Patents by Inventor Ahmet Gün Erlat

Ahmet Gün Erlat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8512809
    Abstract: A method of processing a multilayer film is provided. The method includes providing a substrate film having a substrate film first surface and a substrate film second surface. The method also includes providing a barrier layer adjacent to the substrate film second surface. The barrier layer has at least one opening allowing fluid communication between the substrate film and an outer surface of the barrier layer. Further, the method includes contacting the substrate film first surface with a first reactant and finally contacting the outer surface of the barrier layer with a second reactant, said second reactant being reactive with said first reactant. The method of contacting the substrate film first surface to the first reactant and contacting the outer surface of the barrier layer to the second reactant is carried out under conditions under which reaction between said first reactant and the second reactant results in a formation of a reaction layer.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: August 20, 2013
    Assignee: General Electric Company
    Inventors: Christian Maria Anton Heller, Anil Raj Duggal, Dennis Joseph Coyle, Min Yan, Ahmet Gün Erlat, Ri-an Zhao
  • Publication number: 20110244141
    Abstract: A method of processing a multilayer film is provided. The method includes providing a substrate film having a substrate film first surface and a substrate film second surface. The method also includes providing a barrier layer adjacent to the substrate film second surface. The barrier layer has at least one opening allowing fluid communication between the substrate film and an outer surface of the barrier layer. Further, the method includes contacting the substrate film first surface with a first reactant and finally contacting the outer surface of the barrier layer with a second reactant, said second reactant being reactive with said first reactant. The method of contacting the substrate film first surface to the first reactant and contacting the outer surface of the barrier layer to the second reactant is carried out under conditions under which reaction between said first reactant and the second reactant results in a formation of a reaction layer.
    Type: Application
    Filed: March 31, 2010
    Publication date: October 6, 2011
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Christian Maria Anton Heller, Anil Raj Duggal, Dennis Joseph Coyle, Min Yan, Ahmet Gün Erlat, Ri-an Zhao