Abstract: There is provided a thermally conductive silicone composition including a silicone matrix and a heat transfer filler, and a thermal paste obtainable by mixing and/or curing the composition components. Further provided is an electronic device or component including the thermal paste. The silicone matrix includes a polyorganosiloxane containing two silicon-bonded terminal alkenyl groups per molecule, trimethylsiloxane terminated (methylhydrosiloxane-dimethylsiloxane) copolymer, and a trimethylsiloxy terminated polydimethylsiloxane that is present in a weight percent of at least about 20 wt. %, based on the total weight of the silicone matrix. The heat transfer filler contains a ceramic powder having a thermal conductivity of at least about 10 W/mK and the weight ratio between the heat transfer filler and the silicone matrix is above 11:1.

Abstract: A system for differential recording connectable to an electrical lead with at least two electrodes, including: the lead having a distal end; at least one amplifier electrically connectable to the at least two electrodes, wherein the at least one amplifier subtracts a signal recorded by one of the at least two electrodes, from a signal recorded by the other one of the at least two electrodes to generate a differential signal; a memory configured for storing said differential signal and reference indications of electrical signals associated with neural tissue; a processing circuitry for detection of an anatomical position, wherein the processing circuitry calculates an anatomical position of the electrical lead based on processing of the differential signal and the reference indications of electrical signals associated with the neural tissue.

Abstract: An apparatus of a junction box component housed in a junction box and designed to be coupled to a power generator. The junction box component may include one or more bypass mechanisms configured to bypass one or more substrings of the power generator in a case of malfunction or mismatch between the substring and the remainder of the power generators. The one or more bypass mechanisms may generate heat which may be transferred out of the junction box. The junction box component may be designed to conduct the heat towards the base of the junction box and/or the cover of the junction box. A heat dissipation mechanism may be mounted on the base and/or the cover. A bypass mechanism may bypass the entire power generator.

Abstract: An apparatus of a junction box component housed in a junction box and designed to be coupled to a power generator. The junction box component may include one or more bypass mechanisms configured to bypass one or more substrings of the power generator in a case of malfunction or mismatch between the substring and the remainder of the power generators. The one or more bypass mechanisms may generate heat which may be transferred out of the junction box. The junction box component may be designed to conduct the heat towards the base of the junction box and/or the cover of the junction box. A heat dissipation mechanism may be mounted on the base and/or the cover. A bypass mechanism may bypass the entire power generator.

Abstract: An apparatus of a junction box component housed in a junction box and designed to be coupled to a power generator. The junction box component may include one or more bypass mechanisms configured to bypass one or more substrings of the power generator in a case of malfunction or mismatch between the substring and the remainder of the power generators. The one or more bypass mechanisms may generate heat which may be transferred out of the junction box. The junction box component may be designed to conduct the heat towards the base of the junction box and/or the cover of the junction box. A heat dissipation mechanism may be mounted on the base and/or the cover. A bypass mechanism may bypass the entire power generator.

Abstract: An apparatus of a junction box component housed in a junction box and designed to be coupled to a power generator. The junction box component may include one or more bypass mechanisms configured to bypass one or more substrings of the power generator in a case of malfunction or mismatch between the substring and the remainder of the power generators. The one or more bypass mechanisms may generate heat which may be transferred out of the junction box. The junction box component may be designed to conduct the heat towards the base of the junction box and/or the cover of the junction box. A heat dissipation mechanism may be mounted on the base and/or the cover. A bypass mechanism may bypass the entire power generator.

Abstract: A bobbin, which may comprise a hollow cylindrical shell, wherein the hollow cylindrical shell may define or otherwise comprise an inner cavity. The bobbin may comprise one or more flanges located near an end of the hollow cylindrical shell, wherein the flange(s) extends, at least in part, radially away from the inner cavity, wherein the flange(s) comprises a region of partial conductivity.

Abstract: An apparatus of a junction box component housed in a junction box and designed to be coupled to a power generator. The junction box component may include one or more bypass mechanisms configured to bypass one or more substrings of the power generator in a case of malfunction or mismatch between the substring and the remainder of the power generators. The one or more bypass mechanisms may generate heat which may be transferred out of the junction box. The junction box component may be designed to conduct the heat towards the base of the junction box and/or the cover of the junction box. A heat dissipation mechanism may be mounted on the base and/or the cover. A bypass mechanism may bypass the entire power generator.

Abstract: A rhenium (Re) nanostructure is described. The rhenium nanostructure is an elongated nanostructure, such as, nanowire, nanorod, nanotube, branched nanostructure, and hollow nanostructure. The Re nanostructure may be a binary Re-metal nanotube, a binary Re-metal nanowire, and a binary Re-metal nanorod. The binary Re-metal nanostructure is a nanostructure composed of Re and at least one metal or non-metal. The metal may be In, Sn, Sb, Pb, and/or Bi. The nanostructure is in powder or in liquid form.

Abstract: The present invention provides atomic Re nanostructures selected from binary Re-metal nanotubes, binary Re-metal nanowires, binary Re-metal nanorods, Re branched nanostructures, and hollow Re nanostructures.