Patents by Inventor Agnés Bidard

Agnés Bidard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulated surface acoustic wave component and method of collective fabrication
    Patent number: 6852561
    Abstract: The invention relates to a new type of encapsulated surface acoustic wave component and to a method for the batch production of such components. The component comprises a surface acoustic wave device on the surface of a substrate. The encapsulation package furthermore comprises the substrate, a first layer located on the substrate and hollowed out locally at least at the level of the active surface of the surface acoustic wave device, a printed circuit covering entire first layer and conductive via holes going through the unit formed by the first layer and the printed circuit so as to provide for the electrical connection of the surface acoustic wave device from the exterior.
    Type: Grant
    Filed: October 14, 2003
    Date of Patent: February 8, 2005
    Assignee: Thomson-CSF
    Inventors: Agnés Bidard, Jean-Marc Bureau
  • Encapsulated surface acoustic wave component and method of collective fabrication
    Publication number: 20040103509
    Abstract: The invention relates to a new type of encapsulated surface acoustic wave component and to a method for the batch production of such components.
    Type: Application
    Filed: October 14, 2003
    Publication date: June 3, 2004
    Inventors: Agnes Bidard, Jean-Marc Bureau