Patents by Inventor Ahmad Naiini
Ahmad Naiini has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11939428Abstract: This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least a second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.Type: GrantFiled: August 2, 2021Date of Patent: March 26, 2024Assignee: Fujifilm Electronic Materials U.S.A., Inc.Inventors: Binod B. De, Sanjay Malik, William A. Reinerth, Ognian N. Dimov, Ahmad A. Naiini, Raj Sakamuri
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Patent number: 11899364Abstract: This disclosure relates to a dry film structure that includes a carrier substrate, and a polymeric layer supported by the carrier substrate. The polymeric layer includes at least one fully imidized polyimide polymer.Type: GrantFiled: March 18, 2020Date of Patent: February 13, 2024Assignee: Fujifilm Electronic Materials U.S.A., Inc.Inventors: Binod B. De, Sanjay Malik, Raj Sakamuri, William A. Reinerth, Ognian N. Dimov, Ahmad A. Naiini
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Patent number: 11782344Abstract: This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.Type: GrantFiled: July 11, 2018Date of Patent: October 10, 2023Assignee: Fujifilm Electronic Materials U.S.A., Inc.Inventors: Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Binod B. De, William A. Reinerth, Ahmad A. Naiini
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Patent number: 11721543Abstract: This disclosure describes a process of generating a planarizing polyimide based dielectric film on a substrate with conducting metal pattern, wherein the process comprised steps of: (a) providing a dielectric film forming composition comprising at least one fully imidized polyimide polymer and at least one solvent; and (b) depositing the dielectric film forming composition onto a substrate with conducting metal pattern to form a dielectric film, wherein the difference in the highest and lowest points on a top surface of the dielectric film is less than about 2 microns.Type: GrantFiled: October 1, 2020Date of Patent: August 8, 2023Assignee: Fujifilm Electronic Materials U.S.A., Inc.Inventors: Raj Sakamuri, Ognian Dimov, Sanjay Malik, Michaela Connell, Ahmad A. Naiini, Stephanie Dilocker
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Publication number: 20210355279Abstract: This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least a second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.Type: ApplicationFiled: August 2, 2021Publication date: November 18, 2021Inventors: Binod B. De, Sanjay Malik, William A. Reinerth, Ognian N. Dimov, Ahmad A. Naiini, Raj Sakamuri
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Patent number: 11175582Abstract: This disclosure relates to a photosensitive stacked structure that includes first and second layers, in which the first layer is a photosensitive, dielectric layer and the second layer is a photosensitive layer. The dissolution rate of the first layer in a developer is less than the dissolution rate of the second layer in the developer.Type: GrantFiled: December 20, 2016Date of Patent: November 16, 2021Assignee: Fujifilm Electronic Materials U.S.A., Inc.Inventors: Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Binod B. De, William A. Reinerth, Ahmad A. Naiini
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Patent number: 11061327Abstract: A polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least one second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.Type: GrantFiled: October 25, 2017Date of Patent: July 13, 2021Assignee: Fujifilm Electronic Materials U.S.A., Inc.Inventors: William A. Reinerth, Binod B. De, Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini
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Publication number: 20210104398Abstract: This disclosure describes a process of generating a planarizing polyimide based dielectric film on a substrate with conducting metal pattern, wherein the process comprised steps of: (a) providing a dielectric film forming composition comprising at least one fully imidized polyimide polymer and at least one solvent; and (b) depositing the dielectric film forming composition onto a substrate with conducting metal pattern to form a dielectric film, wherein the difference in the highest and lowest points on a top surface of the dielectric film is less than about 2 microns.Type: ApplicationFiled: October 1, 2020Publication date: April 8, 2021Inventors: Micheala Connell, Sanjay Malik, Raj Sakamuri, Ahmad A. Naiini, Stephanie Dilocker
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Patent number: 10793676Abstract: A polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (I) (b) at least one tetracarboxylic acid dianhydride, and optionally (c) at least one compound containing a first functional group reactive with an amine or an anhydride and at least one second functional group selected from the group consisting of an unsubstituted alkenyl group and an unsubstituted alkynyl group. Each variable in the above formula is defined in the specification.Type: GrantFiled: October 26, 2017Date of Patent: October 6, 2020Assignee: Fujifilm Electronic Materials U.S.A., Inc.Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini
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Publication number: 20200262978Abstract: This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), [insert formula here] (la) or [insert formula here] (lb), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least a second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.Type: ApplicationFiled: October 18, 2017Publication date: August 20, 2020Inventors: Binod B. De, Sanjay Malik, William A. Reinerth, Ognian N. Dimov, Ahmad A. Naiini, Raj Sakamuri
