Abstract: A method for forming metal-polymer hybrid tooling includes patterning a surface of a member such as a silicon wafer, stainless steel, nickel or nickel alloy, engaging a polymer layer with the patterned features of the surface of the silicon wafer to form the polymer layer having a reverse of the patterned surface the silicon wafer, removing the patterned polymer layer to expose a patterned polymer layer surface, depositing a metallic layer on the patterned polymer layer surface, and wherein the deposited metallic layer on the patterned polymer layer is operable to form parts with features having a width dimension between about 0.01 microns and about 100 microns and a height dimension of between about 0.01 micron and about 800 microns (e.g., up to aspect ratio of 8).

Abstract: Nanosubstrates as biosensors, methods of making such nanosubstrates, and methods of using such nanosubstrates to detect biomarkers are described.

Abstract: Nanoscale patterns prepared by lithography are used to direct the self-assembly of amphiphilic molecules to form patterned nanosubstrates having a desired distribution of chemical functional moieties. These patterns can be fabricated over a large area and require no special limitations on the chemistry the assembled amphiphiles. Hydrophilic/hydrophobic patterns can be created and used to direct the deposition of a single functional component to specific regions of the surface or to selectively assemble polymer blends to desired sites in a one step fashion with high specificity and selectivity. The selective deposition of functional moieties on a patterned surface can be based on electrostatic forces, hydrogen bonding, or hydrophobic interactions.

Abstract: Methods for fabricating templates for nanoelement assembly and methods for fluid-guided assembly of nanoelements are provided. Templates are fabricated by plasma modification of surface hydrophilicity and production of a network of hydrophobic trenches having a hydrophilic bottom surface. Single-walled carbon nanotubes (SWNT) can be assembled into stable films, ribbons, and wires of nanoscale thickness and nanoscale or microscale width and length. The nanofilm assemblies prepared according to the invention are highly conductive and can be used in the fabrication of a wide variety of microscale and nanoscale electronic devices.

Abstract: A non-volatile bistable nano-electromechanical switch is provided for use in memory devices and microprocessors. The switch employs carbon nanotubes as the actuation element. A method has been developed for fabricating nanoswitches having one single-walled carbon nanotube as the actuator. The actuation of two different states can be achieved using the same low voltage for each state.

Abstract: An assembly of nanoelements forms a three-dimensional nanoscale circuit interconnect for use in microelectronic devices. A process for producing the circuit interconnect includes using dielectrophoresis by applying an electrical field across a gap between vertically displaced non-coplanar microelectrodes in the presence of a liquid suspension of nanoelements such as nanoparticles or single-walled carbon nanotubes to form a nanoelement bridge connecting the microelectrodes. The assembly process can be carried out at room temperature, is compatible with conventional semiconductor fabrication, and has a high yield. The current-voltage curves obtained from the nanoelement bridge demonstrate that the assembly is functional with a resistance of ?40 ohms for gold nanoparticles. The method is suitable for making high density three-dimensional circuit interconnects, vertically integrated nanosensors, and for in-line testing of manufactured conductive nanoelements.

Abstract: The present invention provides a functionalized nanosubstrate or “nanotemplate” that is useful for selectively assembling nanoelements across a large area. The nanotemplate is capable of guiding the massive parallel assembly of nanoelements to fabricate a three-dimensional nanostructure. Nanoelements can also be transferred at a high-rate from the template to a recipient substrate. Examples of these nanoelements include, but are not limited to, carbon nanotubes, nanocrystals, dendrimers, nanoparticles, nanowires, biological materials, proteins, molecules and organic nanotubes. The invention also provides a nanotemplate combined with selectively assembled nanoelements. The invention encompasses methods for functionalizing a nanosubstrate. These methods involve providing a substrate having a known topology and polymerizing a monomer on its surface. Methods for selecting nanoelements and guiding their self-assembly are also disclosed.

Abstract: The present invention provides a method for directed assembly of a conducting polymer. A method of the invention comprises providing a template such as an insulated template and electrophorectically assembling a conducting polymer thereon. Preferably, the template comprises a patterned electrode on which the conducting polymer is assembled. Moreover, the invention provides a method for transferring an assembled conducting polymer. For example, a method of the invention comprises providing a substrate such as a polymeric substrate and contacting a surface thereof with an assembled conducting polymer. The assembled conducting polymer can be disposed on a patterned electrode of a template, hi one embodiment, a method comprises removing the substrate. By removing the substrate, the assembled conducting polymer is transferred from the patterned electrode of the template to the substrate. The invention also provides a device with a template or substrate comprising an assembled conducting polymer.

Abstract: The present invention provides methods and tools for directed assembly of nanoelements across a large area using a nanosubstrate. The nanosubstrate has a substrate layer, an adhesive layer, a conductive layer, and an insulating layer that is interrupted by one or more nanotrenches or nanowells having a width of at least 20 nm. The nanosubstrate allows the rapid assembly of linear assemblies and arrays of single walled carbon nanotubes and nanoparticles by DC electrophoresis. The density of nanoelements assembled can be controlled by varying the voltage and trench size. Functionalized nanoparticles can be assembled into arrays useful, e.g., as biosensors.

