Abstract: Apparatus for applying solder to electrical or electronic components mounted in a horizontally oriented carrier, includes a solder bath, a pair of tracks (1,2) for guiding the carrier across the solder bath, and a device for urging the carrier along the tracks. The track has a first profiled region (12,19) for guiding a leading position of the carrier down towards the surface of the solder, and a second profiled region (16,20) longitudinally spaced from the first region, and laterally offset, for simultaneously guiding a trailing portion of the carrier down towards the surface of the solder, the profiles being substantially the same so that the carrier maintains its horizontal orientation while being moved vertically towards and away from the surface of the solder. The carrier moves on follower wheels which run along the tracks.

Abstract: Apparatus (1) for applying solder to electrical components such as integrated circuit packages (2) has a chamber (4) which contains a body of solder. The chamber (4) has outlet openings (10) which are below the surface of the solder and from which a flow of solder is provided. Since dross (oxidized solder) floats on the surface of the solder, the flow of solder is relatively pure. The leads of the packages are dipped into the flow of solder so that they are coated with a protective layer of solder. Vibrational apparatus (2) is also provided to vibrate the circuit packages (2) during the dipping of the packages (2) into the solder flow. In this way solder is prevented from bridging the spacing between two closely spaced, adjacent leads.

Abstract: Apparatus for plating electrical or electronic components, comprises a plating chamber (2) for receiving electrolyte through which a current is to be passed via a first anode (10) and cathode (13) pair, means being provided to arrange a component (12) to be plated as the cathode of said first pair, means for supplying the plating chamber with electrolyte enriched with plating material, the supplying means including a reservoir chamber (4) for receiving electrolyte through which a current is to be passed via a second anode and cathode pair (21,22), means being provided to arrange a body of plating material (17) as the anode of said second pair, whereby in use plating material dissolved from the anode of the second pair enriches the electrolyte supplied to the plating chamber (2) and is deposited on the cathode of the first pair.

Abstract: Apparatus for plating electrical or electronic components, comprises a plating chamber (2) for receiving electrolyte through which a current is to be passed via a first anode (10) and cathode (13) pair, means being provided to arrange a component (12) to be plated as the cathode of said first pair, means for supplying the plating chamber with electrolyte enriched with plating material, the supplying means including a reservoir chamber (4) for receiving electrolyte through which a current is to be passed via a second anode and cathode pair (21, 22), means being provided to arrange a body of plating material (17) as the anode of said second pair, whereby in use plating material dissolved from the anode of the second pair enriches the electrolyte supplied to the plating chamber (2) and is deposited on the cathode of the first pair.

Abstract: A carrier for holding SOIC packages during the application of solder to their leads, the carrier including a frame provided with an end plate (17) with mounting lugs (20). On each lug (20) is mounted an upper U-shaped member (1) and a lower U-shaped elongate member (8) with the respective legs (3) and (10) of the members projecting downwardly. The legs (10) are disposed within the legs (3) but extend further and terminate at outwardly turned ends (11). Adjacent assemblies of the members (1) and (8) define a track (T) therebetween for a line of SOIC packages (24) whose leads (26) rest on end portions (11), and which are restricted against upward movement by the ends (4) of legs (3).

Abstract: A carrier for components to be soldered includes an upper frame pivotally connected to a lower frame. The upper frame includes longitudinal grid members interlocked with transverse grid members to define recessed zones with stepped corners to locate the components. The lower frame has slidably mounted strips with projections which engage the components when the lower frame is pivoted to a closed condition.