Patents by Inventor Abhijit Suryavanshi

Abhijit Suryavanshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10753158
    Abstract: Polycrystalline diamond cutters for rotary drill bits and methods of making the same are disclosed. Polycrystalline diamond cutters include a support substrate and a polycrystalline diamond body coupled to the support substrate. The polycrystalline diamond body includes a plurality of diamond grains exhibiting inter-diamond bonding therebetween and defining a plurality of interstitial regions, a non-catalytic material distributed throughout the polycrystalline diamond body in a detectable amount, and a catalytic material distributed throughout the polycrystalline diamond body in a detectable amount.
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: August 25, 2020
    Assignee: DIAMOND INNOVATIONS, INC.
    Inventors: Valeriy Konovalov, Abhijit Suryavanshi
  • Patent number: 10556832
    Abstract: Superabrasive compacts and methods of making superabrasive compacts are disclosed. A superabrasive compact includes a polycrystalline diamond table and a substrate attached to the polycrystalline diamond table. The substrate includes a hard metal carbide and a binder having a compound with a composition of AxByCz, where A and B are transition metals, where C is carbon, and where 0?x?7, 0?y?7, x+y=7, and 0?z?3.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: February 11, 2020
    Assignee: DIAMOND INNOVATIONS, INC.
    Inventors: Hui Zhang, Abhijit Suryavanshi, Alexander Hirsch, Kai Zhang
  • Publication number: 20180245405
    Abstract: Polycrystalline diamond cutters for rotary drill bits and methods of making the same are disclosed. Polycrystalline diamond cutters include a support substrate and a polycrystalline diamond body coupled to the support substrate. The polycrystalline diamond body includes a plurality of diamond grains exhibiting inter-diamond bonding therebetween and defining a plurality of interstitial regions, a non-catalytic material distributed throughout the polycrystalline diamond body in a detectable amount, and a catalytic material distributed throughout the polycrystalline diamond body in a detectable amount.
    Type: Application
    Filed: January 21, 2016
    Publication date: August 30, 2018
    Inventors: Valeriy KONOVALOV, Abhijit SURYAVANSHI
  • Publication number: 20180142522
    Abstract: Cutting elements having accelerated leaching rates and methods of making the same are disclosed herein. In one embodiment, a method of forming a cutting element includes assembling a reaction cell having diamond particles, a non-catalyst material, a catalyst material, and a substrate within a refractory metal container, where the non-catalyst material is generally immiscible in the catalyst material at a sintering temperature and pressure. The method also includes subjecting the reaction cell and its contents to a high pressure high temperature sintering process to form a polycrystalline diamond body that is attached to the substrate. The method further includes contacting at least a portion of the polycrystalline diamond body with a leaching agent to remove catalyst material and non-catalyst material from the diamond body, where a leaching rate of the catalyst material and the non-catalyst material exceeds a conventional leaching rate profile by at least about 30%.
    Type: Application
    Filed: May 6, 2016
    Publication date: May 24, 2018
    Inventors: Abhijit SURYAVANSHI, Andrew GLEDHILL, Christopher LONG, Valeriy KONOVALOV, Kai ZHANG
  • Publication number: 20170297172
    Abstract: A superabrasive compact and a method of making the superabrasive compact are disclosed. A superabrasive compact may include a diamond table and a substrate. The diamond table may be attached to the substrate. The substrate may have a metric of being defined as a ratio of carbon content over tungsten carbide content, wherein the metric ranges from about 6.13% to about 7.5%.
    Type: Application
    Filed: September 25, 2015
    Publication date: October 19, 2017
    Inventors: Kai ZHANG, Abhijit SURYAVANSHI, Alexander HIRSCH, Hui ZHANG
  • Publication number: 20170297960
    Abstract: Superabrasive compacts and methods of making superabrasive compacts are disclosed. A superabrasive compact includes a polycrystalline diamond table and a substrate attached to the polycrystalline diamond table. The substrate includes a hard metal carbide and a binder having a compound with a composition of AxByCz, where A and B are transition metals, where C is carbon, and where 0?x?7, 0?y?7, x+y=7, and 0?z?3.
    Type: Application
    Filed: September 25, 2015
    Publication date: October 19, 2017
    Inventors: Hui ZHANG, Abhijit SURYAVANSHI, Alexander HIRSCH, Kai ZHANG
  • Publication number: 20170266784
    Abstract: A compact, a superabrasive compact and a method of making the compact and superabrasive compact are disclosed. A compact may include a plurality of carbide particles, a binder, and a species. The binder may be dispersed among the plurality of tungsten carbide particles. The species may be dispersed in the compact, wherein the binder has a melting point from about 600° C. to about 1350° C. at ambient pressure. A superabrasive compact may include a diamond table and a substrate. The diamond table may be attached to the substrate. The substrate may have a binder. The melting point of the binder is from about 600° C. to about 1350° C. at high pressure from about 30 kbar to about 100 kbar.
