Abstract: The discussion relates to spatially meshed interactive devices. One example can include a mesh component that has access to a layout of features of a facility and to information about users associated with the facility. The example can also include multiple interactive devices including sensors and communication components. The multiple interactive devices are communicatively coupled via the communication components and at least some of the multiple interactive devices are communicatively coupled to the mesh component. The multiple interactive devices are located at known positions in the facility to create a spatial mesh at the facility relative to the features.

Abstract: The discussion relates to spatially meshed interactive devices. One example can include a mesh component that has access to a layout of features of a facility and to information about users associated with the facility. The example can also include multiple interactive devices including sensors and communication components. The multiple interactive devices are communicatively coupled via the communication components and at least some of the multiple interactive devices are communicatively coupled to the mesh component. The multiple interactive devices are located at known positions in the facility to create a spatial mesh at the facility relative to the features.

Abstract: An electronic device is configured with sub-assemblies including a main logic board, flexible printed circuit, and dual battery packs that are assembled together with electrical connectors to enable power from the battery packs to flow over a power bus that is distributed along the flexible printed circuit and main logic board. A protection circuit module (PCM) in each battery pack is configured to determine a state of each of the connections among the sub-assemblies (i.e., whether or not properly assembled to provide electrical continuity through the connector) so that power from the battery packs is switched on to the power bus only when electrical continuity is verified at each of the connectors. In the event that any connection is faulty, for example due to a misalignment of a connector during assembly that prevents electrical continuity to be established through a connector, neither PCM will switch power on to the power bus.

Abstract: In an electronic device that employs high-speed differential signaling on one or more pairs of conductors in a flexible printed circuit, RF chokes are placed in the differential signal path and mounted directly on the flexible printed circuit which is used to interconnect a peripheral device, such as an image sensor, through a connector to another device component such as a main printed circuit board. The RF chokes are configured to suppress common-mode noise propagating in the differential pairs of conductors. In one illustrative embodiment, the RF chokes are located on the flexible printed circuit adjacent to the peripheral device to suppress common-mode noise near its source. In another illustrative embodiment, the RF chokes are mounted adjacent to the connector to suppress the common-mode noise before it has an opportunity to escape the flexible printed circuit at the major discontinuity presented by the connector.

Abstract: In an electronic device having a compact form factor, such as a head mounted display device, flexible printed circuits may be utilized to provide interconnects between EMI-generating peripheral components and other components in the device such as those populated on main circuit boards. Coverlays utilized to protect circuit traces and ground planes in the flexible printed circuits are configured with openings that can expose ground planes at various locations throughout the electronic device. Electrical pathways are formed by conductive foam, conductive adhesives, and/or other conductive materials between the exposed ground planes and a device ground to establish multiple ground loops throughout the device that shunt EMI energy that is generated by electronic components and circuits during device operation. The coverlay openings can be positioned on the flexible printed circuits so that the lengths of the ground loops are minimized to enhance overall EMI emission management performance.

Abstract: An electronic device is configured with sub-assemblies including a main logic board, flexible printed circuit, and dual battery packs that are assembled together with electrical connectors to enable power from the battery packs to flow over a power bus that is distributed along the flexible printed circuit and main logic board. A protection circuit module (PCM) in each battery pack is configured to determine a state of each of the connections among the sub-assemblies (i.e., whether or not properly assembled to provide electrical continuity through the connector) so that power from the battery packs is switched on to the power bus only when electrical continuity is verified at each of the connectors. In the event that any connection is faulty, for example due to a misalignment of a connector during assembly that prevents electrical continuity to be established through a connector, neither PCM will switch power on to the power bus.

Abstract: In an electronic device having a compact form factor, such as a head mounted display device, flexible printed circuits may be utilized to provide interconnects between EMI-generating peripheral components and other components in the device such as those populated on main circuit boards. Coverlays utilized to protect circuit traces and ground planes in the flexible printed circuits are configured with openings that can expose ground planes at various locations throughout the electronic device. Electrical pathways are formed by conductive foam, conductive adhesives, and/or other conductive materials between the exposed ground planes and a device ground to establish multiple ground loops throughout the device that shunt EMI energy that is generated by electronic components and circuits during device operation. The coverlay openings can be positioned on the flexible printed circuits so that the lengths of the ground loops are minimized to enhance overall EMI emission management performance.

Abstract: In an electronic device that employs high-speed differential signaling on one or more pairs of conductors in a flexible printed circuit, RF chokes are placed in the differential signal path and mounted directly on the flexible printed circuit which is used to interconnect a peripheral device, such as an image sensor, through a connector to another device component such as a main printed circuit board. The RF chokes are configured to suppress common-mode noise propagating in the differential pairs of conductors. In one illustrative embodiment, the RF chokes are located on the flexible printed circuit adjacent to the peripheral device to suppress common-mode noise near its source. In another illustrative embodiment, the RF chokes are mounted adjacent to the connector to suppress the common-mode noise before it has an opportunity to escape the flexible printed circuit at the major discontinuity presented by the connector.