Abstract: A thermoacoustic cooling system for cooling an object such as a microelectronic chip. Heat produced by the object may be transferred to a thermoacoustic engine. The thermoacoustic engine may include a resonator defining a chamber. A stack may be positioned in the chamber with one side of the stack adjacent to the heat source, and the opposite side of the stack adjacent to air in the chamber having a relatively cooler temperature. One or more orifices may be formed in the resonator such that the acoustic power generated by the thermoacoustic engine may create a synthetic jet to circulate air and move the air away from the object being cooled. A guide member may be placed in the orifice to promote circulation of air in the chamber. The heat produced by the object may be used to power the thermoacoustic engine to thereby remove heat from the object.