Abstract: A high temperature heat transfer fluid is disclosed which comprises a mixture of 1,2,3,4-tetrahydro(1-phenylethyl)naphthalene and an alkyl biphenyl to provide high temperature heat transfer fluids exhibiting favorable thermal stability.

Abstract: A high temperature heat transfer fluid is disclosed which comprises a mixture of 1,2,3,4-tetrahydro(1-phenylethyl)naphthalene and an alkyl biphenyl to provide high temperature heat transfer fluids exhibiting favorable thermal stability.

Abstract: A high temperature heat transfer fluid is disclosed which comprises a mixture of 1,2,3,4-tetrahydro(1-phenylethyl)naphthalene and dibenzyl toluene to provide high temperature heat transfer fluids exhibiting favorable thermal stability.

Abstract: A heat transfer fluid is disclosed which comprises a glycol, a phosphate, and a copolymer additive which is a copolymer of an ethylenically substituted carboxylic acid and an aldehyde. A method for preparing the heat transfer fluid comprises admixing 92 to 96 weight percent of one or more glycols; 2 to 4 weight percent of a phosphate; and 0.01 to 0.25 weight percent of the copolymer additive. Precipitation of phosphate salts is inhibited in phosphate-containing glycol-based fluids by the addition of the copolymer additive before mixing the fluid with water.

Abstract: A heat transfer fluid containing a glycol component and a second component selected from the group consisting of 1,3-dioxolane, 2,2-dimethyl-1,3-dioxolane, glycerol formal, solketal, and 1,3-dioxanes is disclosed. The heat transfer fluid can also optionally contain corrosion inhibitors, C.sub.1-3 alcohols, urea, imidazole or alkali metal salts. These fluids are useful as low temperature heat transfer fluids, are stable to aqueous buffers and may be used neat or as aqueous solutions over a wide range of concentrations.

Abstract: Adducts of metabrominated monophenols such as 3,5-dibromo-2,4,6-trimethylphenol and multifunctional epoxides such as cresol-formaldehyde epoxy novolac resins are disclosed to be useful in formulations for encapsulating electronic components.

Abstract: Adducts of metabrominated monophenols such as 3,5-dibromo-2,4,6-trimethylphenol and multifunctional epoxides such as cresol-formaldehyde epoxy novolac resins are disclosed to be useful in formulations for encapsulating electronic components.

Abstract: Thermally stable methylene-bridged polyphenols such as 2,4-bis(4-hydroxy-3,5-dimethyl)-3,5-dibromo-6-methylphenol are prepared by contacting (1) a substituted phenol having at least one halogen substituted on the aromatic ring in a position meta to the phenolic hydroxyl and at least one halomethyl group substituted on the aromatic ring in a position ortho or para to the phenolic hydroxyl with (2) and o,o-dialkylphenol having hydrogen on the aromatic ring position which is para to the phenolic hydroxyl under alkylation conditions.

Abstract: Adducts of metabrominated monophenols such as 3,5-dibromo-2,4,6-trimethylphenol and multifunctional epoxides such as cresol-formaldehyde epoxy novolac resins are disclosed to be useful in formulations for encapsulating electronic components.

Abstract: Adducts of metabrominated monophenols such as 3,5-dibromo-2,4,6-trimethylphenol and multifunctional epoxides such as cresol-formaldehyde epoxy novolac resins are disclosed to be useful in formulations for encapsulating electronic components.

Abstract: Advanced epoxy resins are disclosed which result from the reaction of a relatively low molecular weight epoxy resin and a polyhydric phenol wherein at least one of the reactants contains at least one halogen atom which is meta with respect to a glycidyl ether group or a hydroxyl group attached to an aromatic ring. These advanced epoxy resins, when cured with a suitable curing agent, possess an improvement as compared to an advanced epoxy resin containing halogen atoms which are ortho with respect to a glycidyl ether group in at least one of thermal stability, glass transition temperature, relationship of viscosity to molecular weight and resistance to forming hydrolyzed halides in the presence of a refluxing solution of an alkali metal hydroxide.

