Patents by Inventor Adrian Kriz

Adrian Kriz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WIPER SYSTEM
    Publication number: 20130002756
    Abstract: A wiping system is disclosed. The wiping system has a wiper blade and a web wipe. The wiper blade forms an angle with the surface to be cleaned. The wiper blade has a tip formed in the front end of the wiper blade. The wiper blade moves in a wiping direction with the front end leading the rest of the blade when the wiper blade is moving in the wiping direction. The web wipe is placed between the tip and the surface to be cleaned, with the web wipe contacting both the tip and the surface to be cleaned.
    Type: Application
    Filed: June 28, 2011
    Publication date: January 3, 2013
    Inventor: Adrian Kriz
  • Topography layer
    Patent number: 7585052
    Abstract: An inkjet print-head is formed by selectively disposing a first layer on a substrate. The first layer and the substrate form a topography. A second layer is selectively disposed over the substrate and the first layer. A third layer is disposed over the second layer. The second layer selectively disposed over the substrate and the first layer reduces a surface topography of the third layer.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: September 8, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Adrian Kriz, Bradley Chung
  • Topography layer
    Publication number: 20080024558
    Abstract: An inkjet print-head is formed by selectively disposing a first layer on a substrate. The first layer and the substrate form a topography. A second layer is selectively disposed over the substrate and the first layer. A third layer is disposed over the second layer. The second layer selectively disposed over the substrate and the first layer reduces a surface topography of the third layer.
    Type: Application
    Filed: July 28, 2006
    Publication date: January 31, 2008
    Inventors: Adrian Kriz, Bradley Chung
  • Semi-conductor wafer fabrication
    Publication number: 20050074907
    Abstract: A method of planarizing a semiconductor wafer includes applying a CMP process to a layer of dielectric material to planarize the wafer surface, and applying a plasma etching process to the wafer surface until a signal is generated from a detection layer that indicates that said detection layer has been removed from underlying features disposed on the water.
    Type: Application
    Filed: October 6, 2003
    Publication date: April 7, 2005
    Inventors: Adrian Kriz, Michael Monroe