Patents by Inventor Agnieszka WITCZAK

Agnieszka WITCZAK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
    Patent number: 11066553
    Abstract: The present invention relates to imidazoyl urea polymers and their use in aqueous acidic plating baths for metal or metal alloy deposition such as electrolytic deposition of copper or alloys thereof in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of metal ions and an imidazoyl urea polymer. The plating bath is particularly useful for filling recessed structures and build-up of pillar bump structures.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: July 20, 2021
    Assignee: Atotech Deutschland GmbH
    Inventors: Heiko Brunner, Lars Kohlmann, Agnieszka Witczak, Olivier Mann
  • Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate
    Patent number: 10767275
    Abstract: The present invention relates to bisurea derivatives and their use in aqueous plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions and a bisurea derivative. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: September 8, 2020
    Assignee: Atotech Deutschland GmbH
    Inventors: Heiko Brunner, Lars Kohlmann, Agnieszka Witczak, Olivier Mann
  • IMIDAZOYL UREA POLYMERS AND THEIR USE IN METAL OR METAL ALLOY PLATING BATH COMPOSITIONS
    Publication number: 20190144667
    Abstract: The present invention relates to imidazoyl urea polymers and their use in aqueous acidic plating baths for metal or metal alloy deposition such as electrolytic deposition of copper or alloys thereof in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of metal ions and an imidazoyl urea polymer. The plating bath is particularly useful for filling recessed structures and build-up of pillar bump structures.
    Type: Application
    Filed: August 19, 2016
    Publication date: May 16, 2019
    Inventors: Heiko BRUNNER, Lars KOHLMANN, Agnieszka WITCZAK, Olivier MANN
  • AQUEOUS COPPER PLATING BATHS AND A METHOD FOR DEPOSITION OF COPPER OR COPPER ALLOY ONTO A SUBSTRATE
    Publication number: 20180223442
    Abstract: The present invention relates to bisurea derivatives and their use in aqueous plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions and a bisurea derivative. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.
    Type: Application
    Filed: August 30, 2016
    Publication date: August 9, 2018
    Inventors: Heiko BRUNNER, Lars KOHLMANN, Agnieszka WITCZAK, Olivier MANN
  • Copper plating bath composition
    Patent number: 9551080
    Abstract: The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: January 24, 2017
    Assignee: Atotech Deutschland GmbH
    Inventors: Heiko Brunner, Bernd Roelfs, Agnieszka Witczak, Lars Kohlmann, Olivier Mann, Christian Ohde, Timo Bangerter, Angelo Ferro, Andreas Kirbs, Andre Schmökel, Dirk Rohde, Stefanie Ackermann
  • COPPER PLATING BATH COMPOSITION
    Publication number: 20150299883
    Abstract: The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.
    Type: Application
    Filed: November 12, 2013
    Publication date: October 22, 2015
    Inventors: Heiko BRUNNER, Bernd ROELFS, Agnieszka WITCZAK, Lars KOHLMANN, Olivier MANN, Christian OHDE, Timo BANGERTER, Angelo FERRO, Andreas KIRBS, Andre SCHMÖKEL, Dirk ROHDE, Stefanie ACKERMANN