Abstract: Disclosed herein is a magnetic storage device that comprises a suspension arm co-movably fixed to a carriage arm. The suspension arm comprises a slider attachment side and at least one first electrical contact pad on the slider attachment side. The suspension arm also comprises a slider co-movably fixed to the suspension arm. The slider comprises a suspension attachment side, a non-head side facing the suspension arm and intersecting the suspension attachment side at a first slider edge of the slider, a head side facing away from the suspension arm, and at least one electrical contact component on the suspension attachment side up to the first slider edge. At least one solder weldment is directly coupled to the at least one first electrical contact pad and the at least one electrical contact component. Additionally, a read-write head is coupled to the head side of the slider.

Abstract: Disclosed herein is a magnetic storage device that comprises a suspension arm co-movably fixed to a carriage arm. The suspension arm comprises a slider attachment side and at least one first electrical contact pad on the slider attachment side. The suspension arm also comprises a slider co-movably fixed to the suspension arm. The slider comprises a suspension attachment side, a non-head side facing the suspension arm and intersecting the suspension attachment side at a first slider edge of the slider, a head side facing away from the suspension arm, and at least one electrical contact component on the suspension attachment side up to the first slider edge. At least one solder weldment is directly coupled to the at least one first electrical contact pad and the at least one electrical contact component. Additionally, a read-write head is coupled to the head side of the slider.

Abstract: Examples of a magnetic recording head slider, a head gimbal assembly and methods of manufacturing each are disclosed. The magnetic recording head slider may comprise a slider body and a plurality of bond pads formed on a trailing edge of the slider body. Each of the plurality of bond pads may include a probe contact area and a soldering contact area. The probe contact area may be larger than the soldering contact area. The head gimbal assembly may include a suspension arm with conductive leads. A plurality of bond pads may be formed on the suspension arm in contact with the ends of the conductive leads. A width of a proximal portion of each of the bond pads may be greater than a width of a distal portion of each of the plurality of bond pads. The methods may include forming the above-described structures.

Abstract: A method for manufacturing a magnetic recording head slider is disclosed. A plurality of bond pads are formed in a linear arrangement adjacent one another on a trailing edge of a slider body. Each of the plurality of bond pads comprises a probe contact area and a soldering contact area with each area being laterally bounded in a width dimension, along the trailing edge, by respective edges of the pads wherein a width of the probe contact area is greater than a width of the soldering contact area of each respective pad whereby the probe contact area is larger than the soldering contact area.

Abstract: A laminated structure includes a metallic layer, a dielectric layer on the metallic layer, wherein the dielectric layer and metallic layer have a slot formed therein, and one or more conductive traces on the dielectric layer opposite the metallic layer, wherein the ends of the one or more traces terminate to form bonding pads extending into the slot. A method of forming a slotted laminated structure includes forming a metallic layer, forming a dielectric layer on the metallic layer, forming a slot in the dielectric layer and metallic layer, and forming one or more electrically conductive traces on the dielectric layer opposite the metallic layer, wherein ends of the one or more traces are formed to terminate with bonding pads extending into the slot.

Abstract: Examples of a magnetic recording head slider, a head gimbal assembly and methods of manufacturing each are disclosed. The magnetic recording head slider may comprise a slider body and a plurality of bond pads formed on a trailing edge of the slider body. Each of the plurality of bond pads may include a probe contact area and a soldering contact area. The probe contact area may be larger than the soldering contact area. The head gimbal assembly may include a suspension arm with conductive leads. A plurality of bond pads may be formed on the suspension arm in contact with the ends of the conductive leads. A width of a proximal portion of each of the bond pads may be greater than a width of a distal portion of each of the plurality of bond pads. The methods may include forming the above-described structures.

Abstract: Systems and methods for pre-heating adjacent bond pads for soldering are provided. In one embodiment, the invention relates to a method for soldering adjacent bond pads, the method including directing an ultraviolet light beam onto the bond pads from a first angle relative to the bond pads for a preselected duration, heating a solder, and depositing the solder onto the bond pads from a second angle relative to the bond pads during the preselected duration, wherein the second angle is different from the first angle.

Abstract: Systems for interconnecting magnetic heads of storage devices in a test assembly are provided. In one embodiment, the invention relates to a probe assembly for coupling a read head to a cavity gimbal assembly, the probe assembly including a plurality of conductive probes each including a body section including two substantially flat side surfaces and a bottom surface including a pad configured to be soldered to a corresponding pad of a laminated flexure of the cavity gimbal assembly, a spring section including an elongated arm extending away from the body section, the elongated arm shaped to make conductive contact with a pad on a trailing face of the read head, and a non-conductive adhesive layer attached to at least one of the two side surfaces, where each of the plurality of the conductive probes is attached to an adjacent one of the conductive probes by one of the adhesive layers.