Patents by Inventor Adolf E. Wirsing
Adolf E. Wirsing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7288492Abstract: A method of forming a semiconductor interconnect including, in the order recited: (a) providing a semiconductor wafer; (b) forming bonding pads in a terminal wiring level on the frontside of the wafer; (c) reducing the thickness of the wafer; (d) forming solder bumps on the bonding pads; and (e) dicing the wafer into bumped semiconductor chips.Type: GrantFiled: July 19, 2005Date of Patent: October 30, 2007Assignee: International Business Machines CorporationInventors: Leonard J. Gardecki, James R. Palmer, Erik M. Probstfield, Adolf E. Wirsing
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Patent number: 7138326Abstract: A shadow mask for depositing solder bumps includes additional dummy holes located adjacent holes corresponding to most of the perimeter chips of the wafer. The additional dummy provide more uniform plasma etching of contacts of the wafer, improve etching of contacts of perimeter chips, and lower contact resistance of contacts of perimeter chips. The extra holes also provide solder bumps outside the perimeter chips that can be used to support a second shadow mask for deposition of an additional material, such as tin, on the reflowed solder bumps for mounting the chips on a plastic substrate at low temperature. An improved mask to wafer alignment aid is formed from standard solder bumps. The improved alignment aid avoids damage to test probes and provides improved course alignment.Type: GrantFiled: July 23, 2003Date of Patent: November 21, 2006Assignee: International Business Machines Corp.Inventors: Harry D. Cox, David P. Daniel, Leonard J. Gardecki, Albert J. Gregoritsch, III, Ruth A. Machell Julianelle, Charles H. Keeler, Doris P. Pulaski, Mary A. Schaffer, David L. Smith, David J. Specht, Adolf E. Wirsing
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Patent number: 6951775Abstract: A method of forming a semiconductor interconnect including, in the order recited: (a) providing a semiconductor wafer; (b) forming bonding pads in a terminal wiring level on the frontside of the wafer; (c) reducing the thickness of the wafer; (d) forming solder bumps on the bonding pads; and (e) dicing the wafer into bumped semiconductor chips.Type: GrantFiled: June 28, 2003Date of Patent: October 4, 2005Assignee: International Business Machines CorporationInventors: Leonard J. Gardecki, James R. Palmer, Erik M. Probstfield, Adolf E. Wirsing
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Publication number: 20040266159Abstract: A method of forming a semiconductor interconnect including, in the order recited: (a) providing a semiconductor wafer; (b) forming bonding pads in a terminal wiring level on the frontside of the wafer; (c) reducing the thickness of the wafer; (d) forming solder bumps on the bonding pads; and (e) dicing the wafer into bumped semiconductor chips.Type: ApplicationFiled: June 28, 2003Publication date: December 30, 2004Applicant: International Business Machines CorporationInventors: Leonard J Gardecki, James R Palmer, Erik M Probstfield, Adolf E Wirsing
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Publication number: 20040135233Abstract: A shadow mask for depositing solder bumps includes additional dummy holes located adjacent holes corresponding to most of the perimeter chips of the wafer. The additional dummy provide more uniform plasma etching of contacts of the wafer, improve etching of contacts of perimeter chips, and lower contact resistance of contacts of perimeter chips. The extra holes also provide solder bumps outside the perimeter chips that can be used to support a second shadow mask for deposition of an additional material, such as tin, on the reflowed solder bumps for mounting the chips on a plastic substrate at low temperature. An improved mask to wafer alignment aid is formed from standard solder bumps. The improved alignment aid avoids damage to test probes and provides improved course alignment.Type: ApplicationFiled: July 23, 2003Publication date: July 15, 2004Inventors: Harry D. Cox, David P. Daniel, Leonard J. Gardecki, Albert J. Gregoritsch, Ruth A. Machell Julianelle, Charles H. Keeler, Doris P. Pulaski, Mary A. Schaffer, David L. Smith, David J. Specht, Adolf E. Wirsing
