Abstract: A fiber optic transceiver (FOT) module is provided that has a circuit board attached to the FOT leadframe. The circuit board, which is typically a printed circuit board (PCB), provides several advantages over typical FOT module designs in that it provides additional surface area for mounting additional components, enables components to be moved from the motherboard into the module, allows the I/O pin count of the FOT module to be increased without increasing the width or footprint associated with the module, allows bond wires to be shortened, provides improved performance over changes in temperature, allows manufacturing yield to be improved, and enables improvements in signal integrity to be realized.

Abstract: A small form factor pluggable (SFP) optical transceiver module and method for performing optical communications are provided. The SFP optical transceiver module has a housing to which a duplex receptacle is secured. The duplex receptacle has a C-shaped opening, the upper and lower portions of which are defined by upper and lower flexible retaining elements for receiving and retaining a duplex optical connector therein. An electrical assembly of the module is secured within the transceiver module housing. The electrical assembly comprises a PCB, the back end of which is configured as a plug end for removably plugging the PCB into a receptacle of an external communications management system.

Abstract: A small form factor pluggable (SFP) optical transceiver module and method for performing optical communications are provided. The SFP optical transceiver module has a housing to which a duplex receptacle is secured. The duplex receptacle has a C-shaped opening, the upper and lower portions of which are defined by upper and lower flexible retaining elements for receiving and retaining a duplex optical connector therein. An electrical assembly of the module is secured within the transceiver module housing. The electrical assembly comprises a PCB, the back end of which is configured as a plug end for removably plugging the PCB into a receptacle of an external communications management system.

Abstract: A small form factor pluggable (SFP) optical transceiver module and method for performing optical communications are provided. The SFP optical transceiver module has a housing to which a duplex receptacle is secured. The duplex receptacle has a C-shaped opening, the upper and lower portions of which are defined by upper and lower flexible retaining elements for receiving and retaining a duplex optical connector therein. An electrical assembly of the module is secured within the transceiver module housing. The electrical assembly comprises a PCB, the back end of which is configured as a plug end for removably plugging the PCB into a receptacle of an external communications management system.

Abstract: An electro-optical assembly (EA) is provided in which the transmitter and receiver components are integrated together on a single circuit board, which is encapsulated in a single molded EA package. Integrating the transmitter and receiver components on a single circuit board allows the size and complexity of the EA to be greatly reduced as compared to the traditional TO-can and FOT architectures. A standard semiconductor inline automation system and process may be used to manufacture the EA packages so that they may be mass produced with improved throughput, yield and quality as compared to the method currently used to manufacture and assemble the known EA used in the traditional TO-can and FOT architectures.

Abstract: A small form factor pluggable (SFP) optical transceiver module and method for performing optical communications are provided. The SFP optical transceiver module has a housing to which a duplex receptacle is secured. The duplex receptacle has a C-shaped opening, the upper and lower portions of which are defined by upper and lower flexible retaining elements for receiving and retaining a duplex optical connector therein. An electrical assembly of the module is secured within the transceiver module housing. The electrical assembly comprises a PCB, the back end of which is configured as a plug end for removably plugging the PCB into a receptacle of an external communications management system.

Abstract: In one embodiment, a lens has an object surface and an image surface, with the shape of the image surface being defined by an equation having a conic component and a cone component. The lens may be incorporated into an optical receiver having a photodetector that is positioned to receive light emitted from the image surface of the lens. In some uses, the image surface of the lens mitigates return loss through the lens.

Abstract: An electro-optical subassembly formed using an optical unit and a base. The optical unit has a lens and a cavity in communication with the lens, the cavity having surfaces aligned with the lens. The base includes a body, shaped to fit within the cavity so as to have a predetermined alignment with the lens, and a plurality of leads embedded in and extending from the body. At least one end of one lead is positioned behind the lens when the base is inserted into the cavity. An electro-optical component supported by the at least one lead behind the lens and is optically accessible to the lens when the base is inserted into the optical unit.

Abstract: An electro-optical subassembly generally includes a base supporting at least one lead and a lens unit having a lens. The lead supports an electro-optical component. The lens unit is through transmission laser welded to the base such that the lens is aligned with the electro-optical component.

Abstract: An electro-optical subassembly formed using an optical unit and a base. The optical unit has a lens and a cavity in communication with the lens, the cavity having surfaces aligned with the lens. The base includes a body, shaped to fit within the cavity so as to have a predetermined alignment with the lens, and a plurality of leads embedded in and extending from the body. At least one end of one lead is positioned behind the lens when the base is inserted into the cavity and supports an electro-optical component that is aligned to the lens when the base is inserted into the optical unit.

Abstract: An opto-electronic housing and an opto-electronic assembly. The housing includes an enclosure defining a cavity. An opening through a wall of the enclosure is adapted to receive a substrate. A mount projects into the cavity opposite the opening. The mount is adapted to support an opto-electronic device. Adjacent the mount is an optically transmissive region in a wall of the enclosure. An opto-electronic assembly also includes a substrate disposed in the opening and an opto-electronic device supported by the mount.

Abstract: A monolithic optical coupling module for coupling a light beam is disclosed. The optical coupling module has a light beam input portion, a light beam output portion and at least one integrally formed light beam attenuator between the light beam input portion and the light beam output portion. The monolithic optical coupling module may be unitarily fabricated of a moldable polymeric material. The light beam attenuator may be a roughened surface or a roughened internal portion. A method for forming the monolithic optical coupling module is also disclosed.