceptor. The photoreceptor (1) controls the diode directly via the electrode and the conductive terminal to generate a laser beam (L).Type: ApplicationFiled: August 18, 2008Publication date: March 5, 2009Applicant: EM MICROELECTRONIC-MARIN S.A.Inventors: Michel Willemin, Andre Grandjean, Victorio Quercia, Abdul-Hamid Kayal, Steve Tanner
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Publication number: 20080230679Abstract: The integrated photoreceptor circuit includes a photosensitive area for picking up light and a processing unit area for processing the signals provided by the photosensitive area. This photoreceptor circuit includes electric contact pads, which are arranged symmetrically solely on the side of the processing unit area, which is juxtaposed with the photosensitive area. The integrated photoreceptor circuit is mounted on a first portion of a flexible substrate. The contact pads of the integrated photoreceptor circuit are electrically connected to electrical connection pads of the printed circuit of the flexible substrate. A second portion of the flexible substrate carries electrical connection terminals, which are connected to the connection pads via conductive paths, arranged in part on a connecting portion between the first and second portions. A through aperture in the first portion may be provided opposite the photosensitive area only of the photoreceptor circuit.Type: ApplicationFiled: March 6, 2008Publication date: September 25, 2008Applicant: EM MICROELECTRONIC-MARIN S.A.Inventors: Victorio Quercia, Andre Grandjean, Abdul-Hamid Kayal
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Publication number: 20080204416Abstract: The optoelectronic module (1) includes a photoreceptor circuit (3) for picking up light from a light source by reflection on an external surface. The photoreceptor circuit and the light source circuit are mounted on a substrate (2), and contact pads (6) of the circuits are electrically connected to pads of the substrate. The substrate pads are connected to conductive paths of the substrate. The flexible substrate includes a first portion (2a) on which the photoreceptor circuit (3) and light source circuit are mounted and electrically connected, a second portion (2b) including electrical connection terminals (9) and a connecting portion (2c) between the first portion and the second portion. This connecting portion connects some conductive paths of the first portion to the connection terminals of the second portion. The connecting portion allows the height and/or spacing of the second portion to be adjusted relative to the first portion when the module is mounted, particularly in a computer mouse.Type: ApplicationFiled: February 14, 2008Publication date: August 28, 2008Applicant: EM MICROELECTRONIC-MARIN S.A.Inventors: Victorio Quercia, Andre Grandjean, Abdul-Hamid Kayal
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Publication number: 20080142679Abstract: The method of making an optoelectronic module (10, 20), which includes a first light source circuit (5) and a second photoreceptor circuit (6) for picking up light from the first light source circuit reflected on an external surface. A first moulding (20) with an encapsulation material is made on one part of a lead frame (10) having several conductive paths (12) and an external frame (11) connecting all of the conductive paths. A first light source circuit (5) is placed on one portion of a first conductive path (13) of the lead frame that is not covered by the first moulding. A second photoreceptor circuit (6) is placed on one portion of a second conductive path (14) of the lead frame not covered by the first moulding. A through opening (21) is also made in the first moulding (20) between the external frame (11) and the location of the first light source circuit (5) to give access to the first connecting path (13) and to a third connecting path (15) for the first light source circuit.Type: ApplicationFiled: December 19, 2007Publication date: June 19, 2008Applicant: EM MICROELECTRONIC-MARIN S.A.Inventors: Andre Grandjean, Abdul-Hamid Kayal
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Publication number: 20070279190Abstract: The method allows authentication and secure wireless data exchange between a chip with an identification code (1?) and a dedicated server (35) via a read unit (5). This read unit is arranged for carrying out contactless read and/or write operations on the chip. The read unit is connected to a computer terminal (30) connected to a communication network (300) of computer terminals. For the method, a first connection is first of all established to the communication network from the computer terminal connected to the read unit to the dedicated server using a defined secure data communication protocol. A second connection to the communication network from the read unit to the dedicated server is then established. For this second connection, the computer terminal is used as a secure data transmission tunnel in order to directly exchange encrypted data between the read unit and the server in a manner invisible to the computer terminal.Type: ApplicationFiled: May 16, 2007Publication date: December 6, 2007Applicant: EM MICROELECTRONIC-MARIN S.A.Inventors: Eric Lugt, Jean-Claude Rais, Abdul-Hamid Kayal