Abstract: A method for fabricating a mirror array from multilayered substrate structures. The method forms a release layer overlying a material layer, which is formed on an insulating layer of multilayered substrate. The insulating layer is sandwiched between the material layer and a handle layer. As merely an example, the material layer is a silicon layer defined over a silicon dioxide layer on a silicon on insulator structure, commonly known as SOI. The method forms an opening in the release layer to expose a portion of the material layer. The method forms a torsion bar layer overlying the release layer and in the opening to connect to the material layer; and removes the release layer to hang the material layer from the torsion bar layer.

Abstract: A method for fabricating an array of mirrors disposed on a die from a substrate. The method includes placing a substrate comprising a plurality of die thereon on a stage. Each of the die comprises a plurality of movable mirror devices in an array configuration. Each die comprises a peripheral region defining a street that surrounds the array configuration. The method forms a plurality of tabs that join one die to another die in the street of the substrate. Each of the tabs also is separated from each other in a sequential manner by a recessed region between at least two of the tabs. The street defined by the tabs and the recessed region defined therebetween in a sequential manner.

Abstract: A method for fabricating a mirror array from a silicon on insulator substrate structure. The method includes providing a silicon-on-insulator (SOI) substrate structure, which may have a material thickness of greater than 10 microns overlying an insulating layer. The SOI material thickness is of a single crystal silicon bearing material. The method also patterns the material thickness using a deep reactive ion etching process to pattern a mirror device structure by forming a trench region that extends from a surface of the material thickness to the insulator structure; and patterns the thickness of material to form a recessed region coupled to the trench region to define a torsion bar structure. The recessed region extends from the surface of the material thickness and is less than about 80% of the mirror device thickness. The method forms an opening on a back side of the SOI substrate structure to the insulator structure.

Abstract: An optical deflection device. The device includes a substrate (e.g., silicon, silicon on insulator) comprising a plurality of die thereon. Each of the die has a plurality of movable mirror devices in an array configuration. Each of the movable mirrors is supported by at least one torsion bar to a frame structure, which is formed on the substrate. Each of the die also has a peripheral region defining a street that surrounds the array configuration to define the die. A plurality of tabs is formed in the street to join one die to another die on the substrate. At least two of the tabs are separated from each other in a sequential manner by a recessed region defined there between. The tabs and the recessed region are positioned to each other in a sequential manner.

Abstract: A robust and highly sensitive pressure sensing device with good linearity made with a thin-bossed diaphragm, and a process to manufacture the same that involves minimal additional steps and is fully compatible with conventional bulk micromachining processes that are used to make standard pressure sensors.