Abstract: A grease protecting apparatus (10) includes a heat sink (12) defining a plurality of receiving cavities (124) therein, a layer of grease (16) spread on a surface (122) of the heat sink, and a grease cover (14) attached to the surface of the heat sink for protecting the grease from contamination. The cover includes a main body (142) defining a protecting space (143) therein for covering the grease, two wings (144) extending from two opposite sides of the main body, and a plurality of projections (148) extending from the wings for being snapped in the receiving cavities of the heat sink. The projection has a trapezium-shaped cross section.

Abstract: A heat dissipation device includes a fin unit (50), and at least a heat pipe (30) including an evaporating section (32) and at least a condensing section (34) extending through the fin unit. The fin unit includes a plurality of fins stacked together. Each fin comprises a wavy and a V-shaped section (52,53) and a planar section (54) therebetween. The wavy and V-shaped sections of the fins can guide an airflow flowing into the fin unit to smoothly flow therethrough, and prevent escape of the airflow from lateral directions of the fin unit. Furthermore, the wavy and V-shaped sections increase the heat dissipation area of the fins and strengthen the fins.

Abstract: A heat-pipe type heat sink (10) includes a plurality of fins (140) each defining at least a through hole (143) therein, at least a heat pipe (16) extending through the through holes of the fins, and soldering material filled in spaces formed between the heat pipe and the fins. A sidewall of the through hole forms a first fringe (145) contacting with the heat pipe, and a second fringe (146) smoothly and linearly connecting with the first fringe. The second fringe includes two guide portions (147), which are capable of guiding the molten soldering material to flow towards the first fringe to fill in the spaces to bond the heat pipe to the fins after the molten soldering material is cooled. The through hole has a teardrop-like shape.

Abstract: A heat dissipation device includes a fin unit (50), and at least a heat pipe (30) including an evaporating section (32) and at least a condensing section (34) extending through the fin unit. The fin unit includes a plurality of fins stacked together. Each fin comprises a wavy and a V-shaped section (52,53) and a planar section (54) therebetween. The wavy and V-shaped sections of the fins can guide an airflow flowing into the fin unit to smoothly flow therethrough, and prevent escape of the airflow from lateral directions of the fin unit. Furthermore, the wavy and V-shaped sections increase the heat dissipation area of the fins and strengthen the fins.

Abstract: A grease protecting apparatus (10) includes a heat sink (12) defining a plurality of receiving cavities (124) therein, a layer of grease (16) spread on a surface (122) of the heat sink, and a grease cover (14) attached to the surface of the heat sink for protecting the grease from contamination. The cover includes a main body (142) defining a protecting space (143) therein for covering the grease, two wings (144) extending from two opposite sides of the main body, and a plurality of projections (148) extending from the wings for being snapped in the receiving cavities of the heat sink. The projection has a trapezium-shaped cross section.

Abstract: A heat dissipating device (1) for removing heat from electronic devices is disclosed. The heat dissipating device includes a heat sink (30) and at least one heat pipe (20). The heat sink includes a Y-shaped heat conductive body and a plurality of fins (35) extending from the body. The body includes a solid block (32) and two extension arms (34) extending aslant from a top of the block in opposite directions. An U-shaped groove (35) is defined in the block and extends to an upper portion (33) of the block. The heat pipe comprises an evaporating portion (22) and a condensing portion (24) extending upwardly from the evaporating portion. The heat pipe is received in the groove so that the heat pipe absorbs heat via the evaporating portion and transfers the heat to the upper portion of the block via the condensing portion thereof.

Abstract: A heat dissipating device (1) for removing heat from electronic devices is disclosed. The heat dissipating device includes a heat sink (30) and at least one heat pipe (20). The heat sink includes a Y-shaped heat conductive body and a plurality of fins (35) extending from the body. The body includes a solid block (32) and two extension arms (34) extending aslant from a top of the block in opposite directions. An U-shaped groove (35) is defined in the block and extends to an upper portion (33) of the block. The heat pipe comprises an evaporating portion (22) and a condensing portion (24) extending upwardly from the evaporating portion. The heat pipe is received in the groove so that the heat pipe absorbs heat via the evaporating portion and transfers the heat to the upper portion of the block via the condensing portion thereof.

Abstract: A heat sink clip (50) is formed from a single piece of resilient metal by stamping. The heat sink clip includes an operation portion (59), a pressing body (51), a first and second arms (54, 57) extending from the opposite ends of the pressing body. The first and second arms each defines an aperture (55, 58) for engaging with a catch (22) on a socket (20) on which an electronic device (30) is mounted. The pressing body presses a heat sink (40) onto the electronic device. The operation portion extends from an end of the pressing body for readily engaging/disengaging the clip.

Abstract: A clip assembly (30) includes a nail member (40), a sleeve member (60), and a spring (50) around the sleeve member. The nail member includes a cap (42), a post (44), a neck (46) and a cone-shaped barb (48). A pair of wedges (442) is formed on an outer surface of the post. The sleeve member is cylindrical. The sleeve member defines a central bore (62) for receiving the nail member, and a pair of rectangular slots (66) for receiving the wedges. A circumferential shoulder (68) is formed on the sleeve member, for abutting against a bottom surface of a heat sink. A lower portion (72) of the sleeve member defines cutouts (722), thereby also forming deformable fingers (723). The sleeve member is interposed between the heat sink and a PCB. The nail member is inserted down through the lower portion, and elastically expands the fingers of the sleeve member.

Abstract: A heat sink clip (50) is formed from a single piece of resilient metal by stamping. The heat sink clip includes an operation portion (59), a pressing body (51), a first and second arms (54, 57) extending from the opposite ends of the pressing body. The first and second arms each defines an aperture (55, 58) for engaging with a catch (22) on a socket (20) on which an electronic device (30) is mounted. The pressing body presses a heat sink (40) onto the electronic device. The operation portion extends from an end of the pressing body for readily engaging/disengaging the clip.