Abstract: A test system (1) has a test controller (2) and at least one probe (3). An ICC card (C) is inserted into a slot (8) of the probe (3), and a card-simulating interface (5) of the probe (3) is inserted in the slot (S) of the terminal (T) under test. The test controller (2) communicates bi-directionally with the terminal (T) and an external transaction processing system (B). Up to six data monitoring points (100 to 105) are possible, different numbers of points providing different modes of operation.

Abstract: A method of dicing a wafer into a plurality of dies is disclosed. The wafer comprises a substrate having a surface on which at least one thin film layer is formed. The method comprises the steps of laser cutting a plurality of lines in the wafer to at least the depth of the at least one thin film layer; and saw cutting along the plurality of lines in the wafer to dice the wafer.