Patents by Inventor Adam L. Cohen

Adam L. Cohen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8613846
    Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.
    Type: Grant
    Filed: October 18, 2010
    Date of Patent: December 24, 2013
    Assignee: Microfabrica Inc.
    Inventors: Ming Ting Wu, Rulon Joseph Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard, Dennis R. Smalley
  • Patent number: 8603316
    Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: December 10, 2013
    Assignee: University of Southern California
    Inventor: Adam L. Cohen
  • Patent number: 8556825
    Abstract: Some embodiments of the invention provide an instrument for mechanically removing segments of tissue from a patient during a minimally invasive surgical procedure. An exemplary instrument provides an inlet for receiving tissue a mechanism for cutting away received tissue and for simultaneously moving the cut away tissue away from the inlet to allow additional material to enter the inlet for removal wherein multiple specimens can be captured and eventually removed from the patient's body without the need of removing the instrument after each capture.
    Type: Grant
    Filed: October 11, 2011
    Date of Patent: October 15, 2013
    Assignee: Microfabrica Inc.
    Inventor: Adam L. Cohen
  • Patent number: 8551315
    Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: October 8, 2013
    Assignee: University of Southern California
    Inventor: Adam L. Cohen
  • Patent number: 8551314
    Abstract: Various embodiments of the invention are directed to formation of mesoscale or microscale devices using electrochemical fabrication techniques where structures are formed from a plurality of layers as opened structures which can be folded over or other otherwise combined to form structures of desired configuration. Each layer is formed from at least one structural material and at least one sacrificial material. The initial formation of open structures may facilitate release of the sacrificial material, ability to form fewer layers to complete a structure, ability to locate additional materials into the structure, ability to perform additional processing operations on regions exposed while the structure is open, and/or the ability to form completely encapsulated and possibly hollow structures.
    Type: Grant
    Filed: November 3, 2009
    Date of Patent: October 8, 2013
    Assignee: Microfabrica Inc.
    Inventors: Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley
  • Publication number: 20130226209
    Abstract: The present invention relates generally to the field of micro-scale or millimeter scale devices and to the use of multi-layer multi-material electrochemical fabrication methods for producing such devices with particular embodiments relate to shredding devices and more particularly to shredding devices for use in medical applications. In some embodiments, tissue removal devices include tissue anchoring projections, improved blade configurations, and/or shields or shrouds around the cutting blades to inhibit outflow of tissue that has been brought into the device.
    Type: Application
    Filed: April 9, 2013
    Publication date: August 29, 2013
    Inventors: Michael S. Lockard, Uri Frodis, Adam L. Cohen, Richard T. Chen, Pierre E. Dupont, Pedro J. Del Nido, Nikolay V. Vasilyev
  • Patent number: 8512861
    Abstract: Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.
    Type: Grant
    Filed: December 13, 2011
    Date of Patent: August 20, 2013
    Assignee: Microfabrica Inc.
    Inventors: Michael S. Lockard, Adam L. Cohen, Vacit Arat, Dennis R. Smalley
  • Patent number: 8512578
    Abstract: Multi-layer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surrounds the desired structure. After structure formation, the sacrificial material is removed by a multi-stage etching operation. In some embodiments sacrificial material to be removed may be located within passages or the like on a substrate or within an add-on component. The multi-stage etching operations may be separated by intermediate post processing activities, they may be separated by cleaning operations, or barrier material removal operations, or the like. Barriers may be fixed in position by contact with structural material or with a substrate or they may be solely fixed in position by sacrificial material and are thus free to be removed after all retaining sacrificial material is etched.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: August 20, 2013
    Assignee: Microfabrica Inc.
    Inventors: Adam L. Cohen, Michael S. Lockard, Dale S. McPherson
  • Patent number: 8475458
    Abstract: The present invention relates generally to the field of micro-scale or millimeter scale devices and to the use of multi-layer multi-material electrochemical fabrication methods for producing such devices with particular embodiments relate to shredding devices and more particularly to shredding devices for use in medical applications. In some embodiments, tissue removal devices are used in procedures to removal spinal tissue and in other embodiments, similar devices are used to remove thrombus from blood vessel.
    Type: Grant
    Filed: June 23, 2009
    Date of Patent: July 2, 2013
    Assignee: Microfabrica Inc.
    Inventors: Michael S. Lockard, Uri Frodis, Adam L. Cohen, Richard T. Chen, Ming Ting Wu, Gregory P. Schmitz, Eric C. Miller
  • Patent number: 8460205
    Abstract: The invention includes a forceps and collection assembly for acquiring and storing a plurality of tissue samples in a single pass, and accompanying mechanisms for use with the forceps and collection assembly. The accompanying mechanisms include an endoscope working channel cap assembly configured to minimize compression of a pouch of the forceps and collection assembly as it traverses a seal of the cap assembly, and a flush adapter configured to be coupled to the pouch so as to assist in removing tissue samples in the pouch by flowing fluid through the pouch.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: June 11, 2013
    Assignee: Boston Scientific Scimed, Inc.
    Inventors: Adam L. Cohen, John B. Golden, Liem T. Vu
  • Patent number: 8454652
    Abstract: Embodiments of invention are directed to tissue approximation instruments that may be delivered to the body of a patient during minimally invasive or other surgical procedures. In one group of embodiments, the instruments have an elongated configuration with two sets of expandable wings that each have spreadable wings that can be made to expand when located on opposite sides of a distal tissue region and a proximal tissue region and can then be made to move toward one another to bring the two tissue regions into a more proximate position. The instrument is delivered through a needle or catheter and is controlled by relative movement of a push tube and control wire wherein the control wire can be released from the instrument via rotation in a first direction and can cause release of the approximation device from tissue that it is holding by rotation in the opposite direction.
