Patents by Inventor Adan Diaz

Adan Diaz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shock tolerant heat dissipating electronics package
    Patent number: 9404357
    Abstract: An electronics package of substantially monolithic configuration. The package is particularly adept at enhancing heat dissipation and avoiding secondary shock when placed in harsh application environments. Thus, the package may be particularly well suited for use in conjunction with high shock producing downhole application environments such as bridge plug setting.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: August 2, 2016
    Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: Ruben Martinez, Adan Diaz
  • Shock Tolerant Heat Dissipating Electronics Package
    Publication number: 20130025886
    Abstract: An electronics package of substantially monolithic configuration. The package is particularly adept at enhancing heat dissipation and avoiding secondary shock when placed in harsh application environments. Thus, the package may be particularly well suited for use in conjunction with high shock producing downhole application environments such as bridge plug setting.
    Type: Application
    Filed: December 22, 2010
    Publication date: January 31, 2013
    Applicant: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: Ruben Martinez, Adan Diaz