Patents by Inventor Adam Theron Winter

Adam Theron Winter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-power electronic devices containing metal nanoparticle-based thermal interface materials and related methods
    Patent number: 9190342
    Abstract: High-power electronic components generate significant amounts of heat that must be removed in the course of normal device operations. Certain types of electronic components, such as some monolithic microwave integrated circuits and LEDs, can contain materials that are difficult to effectively bond to a heat gink in order to establish a thermal interface between the two. Device assemblies can include a heat-generating electronic component in thermal communication with a metallic heat sink via a metallic thermal interface layer. The metallic thermal interface layer is disposed between the heat-generating electronic component and the metallic heat sink. The metallic thermal interface layer is formed from a composition including a plurality of metal nanoparticles that are at least partially fused together with one another.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: November 17, 2015
    Assignee: Lockheed Martin Corporation
    Inventors: Arthur Paolella, Adam Theron Winter, David S. Degler, Alfred A. Zinn, Susan Patricia Ermer
  • HIGH-POWER ELECTRONIC DEVICES CONTAINING METAL NANOPARTICLE-BASED THERMAL INTERFACE MATERIALS AND RELATED METHODS
    Publication number: 20150054020
    Abstract: High-power electronic components generate significant amounts of heat that must be removed in the course of normal device operations. Certain types of electronic components, such as some monolithic microwave integrated circuits and LEDs, can contain materials that are difficult to effectively bond to a heat gink in order to establish a thermal interface between the two. Device assemblies can include a heat-generating electronic component in thermal communication with a metallic heat sink via a metallic thermal interface layer. The metallic thermal interface layer is disposed between the heat-generating electronic component and the metallic heat sink. The metallic thermal interface layer is formed from a composition including a plurality of metal nanoparticles that are at least partially fused together with one another.
    Type: Application
    Filed: August 22, 2014
    Publication date: February 26, 2015
    Inventors: Arthur PAOLELLA, Adam Theron Winter, David S. Degler, Alfred A. Zinn, Susan Patricia Ermer