Abstract: Techniques and mechanisms for configuring an integrated circuit (IC) chip to implement a protocol stack. In an embodiment, a transaction layer of the IC chip is operable to exchange with a link layer of the IC chip transaction layer packets (TLPs) having a format compatible with one defined in a Peripheral Component Interconnect Express™ (PCIe™) specification. Configuration circuitry of the IC chip provides for configuration of a first protocol stack including the transaction layer, circuitry of the link layer and a first physical layer of the IC chip. The configuration circuitry further provides for an alternative configuration of a second protocol stack including the transaction layer, circuitry of the link layer and a second physical layer of the IC chip. In another embodiment, the first protocol stack supports single-ended signaling to communicate TLP information, whereas the second protocol stack supports differential signaling to communicate TLP information.

Abstract: Techniques and mechanisms for configuring an integrated circuit (IC) chip to implement a protocol stack. In an embodiment, a transaction layer of the IC chip is operable to exchange with a link layer of the IC chip transaction layer packets (TLPs) having a format compatible with one defined in a Peripheral Component Interconnect Express™ (PCIe™) specification. Configuration circuitry of the IC chip provides for configuration of a first protocol stack including the transaction layer, circuitry of the link layer and a first physical layer of the IC chip. The configuration circuitry further provides for an alternative configuration of a second protocol stack including the transaction layer, circuitry of the link layer and a second physical layer of the IC chip. In another embodiment, the first protocol stack supports single-ended signaling to communicate TLP information, whereas the second protocol stack supports differential signaling to communicate TLP information.

Abstract: Techniques and mechanisms for configuring an integrated circuit (IC) chip to implement a protocol stack. In an embodiment, a transaction layer of the IC chip is operable to exchange with a link layer of the IC chip transaction layer packets (TLPs) having a format compatible with one defined in a Peripheral Component Interconnect Express™ (PCIe™) specification. Configuration circuitry of the IC chip provides for configuration of a first protocol stack including the transaction layer, circuitry of the link layer and a first physical layer of the IC chip. The configuration circuitry further provides for an alternative configuration of a second protocol stack including the transaction layer, circuitry of the link layer and a second physical layer of the IC chip. In another embodiment, the first protocol stack supports single-ended signaling to communicate TLP information, whereas the second protocol stack supports differential signaling to communicate TLP information.

Abstract: Techniques and mechanisms for configuring an integrated circuit (IC) chip to implement a protocol stack. In an embodiment, a transaction layer of the IC chip is operable to exchange with a link layer of the IC chip transaction layer packets (TLPs) having a format compatible with one defined in a Peripheral Component Interconnect Express™ (PCIe™) specification. Configuration circuitry of the IC chip provides for configuration of a first protocol stack including the transaction layer, circuitry of the link layer and a first physical layer of the IC chip. The configuration circuitry further provides for an alternative configuration of a second protocol stack including the transaction layer, circuitry of the link layer and a second physical layer of the IC chip. In another embodiment, the first protocol stack supports single-ended signaling to communicate TLP information, whereas the second protocol stack supports differential signaling to communicate TLP information.

Abstract: In one embodiment, the present invention includes apparatus that is formed on a single semiconductor die having one or more cores, a memory controller, and a hub coupled to the memory controller. The hub includes multiple fabrics each to communicate with a peripheral controller via a target interface and a master interface according to a first protocol, and where the fabrics are serially coupled via a first plurality of target interfaces in an upstream direction and a second plurality of target interfaces in a downstream direction. Other embodiments are described and claimed.

Abstract: In one embodiment, the present invention includes apparatus that is formed on a single semiconductor die having one or more cores, a memory controller, and a hub coupled to the memory controller. The hub includes multiple fabrics each to communicate with a peripheral controller via a target interface and a master interface according to a first protocol, and where the fabrics are serially coupled via a first plurality of target interfaces in an upstream direction and a second plurality of target interfaces in a downstream direction. Other embodiments are described and claimed.

Abstract: Techniques that may utilize generic tracker structures to provide data coherency in a multi-node system that supports non-snoop read and write operations. The trackers may be organized as a two-dimensional queue structure that may be utilized to resolve conflicting read and/or write operations. Multiple queues having differing associated priorities may be utilized.

Abstract: Techniques that may utilize generic tracker structures to provide data coherency in a multi-node system that supports non-snoop read and write operations. The trackers may be organized as a two-dimensional queue structure that may be utilized to resolve conflicting read and/or write operations. Multiple queues having differing associated priorities may be utilized.

Abstract: Techniques that may utilize generic tracker structures to provide data coherency in a multi-node system that supports non-snoop read and write operations. The trackers may be organized as a two-dimensional queue structure that may be utilized to resolve conflicting read and/or write operations. Multiple queues having differing associated priorities may be utilized.

Abstract: Techniques that may utilize generic tracker structures to provide data coherency in a multi-node system that supports non-snoop read and write operations. The trackers may be organized as a two-dimensional queue structure that may be utilized to resolve conflicting read and/or write operations. Multiple queues having differing associated priorities may be utilized.