Abstract: Systems, apparatuses, and methods are provided for manufacturing a substrate table. An example method can include forming a vacuum sheet including a plurality of vacuum connections and a plurality of recesses configured to receive a plurality of burls disposed on a core body for supporting an object such as a wafer. Optionally, at least one burl can be surrounded, partially or wholly, by a trench. The example method can further include using the vacuum sheet to mount the core body to an electrostatic sheet including a plurality of apertures configured to receive the plurality of burls. Optionally, the example method can include using the vacuum sheet to mount the core body to the electrostatic sheet such that the plurality of recesses of the vacuum sheet line up with the plurality of burls of the core body and the plurality of apertures of the electrostatic sheet.

Abstract: A patterning device support for controlling a temperature of a patterning device can include a movable component. The movable component can include a gas inlet for supplying a gas flow across a surface of the patterning device and a gas outlet for extracting the gas flow. The patterning device support can also include a gas flow generator coupled to a duct, for recirculating the gas flow from the gas outlet to the gas inlet.

Abstract: A patterning device support for controlling a temperature of a patterning device can include a movable component. The movable component can include a gas inlet for supplying a gas flow across a surface of the patterning device and a gas outlet for extracting the gas flow. The patterning device support can also include a gas flow generator coupled to a duct, for recirculating the gas flow from the gas outlet to the gas inlet.

Abstract: A patterning device support for controlling a temperature of a patterning device can include a movable component. The movable component can include a gas inlet for supplying a gas flow across a surface of the patterning device and a gas outlet for extracting the gas flow. The patterning device support can also include a gas flow generator coupled to a duct, for recirculating the gas flow from the gas outlet to the gas inlet.

Abstract: A patterning device support for controlling a temperature of a patterning device can include a movable component. The movable component can include a gas inlet for supplying a gas flow across a surface of the patterning device and a gas outlet for extracting the gas flow. The patterning device support can also include a gas flow generator coupled to a duct, for recirculating the gas flow from the gas outlet to the gas inlet.

Abstract: A system for controlling temperature of a patterning device in a lithographic apparatus is discussed. The system includes a patterning device support configured to support a patterning device and a reticle cooling system configured to provide substantially uniform temperature distribution across the patterning device. The reticle cooling system includes a first and second array of gas inlets configured to provide a first and second gas flow along a first and second direction across a surface of the patterning device, respectively, where first and second directions are opposite to each other. The reticle cooling system further includes a switching control system configured to control operation of the first and second arrays of gas inlets.

Abstract: A patterning device support (1100) for controlling a temperature of a patterning device (1102) can include a movable component (1104). The movable component can include a gas inlet (1108) for supplying a gas flow across a surface of the patterning device and a gas outlet (1110) for extracting the gas flow. The patterning device support can also include a gas flow generator (1118) coupled to a duct (1114, 1116) for recirculating the gas flow from the gas outlet to the gas inlet.

Abstract: A patterning device support (1100) for controlling a temperature of a patterning device (1102) can include a movable component (1104). The movable component can include a gas inlet (1108) for supplying a gas flow across a surface of the patterning device and a gas outlet (1110) for extracting the gas flow. The patterning device support can also include a gas flow generator (1118) coupled to a duct (1114, 1116) for recirculating the gas flow from the gas outlet to the gas inlet.

Abstract: A system for controlling temperature of a patterning device in a lithographic apparatus is discussed. The system includes a patterning device support configured to support a patterning device and a reticle cooling system configured to provide substantially uniform temperature distribution across the patterning device. The reticle cooling system includes a first and second array of gas inlets configured to provide a first and second gas flow along a first and second direction across a surface of the patterning device, respectively, where first and second directions are opposite to each other. The reticle cooling system further includes a switching control system configured to control operation of the first and second arrays of gas inlets.

Abstract: Systems and methods to protect a mask from being contaminated by airborne particles are described. The systems and methods include providing a reticle secured in a two-part cover. The two part cover includes a removable protection device used to protect the reticle from contaminants. The cover can be held inside a pod or box that can be used to transport the cover through a lithography system from an atmospheric section to a vacuum section. While in the vacuum section, the removable cover can be moved during an exposure process during which a pattern on the reticle can be formed on a wafer.

Abstract: Systems and methods to protect a mask from being contaminated by airborne particles are described. The systems and methods include providing a reticle secured in a two-part cover. The two part cover includes a removable protection device used to protect the reticle from contaminants. The cover can be held inside a pod or box that can be used to transport the cover through a lithography system from an atmospheric section to a vacuum section. While in the vacuum section, the removable cover can be moved during an exposure process during which a pattern on the reticle can be formed on a wafer.

