Patents by Inventor Aiman I. Alhoussami

Aiman I. Alhoussami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High power semiconductor switch module
    Patent number: 5563447
    Abstract: A high power module containing high power, high frequency semiconductor switching devices and methods of operating the same that provide high power and low inductance. The module incorporates compositional, geometrical and electrical symmetry. The module also includes short internal leads, special IC chip substrates, trimmable gate lead resistances, a special composite metal/ceramic baseplate, and a special terminal conductor overlap.
    Type: Grant
    Filed: September 7, 1993
    Date of Patent: October 8, 1996
    Assignee: Delco Electronics Corp.
    Inventors: Donald E. Lake, deceased, Aiman I. Alhoussami, Charles T. Eytcheson
  • Substrate subassembly for a transistor switch module
    Patent number: 5539254
    Abstract: A substrate subassembly for a high power module, and methods involving the same. The substrate subassembly contains only one switching transistor and has at least one integral short terminal lead tab. The substrate subassemblies can be pretested at significant operating current, to obtain enhanced characterization and matching of mounted switching transistors. Trimmable gate lead resistances can be incorporated in the substrate subassemblies. Enhanced compositional, geometrical and electrical module symmetry is available. New module structures and method are afforded.
    Type: Grant
    Filed: March 9, 1994
    Date of Patent: July 23, 1996
    Assignee: Delco Electronics Corp.
    Inventors: Charles T. Eytcheson, Donald E. Lake, deceased, Aiman I. Alhoussami, John D. Tagle, Timothy D. Martin, Lisa A. Viduya, Frank D. Lachenmaier
  • Substrate subassembly and method of making transistor switch module
    Patent number: 5492842
    Abstract: A substrate subassembly for a high power module, and methods involving the same. The substrate subassembly contains only one switching transistor and has at least one integral short terminal lead tab. The substrate subassemblies can be pretested at significant operating current, to obtain enhanced characterization and matching of mounted switching transistors. Trimmable gate lead resistances can be incorporated in the substrate subassemblies. Enhanced compositional, geometrical and electrical module symmetry is available. New module structures and method are afforded.
    Type: Grant
    Filed: January 30, 1995
    Date of Patent: February 20, 1996
    Assignee: Delco Electronics Corp.
    Inventors: Charles T. Eytcheson, Donald E. Lake, deceased, Aiman I. Alhoussami, John D. Tagle, Timothy D. Martin, Lisa A. Viduya, Frank D. Lachenmaier
  • Linear dual switch module
    Patent number: 5444295
    Abstract: A low inductance linear semiconductor switching module and methods of operating the same. The module can contain high power, high frequency semiconductor switching devices, operated to provide high power at low inductance. The module incorporates compositional, geometrical and electrical symmetry in a linear configuration. The module also includes short internal leads, special linear arrays substrates, special linear gate circuit constructions, special kelvin circuit constructions, special terminal subassemblies and special module interconnection techniques.
    Type: Grant
    Filed: September 7, 1993
    Date of Patent: August 22, 1995
    Assignee: Delco Electronics Corp.
    Inventors: Donald E. Lake, deceased, Aiman I. Alhoussami, Charles T. Eytcheson