Patents by Inventor Abhijit Y. Desai

Abhijit Y. Desai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CARRIER HEAD MEMBRANE WITH A BEAD
    Publication number: 20200381286
    Abstract: A method and apparatus for planarizing a substrate are provided. A substrate carrier head with an improved cover for holding the substrate securely is provided. The cover may have a bead that is larger than the recess into which it fits, such that the compression forms a conformal seal inside the recess. The bead may also be left uncoated to enhance adhesion of the bead to the surface of the groove. The surface of the cover may be roughened to reduce adhesion of the substrate to the cover without using a non-stick coating.
    Type: Application
    Filed: August 5, 2020
    Publication date: December 3, 2020
    Inventors: Young J. Paik, Melvin Barrentine, Abhijit Y. Desai, Hai Nguyen, Ashish Bhatnagar, Rajkumar Alagarsamy
  • CARRIER HEAD MEMBRANE WITH A BEAD
    Publication number: 20170243779
    Abstract: A method and apparatus for planarizing a substrate are provided. A substrate carrier head with an improved cover for holding the substrate securely is provided. The cover may have a bead that is larger than the recess into which it fits, such that the compression forms a conformal seal inside the recess. The bead may also be left uncoated to enhance adhesion of the bead to the surface of the groove. The surface of the cover may be roughened to reduce adhesion of the substrate to the cover without using a non-stick coating.
    Type: Application
    Filed: May 10, 2017
    Publication date: August 24, 2017
    Applicant: Applied Materials, Inc.
    Inventors: Young J. Paik, Melvin Barrentine, Abhijit Y. Desai, Hai Nguyen, Ashish Bhatnagar, Rajkumar Alagarsamy
  • Carrier Head Membrane
    Publication number: 20090242125
    Abstract: A method and apparatus for planarizing a substrate are provided. A substrate carrier head with an improved cover for holding the substrate securely is provided. The cover may have a bead that is larger than the recess into which it fits, such that the compression forms a conformal seal inside the recess. The bead may also be left uncoated to enhance adhesion of the bead to the surface of the groove. The surface of the cover may be roughened to reduce adhesion of the substrate to the cover without using a non-stick coating.
    Type: Application
    Filed: March 23, 2009
    Publication date: October 1, 2009
    Inventors: Young J. Paik, Melvin Barrentine, Abhijit Y. Desai, Hai Nguyen, Ashish Bhatnagar, Rajkumar Alagarsamy