Patents by Inventor Adrian ALTING-MEES

Adrian ALTING-MEES has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9933295
    Abstract: A monitoring system includes a plurality of modules to sense temperature and vibrations of a motor assembly, a hub computer to collect the sensed temperature and vibrations, and an analyzer computer to analyze the collected temperature and vibrations. The modules contain detectors that measure a temperature and vibrations in three axes of the motor assembly, a transceiver integrated circuit that measures a die temperature of the transceiver integrated circuit, a microcontroller integrated circuit that self-adjusts its clock pulses, and a memory that stores parameters set for the operation of the modules. The microcontroller integrated circuit and the memory are configured to check parameters corruption upon transferring the parameters from the memory to the microcontroller integrated circuit and prior to utilizing by the microcontroller integrated circuit.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: April 3, 2018
    Assignee: TDG AEROSPACE, INC.
    Inventors: Daniel E. Fish, David L. Evans, Todd B. Skinner, Andrew Wagner, Adrian Alting-Mees
  • Publication number: 20160370223
    Abstract: A monitoring system includes a plurality of modules to sense temperature and vibrations of a motor assembly, a hub computer to collect the sensed temperature and vibrations, and an analyzer computer to analyze the collected temperature and vibrations. The modules contain detectors that measure a temperature and vibrations in three axes of the motor assembly, a transceiver integrated circuit that measures a die temperature of the transceiver integrated circuit, a microcontroller integrated circuit that self-adjusts its clock pulses, and a memory that stores parameters set for the operation of the modules. The microcontroller integrated circuit and the memory are configured to check parameters corruption upon transferring the parameters from the memory to the microcontroller integrated circuit and prior to utilizing by the microcontroller integrated circuit.
    Type: Application
    Filed: September 6, 2016
    Publication date: December 22, 2016
    Applicant: TDG AEROSPACE, INC.
    Inventors: Daniel E. FISH, David L. EVANS, Todd B. SKINNER, Andrew WAGNER, Adrian ALTING-MEES
  • Patent number: 9435698
    Abstract: A monitoring system includes a plurality of modules to sense temperature and vibrations of a motor assembly, a hub computer to collect the sensed temperature and vibrations, and an analyzer computer to analyze the collected temperature and vibrations. The modules contain detectors that measure a temperature and vibrations in three axes of the motor assembly, a transceiver integrated circuit that measures a die temperature of the transceiver integrated circuit, a microcontroller integrated circuit that self-adjusts its clock pulses, and a memory that stores parameters set for the operation of the modules. The microcontroller integrated circuit and the memory are configured to check parameters corruption upon transferring the parameters from the memory to the microcontroller integrated circuit and prior to utilizing by the microcontroller integrated circuit.
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: September 6, 2016
    Assignee: TDG AEROSPACE, INC.
    Inventors: Daniel E. Fish, David L. Evans, Todd B. Skinner, Andrew Wagner, Adrian Alting-Mees
  • Publication number: 20150168268
    Abstract: A monitoring system includes a plurality of modules to sense temperature and vibrations of a motor assembly, a hub computer to collect the sensed temperature and vibrations, and an analyzer computer to analyze the collected temperature and vibrations. The modules contain detectors that measure a temperature and vibrations in three axes of the motor assembly, a transceiver integrated circuit that measures a die temperature of the transceiver integrated circuit, a microcontroller integrated circuit that self-adjusts its clock pulses, and a memory that stores parameters set for the operation of the modules. The microcontroller integrated circuit and the memory are configured to check parameters corruption upon transferring the parameters from the memory to the microcontroller integrated circuit and prior to utilizing by the microcontroller integrated circuit. The modules further have an enclosure that is compact in size and that can withstand severe industrial environment.
    Type: Application
    Filed: December 15, 2014
    Publication date: June 18, 2015
    Applicant: TDG AEROSPACE, INC.
    Inventors: Daniel E. FISH, David L. EVANS, Todd B. SKINNER, Andrew WAGNER, Adrian ALTING-MEES