Abstract: 2,6-dibromo-3,5-dialkyl-4-hydroxybenzyl ethers, glycidyl ethers thereof and reaction products with phenolic hydroxyl-containing compounds, and glycidyl ethers of the resulting new phenolic hydroxyl-containing compounds.

Abstract: An improvement in curable compositions which comprise a polyglycidyl ether such as the triglycidylether of tris(hydroxyphenyl)methane and a halogenated dihydric phenol such as tetrabromobisphenol A, the improvement being employing as the halogenated dihydric phenol one in which the halogen atoms are meta with respect to the hydroxyl groups such as 2,2',6,6'-tetrabromo-3 ,3',5,5'-tetramethyl-4,4'-biphenol. These compositions can be cured by heating in the presence or absence of a catalyst for reacting epoxy groups with phenolic hydroxyl groups such as 2-methyl imidazole. These compositions are particularly useful in the preparation of electrical laminates.

Abstract: Phenyl cyanates substituted at both ortho positions and further substituted with at least one halo at the meta or para positions are prepared. Then enhance ignition resistance, fire retardance, and toughness of polytriazines when added in varying amounts to polycyanate monomers before cure.

Abstract: A class of novel tertiary alkyl isocyanates. Of these, novel carbonate diisocyanates can be prepared by contacting a carbonyl dihalide and an aminotertiaryalkylhydroxyaromatic compound in the presence of a base and a reaction medium under reaction conditions.

Abstract: Included is a process to prepare a 4-HALOmethyl-3,5-dihalo-2,6-disubstitutedphenol from a 4-methyl(substituted)phenol and a HALOgenating agent, in an aprotic organic diluent. The process is highly selective and efficient. For example, high purity 4-bromomethyl-3,5-dibromo-2,6-dimethylphenol can be prepared from 2,4,6-trimethylphenol and bromine, in bromochloromethane at high conversion.

Abstract: Titled materials and their preparation. The materials contain a moiety such as, for example, 4-oxy-3,5-dimethyl-2,6-dibromobenzyl which can impart a high degree of thermal and hydrolytic stability to the materials, for example, epoxy thermosets such as in electronic encapsulations. For example, when used in electronic encapsulation formulations, these materials can provide a substantial increase in electronic device reliability. Their preparation involves an alkylation of an aromatic ring, for example, such as a Friedel-Crafts alkylation with 4-bromomethyl-3,5-dibromo-2,6-dimethylphenol or with 4-hydroxymethyl-3,5-dibromo-2,6-dimethylphenol.

Abstract: Halogenated aromatic epoxy resins are disclosed wherein the halogen atoms are in the meta position with respect to a glycidyl ether group attached to an aromatic ring.Advanced epoxy resins are disclosed which result from the reaction of a relatively low molecular weight epoxy resin and a polyhydric phenol wherein at least one of the reactants contains at least one halogen atom which is meta with respect to a glycidyl ether group or a hydroxyl group attached to an aromatic ring. These advanced epoxy resins, when cured with a suitable curing agent, possess an improvement as compared to an advanced epoxy resin containing halogen atoms which are ortho with respect to a glycidyl ether group in at least one of thermal stability, glass transition temperature, relationship of viscosity to molecular weight and resistance to forming hydrolyzed halides in the presence of a refluxing solution of an alkali metal hydroxide.

Abstract: Prepare novel ring-brominated derivatives of tetraalkyl dihydroxy diaromatic compounds, e.g. 4,4'-(1,2-ethanediyl)bis(3,5-dibromo-2,6-dimethyl-phenol).

Abstract: Preparation of monoethers of dihydroxybenzenes from an alkenylphenol and an alkylating agent and thereafter oxidizing in the presence of an acid catalyst.