Patents by Inventor AHMET DURGUN

AHMET DURGUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connectors for integrated circuit packages
    Patent number: 11158969
    Abstract: Apparatuses, systems and methods associated with connector design for mating with integrated circuit packages are disclosed herein. In embodiments, a connector for mating with an integrated circuit (IC) package may include a housing with a recess to receive a portion of the IC package and a contact coupled to the housing and that extends into the recess. The contact may include a main body that extends from the housing into the recess and a curved portion that extends from an end of the main body, wherein the curved portion loops back and contacts the main body. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: October 26, 2021
    Assignee: Intel Corporation
    Inventors: Feifei Cheng, Emad Al-Momani, Ahmet Durgun, Kuang Liu
  • CONNECTORS FOR INTEGRATED CIRCUIT PACKAGES
    Publication number: 20190044265
    Abstract: Apparatuses, systems and methods associated with connector design for mating with integrated circuit packages are disclosed herein. In embodiments, a connector for mating with an integrated circuit (IC) package may include a housing with a recess to receive a portion of the IC package and a contact coupled to the housing and that extends into the recess. The contact may include a main body that extends from the housing into the recess and a curved portion that extends from an end of the main body, wherein the curved portion loops back and contacts the main body. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: March 9, 2018
    Publication date: February 7, 2019
    Inventors: FEIFEI CHENG, EMAD AL-MOMANI, AHMET DURGUN, KUANG LIU