Abstract: Systems and methods of testing integrated circuits are disclosed. The systems include a test module configured to operate between an automated testing equipment and an integrated circuit to be tested. The testing interface is configured to test the integrated circuit at a higher clock frequency than the automated testing equipment is configured to operate. In order to do so, the testing interface includes components configured for generating addresses and test data to be provided to the integrated circuit. A variety of test data patterns can be produced and the test data can be address dependent.

Abstract: A system is provided for communicating with a device within a packaged semiconductor device through a shared external terminal thereof. As one example, the system provides for testing a memory within the package. In addition to the device and the shared external terminal, the system includes a command register that receives a plurality of command signals, and digital logic devices coupled between the external terminal and the command register. Each of the digital logic devices receives a different clock signal and outputs one of the command signals to the command register. The command signals are provided to the external terminal in a sequence that is coordinated with the clock signals so that each digital logic device buffers one of the command signals.

Abstract: Systems and methods of testing integrated circuits are disclosed. The systems include a test module configured to operate between an automated testing equipment and an integrated circuit to be tested. The testing interface is configured to test the integrated circuit at a higher clock frequency than the automated testing equipment is configured to operate. In order to do so, the testing interface includes components configured for generating addresses and test data to be provided to the integrated circuit. A variety of test data patterns can be produced and the test data can be address dependent.

Abstract: In one embodiment, the present invention provides a platform of hardware and/or software that enables the complete access and reliable testing of multiple integrated circuit (IC) devices within a package. This platform may include a testing component (e.g., test circuits, test pads, shared pads, etc.), one or more probe cards and related hardware, wafer probe programs, load board and related hardware of external test equipment, and software and routines for final test programs.

Abstract: A first integrated circuit chip is provided for packaging along with at least a second integrated circuit chip in a semiconductor device, wherein at least some external terminals for the semiconductor device are to be shared by the first and the second integrated circuit chips, wherein the first integrated circuit chip is designed for normal operation and a test mode. The first integrated circuit chip includes up to eleven bonding pads for complete testing of the first integrated circuit chip, wherein the up to eleven bonding pads are for communicating TEST, SET, LOAD, and up to eight TDQ signals. The TEST, SET, and LOAD signals are operable to transition the first integrated circuit chip from normal operation into the test mode and to enable test codes to be loaded into the first integrated circuit chip during a programming phase of the test mode.

Abstract: In a first integrated circuit chip contained in a single package along with a second integrated circuit chip, a system includes circuitry on the first integrated circuit chip for receiving address signals from the second integrated circuit chip during normal operation. Circuitry on the first integrated circuit chip generates address signals for use in testing the first integrated chip in a test mode.

Abstract: A semiconductor memory chip is provided for packaging along with a system chip in a single semiconductor package having a plurality of external connectors. The memory chip includes a memory storage array for storing data. A plurality of data buffers is provided for writing or reading data between said memory storage array and the system chip within the single semiconductor package. A first power level may be used for each of the plurality of data buffers. At least one test buffer is directly connected to certain of said plurality of external connectors for supporting testing of said memory chip within the single semiconductor package by external test equipment. A second power level may be used for the test buffer.

Abstract: Method and apparatus are disclosed for checking the resistance of antifuse elements in an integrated circuit. A voltage based on the resistance of an antifuse element is compared to a voltage based on a known resistance, and an output signal is generated whose binary value indicates whether the resistance of the antifuse element is higher or lower than the known value of resistance. The method and apparatus are useful in verifying the programming of antifuse elements.

Abstract: A row repair system for replacing a defective primary memory row with a redundant memory row within an entire section of an integrated circuit memory chip. The system comprises a dedicated match circuit for each redundant row in a given section. The match circuit analyzes incoming address information to determine whether the address corresponds to a memory location in a specific defective row in any one of a number of sub-array blocks within the section. When such a critical address is detected, the match circuit activates circuitry which inhibits access to the defective row and enables access to its dedicated redundant row.

Abstract: A semiconductor dynamic random-access memory (DRAM) device embodying numerous features that collectively and/or individually prove beneficial and advantageous with regard to such considerations as density, power consumption, speed, and redundancyis disclosed. The device is a 64 Mbit DRAM comprising eight substantially identical 8 Mbit partial array blocks (PABs), each pair of PABs comprising a 16 Mbit quadrant of the device. Between the top two quadrants and between the bottom two quadrants are column blocks containing I/O read/write circuitry, column redundancy fuses, and column decode circuitry. Column select lines originate from the column blocks and extend right and left across the width of each quadrant. Each PAB comprises eight substantially identical 1Mbit sub-array blocks (SABs).

Abstract: A counter comprised of two flip flops and a multiplexer produces a sequential or interleaved address sequence. The addresses produced are used to access memory elements in a Burst Extended Data Output Dynamic Random Access Memory (Burst EDO or BEDO DRAM). Input addresses in combination with a sequence select signal are logically combined to produce a multiplexer select input which selects between true and compliment outputs of a first flip flop to couple to an input of a second flip flop to specify a toggle condition for the second flip flop. Outputs of the counter are compared with outputs of an input address latch to detect the end of a burst sequence and initialize the device for another burst access. A transition of the Read/Write control line during a burst access will terminate the burst access and initialize the device for another burst access.

Abstract: A row repair system for replacing a defective primary memory row with a redundant memory row within an entire section of an integrated circuit memory chip. The system comprises a dedicated match circuit for each redundant row in a given section. The match circuit analyzes incoming address information to determine whether the address corresponds to a memory location in a specific defective row in any one of a number of sub-array blocks within the section. When such a critical address is detected, the match circuit activates circuitry which inhibits access to the defective row and enables access to its dedicated redundant row.

Abstract: The invention is a circuit and method for quickly driving non-selected wordlines to correct potentials. The invention drives the non-selected wordlines to low potentials through a driving device directly gated by a primary select predecode signal generated by decode circuitry. The driving device is electrically interposed between the wordline and a reference node. The invention provides low power operation, and provides reliable wordline selection for circuits having supply potentials less than 5 volts.

Abstract: The invention is an automatic precharge circuit featuring precharge devices each of which is interposed between a high voltage node, connectable to a supply potential, and a serial node. The precharge devices are gated automatically by a primary predecode signal of a decode portion of the row decoder. Power is conserved since the serial nodes are passively pulled to the supply potential through the precharge devices. The invention increases speed and provides error free wordline selection.

Abstract: The invention is an automatic precharge circuit featuring precharge devices each of which is interposed between a high voltage node, connectable to a supply potential, and a serial node. The precharge devices are gated automatically by a primary predecode signal of a decode portion of the row decoder. Power is conserved since the serial nodes are passively pulled to the supply potential through the precharge devices. The invention increases speed and provides error free wordline selection.