    Type: Application
    Filed: September 25, 2015
    Publication date: September 21, 2017
    Inventors: Kai ZHANG, Alexander HIRSCH, Hui ZHANG, Abhijit SURYAVANSHI
  • Publication number: 20170247951
    Abstract: Polycrystalline diamond cutting elements with modified catalyst depleted portions and methods of making the same are disclosed herein. A method may include removing inter-bonded diamond grains along an outer surface of a polycrystalline diamond compact to form a frustoconical surface, introducing the polycrystalline diamond compact to a leaching process in which catalyst material that is positioned within interstitial regions between the inter-bonded diamond grains is removed from the polycrystalline diamond compact, and removing inter-bonded diamond grains along the outer surface of the polycrystalline diamond compact to form a polycrystalline diamond cutting element having a peripheral surface.
    Type: Application
    Filed: February 21, 2017
    Publication date: August 31, 2017
    Inventor: Abhijit SURYAVANSHI
  • Publication number: 20150292270
    Abstract: A superabrasive compact and a method of making the superabrasive compact are disclosed. A superabrasive compact may comprise a diamond table and a substrate. The diamond table may be attached to the substrate. The diamond table may include bonded diamond grains defining interstitial channels. The interstitial channels may be filled with non-binder materials in the first region. The interstitial channels in the second region may be filled with a binder material and an additive from the substrate.
    Type: Application
    Filed: April 9, 2014
    Publication date: October 15, 2015
    Applicant: DIAMOND INNOVATIONS, INC.
    Inventors: Kai Zhang, Abhijit Suryavanshi, Alexander Hirsch, Jessica Marshall, Susanne Norgren, Joel Vaughn, Hui Zhang
  • Patent number: 9034064
    Abstract: Methods for preparing a silicon bonded PCD material involving a one step, double sweep process and drilling cutters made by such processes are disclosed. The PCD material includes thermally stable phases in the interstitial spaces between the sintered diamond grains. The method sweeps a diamond powder with a binder to form sintered PCD, reacts said molten binder with a temporary barrier separating said binder and said diamond from a silicon (Si) source, and sweeps said sintered PCD with said Si source to form SiC bonded PCD.
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: May 19, 2015
    Inventor: Abhijit Suryavanshi
  • Patent number: 9010463
    Abstract: A method of prolonging the life of a PDC cutter having a substantially cylindrical shape centered about a rotational axis, and an apparatus for multi-axis modulation of a PDC cutter, the method including imparting linear modulation to the cutter in at least one direction and imparting rotary modulation to the cutter about the rotational axis, the rotary modulation being synchronized with, and facilitated by, the linear modulation.
    Type: Grant
    Filed: July 18, 2012
    Date of Patent: April 21, 2015
    Assignee: Diamond Innovations, Inc.
    Inventors: Steven W. Webb, Abhijit Suryavanshi
  • Publication number: 20140208660
    Abstract: A method for forming a polycrystalline diamond compact (PDC) includes treating a carbide substrate having a cobalt content therein with an acid, e.g., aqua regia, to remove cobalt from a surface portion of the carbide substrate; disposing diamond crystals on the treated carbide substrate; disposing a sweep material on the diamond crystals on a surface of the diamond opposite the carbide substrate; and applying high temperature and pressure to the carbide substrate, the diamond crystals and the sweep material such that the diamond crystals are sintered into a polycrystalline diamond attached to the carbide substrate to form the polycrystalline diamond compact.
    Type: Application
    Filed: January 31, 2013
    Publication date: July 31, 2014
    Applicant: DIAMOND INNOVATIONS, INC.
    Inventors: Abhijit Suryavanshi, Anshul Singh
  • Publication number: 20130020133
    Abstract: A method of prolonging the life of a PDC cutter having a substantially cylindrical shape centered about a rotational axis, and an apparatus for multi-axis modulation of a PDC cutter, the method including imparting linear modulation to the cutter in at least one direction and imparting rotary modulation to the cutter about the rotational axis, the rotary modulation being synchronized with, and facilitated by, the linear modulation.
    Type: Application
    Filed: July 18, 2012
    Publication date: January 24, 2013
    Applicant: DIAMOND INNOVATIONS, INC.
    Inventors: Steven W. Webb, Abhijit Suryavanshi
  • Publication number: 20120255238
    Abstract: The present disclosure provides methods for preparing a silicon bonded PCD material involving a one step, double sweep process.
    Type: Application
    Filed: April 6, 2012
    Publication date: October 11, 2012
    Applicant: DIAMOND INNOVATIONS, INC.
    Inventor: Abhijit Suryavanshi