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Patent number: 6706621Abstract: A shadow mask for depositing solder bumps includes additional dummy holes located adjacent holes corresponding to most of the perimeter chips of the wafer. The additional dummy provide more uniform plasma etching of contacts of the wafer, improve etching of contacts of perimeter chips, and lower contact resistance of contacts of perimeter chips. The extra holes also provide solder bumps outside the perimeter chips that can be used to support a second shadow mask for deposition of an additional material, such as tin, on the reflowed solder bumps for mounting the chips on a plastic substrate at low temperature. An improved mask to wafer alignment aid is formed from standard solder bumps. The improved alignment aid avoids damage to test probes and provides improved course alignment.Type: GrantFiled: November 22, 2002Date of Patent: March 16, 2004Assignee: International Business Machines CorporationInventors: Harry D. Cox, David P. Daniel, Leonard J. Gardecki, Albert J. Gregoritsch, III, Ruth A. Machell Julianelle, Charles H. Keeler, Doris P. Pulaski, Mary A. Schaffer, David L. Smith, David J. Specht, Adolf E. Wirsing
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Publication number: 20030071329Abstract: A shadow mask for depositing solder bumps includes additional dummy holes located adjacent holes corresponding to most of the perimeter chips of the wafer. The additional dummy provide more uniform plasma etching of contacts of the wafer, improve etching of contacts of perimeter chips, and lower contact resistance of contacts of perimeter chips. The extra holes also provide solder bumps outside the perimeter chips that can be used to support a second shadow mask for deposition of an additional material, such as tin, on the reflowed solder bumps for mounting the chips on a plastic substrate at low temperature. An improved mask to wafer alignment aid is formed from standard solder bumps. The improved alignment aid avoids damage to test probes and provides improved course alignment.Type: ApplicationFiled: November 22, 2002Publication date: April 17, 2003Applicant: International Business Machines CorporationInventors: Harry D. Cox, David P. Daniel, Leonard J. Gardecki, Albert J. Gregoritsch, Ruth A. Machell Julianelle, Charles H. Keeler, Doris P. Pulaski, Mary A. Schaffer, David L. Smith, David J. Specht, Adolf E. Wirsing
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Patent number: 5457345Abstract: A metallization composite comprises a refractory metal, nickel, and copper. The refractory metal is preferably titanium (Ti), but other suitable refractory metals such as zirconium and hafnium can also be utilized. An additional optional layer of gold can overlie the copper. The metallization composite is used to connect a solder contact to a semiconductor substrate.Type: GrantFiled: January 14, 1994Date of Patent: October 10, 1995Assignee: International Business Machines CorporationInventors: Herbert C. Cook, Paul A. Farrar, Sr., Robert M. Geffken, William T. Motsiff, Adolf E. Wirsing
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Patent number: 5251806Abstract: The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.Type: GrantFiled: April 16, 1992Date of Patent: October 12, 1993Assignee: International Business Machines CorporationInventors: Birendra N. Agarwala, Aziz M. Ahsan, Arthur Bross, Mark F. Chadurjian, Nicholas G. Koopman, Li-Chung Lee, Karl J. Puttlitz, Sudipta K. Ray, James G. Ryan, Joseph G. Schaefer, Kamalesh K. Srivastava, Paul A. Totta, Erick G. Walton, Adolf E. Wirsing
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Patent number: 5130779Abstract: The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.Type: GrantFiled: June 19, 1990Date of Patent: July 14, 1992Assignee: International Business Machines CorporationInventors: Birendra N. Agarwala, Aziz M. Ahsan, Arthur Bross, Mark F. Chadurjian, Nicholas G. Koopman, Li-Chung Lee, Karl J. Puttlitz, Sudipta K. Ray, James G. Ryan, Joseph G. Schaefer, Kamalesh K. Srivastava, Paul A. Totta, Erick G. Walton, Adolf E. Wirsing
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Patent number: 5104695Abstract: A method and apparatus for depositing the material onto a substrate is provided. The apparatus includes a mesh member which has impregnated therein the material which is to be vapor deposited. The mesh member with the material thereon is heated to vaporize the material and the vaporized material is then deposited onto the desired substrate. Preferably the material that is deposited is maintained in a crucible having an opening and the mesh member is disposed over the opening. The material in the crucible is vaporized and condensed onto the mesh member, and the condensed material wicks through the mesh member and then revaporizes from the top of the mesh member and is deposited onto the substrates.Type: GrantFiled: September 8, 1989Date of Patent: April 14, 1992Assignee: International Business Machines CorporationInventors: Stuart E. Greer, Eric E. Millham, Adolf E. Wirsing