Patents by Inventor Adrien KERSTEN

Adrien KERSTEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11639557
    Abstract: A composite copper foil contains a carrier layer, a release layer and an ultra-thin copper layer in this order. In the composite copper foil, the release layer includes a binary alloy or a ternary alloy comprising nickel, and is formed into an amorphous layer, and the ultra-thin copper layer is peelable from the carrier layer. A method of fabricating the composite copper foil includes preparing a carrier layer, forming a release layer which is amorphous on the carrier layer by electroplating using an electrolyte that comprises nickel, and forming an ultra-thin copper layer on the release layer by electroplating.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: May 2, 2023
    Assignee: Circuit Foil Luxembourg
    Inventors: Zainhia Kaidi, Thomas Devahif, Adrien Kersten, Michel Streel
  • Publication number: 20220127743
    Abstract: A composite copper foil contains a carrier layer, a release layer and an ultra-thin copper layer in this order. In the composite copper foil, the release layer includes a binary alloy or a ternary alloy comprising nickel, and is formed into an amorphous layer, and the ultra-thin copper layer is peelable from the carrier layer. A method of fabricating the composite copper foil includes preparing a carrier layer, forming a release layer which is amorphous on the carrier layer by electroplating using an electrolyte that comprises nickel, and forming an ultra-thin copper layer on the release layer by electroplating.
    Type: Application
    Filed: February 28, 2019
    Publication date: April 28, 2022
    Applicant: Circuit Foil Luxembourg
    Inventors: Zainhia KAIDI, Thomas DEVAHIF, Adrien KERSTEN, Michel STREEL