Patents by Inventor Abelardo Ramirez-Hernandez

Abelardo Ramirez-Hernandez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9718250
    Abstract: Provided are methods of fabricating thin film structures that involve assembling block copolymer materials in the presence of condensed phase surfaces on both sides of the thin film, at least one of which is a chemically patterned surface configured to direct the assembly of the block copolymer material. According to various embodiments, the other of the condensed phase surfaces can be a chemically homogenous surface or a chemically patterned surface. Also provided are structures, morphologies, and templates formed in the domain structure of block copolymer materials. In certain embodiments, complex 3-D morphologies and related structures not present in bulk block copolymer materials are provided.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: August 1, 2017
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Paul Franklin Nealey, Huiman Kang, Guoliang Liu, Hiroshi Yoshida, Yashuhiko Tada, Juan Jose De Pablo, Abelardo Ramirez-Hernandez
  • Publication number: 20130189504
    Abstract: Provided are methods of fabricating thin film structures that involve assembling block copolymer materials in the presence of condensed phase surfaces on both sides of the thin film, at least one of which is a chemically patterned surface configured to direct the assembly of the block copolymer material. According to various embodiments, the other of the condensed phase surfaces can be a chemically homogenous surface or a chemically patterned surface. Also provided are structures, morphologies, and templates formed in the domain structure of block copolymer materials. In certain embodiments, complex 3-D morphologies and related structures not present in bulk block copolymer materials are provided.
    Type: Application
    Filed: September 14, 2012
    Publication date: July 25, 2013
    Applicant: WISCONSIN ALUMNI RESEARCH FOUNDATION
    Inventors: Paul Franklin Nealey, Huiman Kang, Guoliang Liu, Hiroshi Yoshida, Yashuhiko Tada, Juan Jose De Pablo, Abelardo Ramirez-Hernandez