Abstract: Systems and methods to protect a mask from being contaminated by airborne particles are described. The systems and methods include providing a reticle secured in a two-part cover. The two part cover includes a removable protection device used to protect the reticle from contaminants. The cover can be held inside a pod or box that can be used to transport the cover through a lithography system from an atmospheric section to a vacuum section. While in the vacuum section, the removable cover can be moved during an exposure process during which a pattern on the reticle can be formed on a wafer.

Abstract: Systems and methods to protect a mask from being contaminated by airborne particles are described. The systems and methods include providing a reticle secured in a two-part cover. The two part cover includes a removable protection device used to protect the reticle from contaminants. The cover can be held inside a pod or box that can be used to transport the cover through a lithography system from an atmospheric section to a vacuum section. While in the vacuum section, the removable cover can be moved during an exposure process during which a pattern on the reticle can be formed on a wafer.

Abstract: A system and method are used to protect a mask from being contaminated by airborne particles. They include coupling a reticle and a cover to protect the reticle. The cover includes a frame and a movable panel that moves to allow direct access of light to the reticle during an exposure process. The reticle and cover are moved to a stage using a robot gripper. The reticle and cover may be coupled to a baseplate before being moved. Corresponding alignment devices are coupled to the frame and the panel, the gripper and the panel, and the baseplate and the panel. The stage and the frame can have corresponding attachment devices. A pre-alignment device can be used to align the reticle before transporting it to a stage. The pre-alignment device and the frame can have corresponding alignment devices that can be used to perform the pre-alignment. Predetermined areas of the reticle can be hardened or shaped, such that less particles are produced during contact with the reticle.

Abstract: Systems and methods to protect a mask from being contaminated by airborne particles are described. The systems and methods include providing a reticle secured in a two-part cover. The two part cover includes a removable protection device used to protect the reticle from contaminants. The cover can be held inside a pod or box that can be used to transport the cover through a lithography system from an atmospheric section to a vacuum section. While in the vacuum section, the removable cover can be moved during an exposure process during which a pattern on the reticle can be formed on a wafer.

Abstract: A system and method are used to protect a mask from being contaminated by airborne particles. They include providing a reticle secured in a two-part cover. The two part cover includes a removable protection device used to protect the reticle from contaminants. The cover can be held inside a pod or box that can be used to transport the cover through a lithography system from an atmospheric section to a vacuum section. While in the vacuum section, the removable cover can be moved during an exposure process during which a pattern on the reticle can be formed on a wafer.

Abstract: A system and method are used to protect a mask from being contaminated by airborne particles. They include providing a reticle secured in a two-part cover. The two part cover includes a removable protection device used to protect the reticle from contaminants. The cover can be held inside a pod or box that can be used to transport the cover through a lithography system from an atmospheric section to a vacuum section. While in the vacuum section, the removable cover can be moved during an exposure process during which a pattern on the reticle can be formed on a wafer.

Abstract: A system and method are used to protect a mask from being contaminated by airborne particles. They include providing a reticle secured in a two-part cover. The two part cover includes a removable protection device used to protect the reticle from contaminants. The cover can be held inside a pod or box that can be used to transport the cover through a lithography system from an atmospheric section to a vacuum section. While in the vacuum section, the removable cover can be moved during an exposure process during which a pattern on the reticle can be formed on a wafer.

Abstract: A system and method are used to protect a mask from being contaminated by airborne particles. They include providing a reticle secured in a two-part cover. The two part cover includes a removable protection device used to protect the reticle from contaminants. The cover can be held inside a pod or box that can be used to transport the cover through a lithography system from an atmospheric section to a vacuum section. While in the vacuum section, the removable cover can be moved during an exposure process during which a pattern on the reticle can be formed on a wafer.

Abstract: A system and method are used to protect a mask from being contaminated by airborne particles. They include coupling a reticle and a cover to protect the reticle. The cover includes a frame and a movable panel that moves to allow direct access of light to the reticle during an exposure process. The reticle and cover are moved to a stage using a robot gripper. The reticle and cover may be coupled to a baseplate before being moved. Corresponding alignment devices are coupled to the frame and the panel, the gripper and the panel, and the baseplate and the panel. The stage and the frame can have corresponding attachment devices. A pre-alignment device can be used to align the reticle before transporting it to a stage. The pre-alignment device and the frame can have corresponding alignment devices that can be used to perform the pre-alignment. Predetermined areas of the reticle can be hardened or shaped, such that less particles are produced during contact with the reticle.