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Publication number: 20200218152Abstract: This disclosure relates to a dry film structure that includes a carrier substrate, and a polymeric layer supported by the carrier substrate. The polymeric layer includes at least one fully imidized polyimide polymer.Type: ApplicationFiled: March 18, 2020Publication date: July 9, 2020Inventors: Binod B. De, Sanjay Malik, Raj Sakamuri, William A. Reinerth, Ognian N. Dimov, Ahmad A. Naiini
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Patent number: 10696932Abstract: This disclosure relates to a composition (e.g., a cleaning and/or stripping composition) containing (a) 0.5-25 percent by weight an alkaline compound; (b) 1-25 percent by weight an alcohol amine compound; (c) 0.1-20 percent by weight a hydroxylammonium compound; (d) 5-95 percent by weight an organic solvent; (e) 0.1-5 percent by weight a corrosion inhibitor compound; and (f) 2-25 percent by weight water.Type: GrantFiled: July 28, 2016Date of Patent: June 30, 2020Assignee: Fujifilm Electronic Materials U.S.A., Inc.Inventors: Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini, Sanjay Malik, Binod B. De, William A. Reinerth
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Patent number: 10604628Abstract: This disclosure relates to a polymer that includes a first repeat unit and at least one end-cap group at one end of the polymer. The first repeat unit includes at least one imide moiety and at least one indane-containing moiety. The end-cap group is capable of undergoing a cycloreversion reaction. This disclosure also relates to a thermosetting composition containing the above polymer.Type: GrantFiled: May 30, 2017Date of Patent: March 31, 2020Assignee: Fujifilm Electronic Materials U.S.A., Inc.Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Ahmad A. Naiini
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Publication number: 20190263969Abstract: This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (I) Structure (I) (b) at least one tetracarboxylic acid dianhydride, and optionally (c) at least one compound containing a first functional group reactive with an amine or an anhydride and at least one second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formula is defined in the specification.Type: ApplicationFiled: October 26, 2017Publication date: August 29, 2019Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini
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Publication number: 20190171105Abstract: This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.Type: ApplicationFiled: July 11, 2018Publication date: June 6, 2019Inventors: Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Binod B. De, William A. Reinerth, Ahmad A. Naiini
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Publication number: 20190129303Abstract: This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least one second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.Type: ApplicationFiled: October 25, 2017Publication date: May 2, 2019Inventors: William A. Reinerth, Binod B. De, Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini
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Publication number: 20190018321Abstract: This disclosure relates to a photosensitive stacked structure that includes first and second layers, in which the first layer is a photosensitive, dielectric layer and the second layer is a photosensitive layer. The dissolution rate of the first layer in a developer is less than the dissolution rate of the second layer in the developer.Type: ApplicationFiled: December 20, 2016Publication date: January 17, 2019Inventors: Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Binod B. De, William A. Reinerth, Ahmad A. Naiini
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Publication number: 20190016999Abstract: This disclosure relates to a composition (e.g., a cleaning and/or stripping composition) containing (a) 0.5-25 percent by weight an alkaline compound; (b) 1-25 percent by weight an alcohol amine compound; (c) 0.1-20 percent by weight a hydroxylammonium compound; (d) 5-95 percent by weight an organic solvent; (e) 0.1-5 percent by weight a corrosion inhibitor compound; and (f) 2-25 percent by weight water.Type: ApplicationFiled: July 28, 2016Publication date: January 17, 2019Inventors: Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini, Sanjay Malik, Binod B. De, William A. Reinerth
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Patent number: 10036952Abstract: This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.Type: GrantFiled: April 19, 2016Date of Patent: July 31, 2018Assignee: Fujifilm Electronic Materials U.S.A., Inc.Inventors: Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Binod B. De, William A. Reinerth, Ahmad A. Naiini
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Publication number: 20170260330Abstract: This disclosure relates to a polymer that includes a first repeat unit and at least one end-cap group at one end of the polymer. The first repeat unit includes at least one imide moiety and at least one indane-containing moiety. The end-cap group is capable of undergoing a cycloreversion reaction. This disclosure also relates to a thermosetting composition containing the above polymer.Type: ApplicationFiled: May 30, 2017Publication date: September 14, 2017Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Ahmad A. Naiini