    Type: Grant
    Filed: December 31, 2009
    Date of Patent: June 4, 2013
    Inventors: Adam L. Cohen, Christopher R. Folk
  • Patent number: 8414607
    Abstract: The present invention relates generally to the field of micro-scale or millimeter scale devices and to the use of multi-layer multi-material electrochemical fabrication methods for producing such devices with particular embodiments relate to shredding devices and more particularly to shredding devices for use in medical applications. In some embodiments, tissue removal devices include tissue anchoring projections, improved blade configurations, and/or shields or shrouds around the cutting blades to inhibit outflow of tissue that has been brought into the device.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: April 9, 2013
    Assignees: Microfabrica Inc., Trustees of Boston University, Children's Hospital Boston
    Inventors: Michael S. Lockard, Uri Frodis, Adam L. Cohen, Richard T. Chen, Pierre E. Dupont, Pedro J. Del Nido, Nikolay V. Vasilyev
  • Patent number: 8382423
    Abstract: Embodiments are directed to micro-scale or meso-scale devices having hydraulic or pneumatic actuation mechanisms incorporating bearings elements (such as ball bearings, cylindrical bearings, interference bearings, or hydrostatic bearings. Devices of some embodiments are turbines. Some devices may function as medical devices. Other embodiments are directed to multi-layer, multi-material electrochemical fabrication methods for producing such devices.
    Type: Grant
    Filed: July 7, 2008
    Date of Patent: February 26, 2013
    Assignee: Microfabrica Inc.
    Inventors: Uri Frodis, Adam L. Cohen, Michael S. Lockard
  • Publication number: 20120234688
    Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
    Type: Application
    Filed: April 6, 2012
    Publication date: September 20, 2012
    Inventor: Adam L. Cohen
  • Publication number: 20120228143
    Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
    Type: Application
    Filed: April 6, 2012
    Publication date: September 13, 2012
    Inventor: Adam L. Cohen
  • Patent number: 8262916
    Abstract: Embodiments of the invention are directed to multi-layer, multi-material fabrication methods (e.g. electrochemical fabrication methods) which provide improved versatility in producing complex microdevices and in particular in removing sacrificial material from passages, channels, or cavities that are complex or that include etching access ports in their final configurations that are small relative to passage, channel, or cavity lengths. Embodiments of the present invention provide for removal of sacrificial material from these passages, channels or cavities using one or more initial or preliminary removal steps that occur prior to completion of the such passages that results from the completion of the layer forming steps. In some embodiments, first sacrificial material is replaced after a secondary solid sacrificial material after the initial removal step or steps. In other embodiments, the first sacrificial material is replaced after a liquid material after the initial removal step or steps.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: September 11, 2012
    Assignee: Microfabrica Inc.
    Inventors: Dennis R. Smalley, Michael S. Lockard, Adam L. Cohen
  • Publication number: 20120222960
    Abstract: Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.
    Type: Application
    Filed: March 1, 2012
    Publication date: September 6, 2012
    Inventors: Ananda H. Kumar, Jorge Sotelo Albarran, Adam L. Cohen, Kieun Kim, Michael S. Lockard, Uri Frodis, Dennis R. Smalley
  • Patent number: 8257573
    Abstract: Multi-layer fabrication methods (e.g. electrochemical fabrication methods) for forming microscale and mesoscale devices or structures (e.g. turbines) provide bushings or roller bearing that allow rotational or linear motion which is constrained by multiple structural elements spaced from one another by gaps that are effectively less than minimum features sizes associated with the individual layers used to form the structures. In some embodiments, features or protrusions formed on different layers on opposing surfaces are offset along the axis of layer stacking so as to bring the features into positions that are closer than allowed by the minimum features sizes associated with individual layers. In other embodiments, interference is used to create effective spacings that are less than the minimum features sizes.
    Type: Grant
    Filed: September 23, 2009
    Date of Patent: September 4, 2012
    Assignee: Microfabrica Inc.
    Inventor: Adam L. Cohen
  • Patent number: 8241228
    Abstract: Embodiments are directed to micro-scale or meso-scale hydraulically or pneumatically actuated devices, methods for forming such devices using multi-layer, multi-material electrochemical fabrication methods and particularly fabricating (i.e. building up) a plurality of components of devices that are moveable relative to one another in pre-assembled configurations wherein special features are designed into the devices (e.g. wide gaps in fabrication positions and narrowed gaps in working regions of component movement, mechanisms that inhibit the return of device components to fabrication positions after being moved into working regions, used of cylindrical interference and/or checkerboard bushings, etching holes in selected locations to allow removal of sacrificial material) to allow such fabrication to occur without violating intra-layer minimum feature size constraints while still obtaining effective gaps between components that are smaller than the minimum features size limits.
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: August 14, 2012
    Assignee: Microfabrica Inc.
    Inventors: Adam L. Cohen, Chris R. Folk, Richard T. Chen, Dennis R. Smalley
  • Patent number: 8231525
    Abstract: The invention relates to an endoscope channel cap that may be used separately with two or more endoscopes each having a cap interface portion with a different configuration. The channel cap also may include one or more seals to maintain insufflation pressure both when an endoscopic instrument is inserted in a working channel of the endoscope and when the instrument is not inserted in the channel.
    Type: Grant
    Filed: December 29, 2005
    Date of Patent: July 31, 2012
    Assignee: Boston Scientific Scimed, Inc.
    Inventors: Adam L. Cohen, John Golden, Liem T. Vu