Patents by Inventor Ainissa G Ramirez

Ainissa G Ramirez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110210283
    Abstract: A low melting temperature composite material including an alloy having about 0.1% by weight to about 99% by weight of tin and about 0.1% by weight to about 90% by weight of an element selected from the group consisting of silver and gold, and about 0.1% by weight to about 50% by weight of magnetic particles dispersed in the alloy. Method of heating such a composite material, remotely manipulating such a composite material with magnetic fields, enhancing the mechanical properties of such a material, and making such a material are also disclosed.
    Type: Application
    Filed: February 23, 2011
    Publication date: September 1, 2011
    Inventors: Ainissa G. Ramirez, Eric L. Hayes
  • Patent number: 6869007
    Abstract: A method for fabricating a reactive solder or braze includes forming a metallic matrix with an interior region and surface regions by actively providing a higher concentration of reactive atoms to the interior region than to the surface regions.
    Type: Grant
    Filed: January 15, 2002
    Date of Patent: March 22, 2005
    Assignee: Lucent Technologies Inc.
    Inventors: Sungho Jin, Hareesh Mavoori, Ainissa G Ramirez
  • Publication number: 20020106528
    Abstract: A method for fabricating a reactive solder or braze includes forming a metallic matrix with an interior region and surface regions by actively providing a higher concentration of reactive atoms to the interior region than to the surface regions.
    Type: Application
    Filed: January 15, 2002
    Publication date: August 8, 2002
    Inventors: Sungho Jin, Hareesh Mavoori, Ainissa G. Ramirez
  • Patent number: 6319617
    Abstract: A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. The solder composition exhibits a microstructure containing a solder matrix in which is distributed fine, micron-scale islands of rare-earth-containing intermetallic particles. The existence of the islands makes the rare earth elements better available for bonding, and reduce the extent to which the rare earths are oxidized. Advantageously, the solder contains Au and/or Ag, in which the rare earth elements tend to have some solid solubility. Due to this solubility, the Au and/or Ag tend to provide some additional protection of the rare earths against oxidation, and thereby also provide accelerated dissolution of the rare earth into the molten solder.
    Type: Grant
    Filed: August 18, 2000
    Date of Patent: November 20, 2001
    Assignee: Agere Systems Gaurdian Corp.
    Inventors: Sungho Jin, Guenther Wilhelm Kammlott, Hareesh Mavoori, Ainissa G Ramirez
  • Patent number: 6306516
    Abstract: The invention provides an article comprising a solder that bonds well to oxides and other surfaces to which solder bonding is problematic. The solder composition contains one or more rare earth elements, which react with the oxide or other surface to promote bonding, and further contains sufficient Au and/or Ag to act as carriers for the rare earths. Because rare earths have some solid solubility in Au and Ag, the problem of intermetallic formation is lessened or eliminated, and improved bonding to oxide surfaces is attained.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: October 23, 2001
    Assignee: Agere Systems Guardian Corp.
    Inventors: Sungho Jin, Hareesh Mavoori, Ainissa G Ramirez
  • Publication number: 20010008157
    Abstract: A device having electrical contacts formed from an alloy having improved wear resistance is provided, the alloy being particularly useful in microrelay devices formed by MEMS technology. In one embodiment, the alloys are chosen to allow sufficient precipitation hardening to improve wear resistance, but keep precipitation below a level that would unacceptably reduce electrical conductivity. This is achieved by using alloying materials that have very limited or no solid solubility in the noble metal matrix, e.g., less than 4 wt. % solid solubility. In a second embodiment, an alloy contains a noble metal matrix and insoluble, dispersoid particles having no solubility in the matrix, these dispersoid particles offering a similar strengthening mechanism.
    Type: Application
    Filed: December 6, 2000
    Publication date: July 19, 2001
    Inventors: David John Bishop, Sungho Jin, Jungsang Kim, Ainissa G. Ramirez, Robert Bruce Van Dover
  • Patent number: 6124650
    Abstract: An actuation device employing square-loop latchable magnetic material having a magnetization direction (polarization) capable of being changed in response to exposure to an external magnetic field is disclosed. The magnetic field is created by a conductor assembly with non-solenoid configuration. Once the magnetization direction of the material is so changed, the external magnetic field is no longer required to maintain the new magnetization direction. The latchable magnetic material is disposed on the mobile electrode of a switching device, and another magnetic material is disposed in spaced relation to the latchable magnetic material on a stationary electrode or surface. By applying an electrical current to a conductor assembly arranged proximate the latchable material, a magnetic field is created about the latchable magnetic material, to change the magnetization direction and thereby enable the attraction or repulsion of another magnetic material located on the stationary electrode.
    Type: Grant
    Filed: October 15, 1999
    Date of Patent: September 26, 2000
    Assignee: Lucent Technologies Inc.
    Inventors: David John Bishop, Sungho Jin, Jungsang Kim, Ainissa G. Ramirez