Abstract: A variety of techniques may be employed, alone or in combination, to enhance contact between a processed substrate and applied megasonic energy. In accordance with one embodiment of the new invention, the vibration plate is brought into intimate contact with one surface of the substrate, while cleaning or processing fluid contacts the other. In accordance with an alternative embodiment of the present invention, a reflecting surface may be provided to cause emanated energy to be reflected back into the near field and make it more uniform. In accordance with another alternative embodiment of the present invention, energy may be transferred across a substrate bounded on both sides by liquid with incidence of megasonic energy that is either normal to the substrate surface or within a critical range of incident angles. In yet another embodiment, generated dilatational waves may be converted to surface waves prior to contacting the substrate.

Abstract: A variety of techniques may be employed, alone or in combination, to enhance contact between a processed substrate and applied megasonic energy. In accordance with one embodiment of the new invention, the vibration plate is brought into intimate contact with one surface of the substrate, while cleaning or processing fluid contacts the other. In accordance with an alternative embodiment of the present invention, a reflecting surface may be provided to cause emanated energy to be reflected back into the near field and make it more uniform. In accordance with another alternative embodiment of the present invention, energy may be transferred across a substrate bounded on both sides by liquid with incidence of megasonic energy that is either normal to the substrate surface or within a critical range of incident angles. In yet another embodiment, generated dilatational waves may be converted to surface waves prior to contacting the substrate.

Abstract: A variety of techniques may be employed, alone or in combination, to enhance contact between a processed substrate and applied megasonic energy. In accordance with one embodiment of the new invention, the vibration plate is brought into intimate contact with one surface of the substrate, while cleaning or processing fluid contacts the other. In accordance with an alternative embodiment of the present invention, a reflecting surface may be provided to cause emanated energy to be reflected back into the near field and make it more uniform. In accordance with another alternative embodiment of the present invention, energy may be transferred across a substrate bounded on both sides by liquid with incidence of megasonic energy that is either normal to the substrate surface or within a critical range of incident angles. In yet another embodiment, generated dilatational waves may be converted to surface waves prior to contacting the substrate.

Abstract: A variety of techniques may be employed, alone or in combination, to enhance contact between a processed substrate and applied megasonic energy. In accordance with one embodiment of the new invention, the vibration plate is brought into intimate contact with one surface of the substrate, while cleaning or processing fluid contacts the other. In accordance with an alternative embodiment of the present invention, a reflecting surface may be provided to cause emanated energy to be reflected back into the near field and make it more uniform. In accordance with another alternative embodiment of the present invention, energy may be transferred across a substrate bounded on both sides by liquid with incidence of megasonic energy that is either normal to the substrate surface or within a critical range of incident angles. In yet another embodiment, generated dilatational waves may be converted to surface waves prior to contacting the substrate.

Abstract: The present invention provides a functionalized nanosubstrate or “nanotemplate” that is useful for selectively assembling nanoelements across a large area. The nanotemplate is capable of guiding the massive parallel assembly of nanoelements to fabricate a three-dimensional nanostructure. Nanoelements can also be transferred at a high-rate from the template to a recipient substrate. Examples of these nanoelements include, but are not limited to, carbon nanotubes, nanocrystals, dendrimers, nanoparticles, nanowires, biological materials, proteins, molecules and organic nanotubes. The invention also provides a nanotemplate combined with selectively assembled nanoelements. The invention encompasses methods for functionalizing a nanosubstrate. These methods involve providing a substrate having a known topology and polymerizing a monomer on its surface. Methods for selecting nanoelements and guiding their self-assembly are also disclosed.

Abstract: A variety of techniques may be employed, alone or in combination, to enhance contact between a processed substrate and applied megasonic energy. In accordance with one embodiment of the new invention, the vibration plate is brought into intimate contact with one surface of the substrate, while cleaning or processing fluid contacts the other. In accordance with an alternative embodiment of the present invention, a reflecting surface may be provided to cause emanated energy to be reflected back into the near field and make it more uniform. In accordance with another alternative embodiment of the present invention, energy may be transferred across a substrate bounded on both sides by liquid with incidence of megasonic energy that is either normal to the substrate surface or within a critical range of incident angles. In yet another embodiment, generated dilatational waves may be converted to surface waves prior to contacting the substrate.

Abstract: A fast single-article megasonic cleaning system (200) is used to clean substrates (such as semiconductor wafers, flat panel display glass, etc.) at frequencies of 400 kHz-20,000 kHz or higher. The technique provides a single-wafer cleaning process that reduces the cleaning time from the 10-20 minutes typical of the prior art to 15-60 seconds. The system utilizes concentrated megasonic energy on one wafer (90) to dramatically reduce cleaning time. The system uses a transducer (210) or a pair or transducers (210a, 210b) parallel to the substrate (90) to be cleaned where the transducer area is more than about 40% of the substrate area. Two alternate configurations are disclosed, one utilizing a horizontal wafer arrangement and the second utilizing a vertical wafer arrangement. The latter requires a smaller floor area.