Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology for the pick-up and release of materials, respectively.

Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with vacuum for the pick up and release of materials, respectively.

Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with at least one mechanically actuated modality for the pick-up and release of materials, respectively. The mechanically actuated modality in one embodiment is configured as a netting configured to be placed over a contact surface of an electroadhesive plate to facilitate the handling of an object.

Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology for the pick-up and release of materials, respectively.

Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with at least one mechanically actuated modality for the pick-up and release of materials, respectively.

Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with vacuum for the pick up and release of materials, respectively.

Abstract: In one embodiment, the present invention includes a method for receiving entries in a database, each corresponding to a semiconductor lot to be processed, automatically assigning each of the entries to a process tool, and dynamically dispatching the semiconductor lot corresponding to an assigned entry to the corresponding assigned process tool based on status information of the assigned process tool. Other embodiments are described and claimed.

Abstract: The operation of a semiconductor fabrication facility may be automated to enable efficient assignments of lots to specific process tools or entities. This may involve the use of an algorithm which may have aspects which are common across various process areas within the fabrication facility. However, the algorithm may be customized to meet the needs of specific process areas.

Abstract: In one embodiment, the present invention includes a method for receiving entries in a database, each corresponding to a semiconductor lot to be processed, automatically assigning each of the entries to a process tool, and dynamically dispatching the semiconductor lot corresponding to an assigned entry to the corresponding assigned process tool based on status information of the assigned process tool. Other embodiments are described and claimed.

Abstract: The operation of a semiconductor fabrication facility may be automated to enable efficient assignments of lots to specific process tools or entities. This may involve the use of an algorithm which may have aspects which are common across various process areas within the fabrication facility. However, the algorithm may be customized to meet the needs of specific process areas.

Abstract: In one embodiment, a method for upfront specification of lot process parameters to enable automated processing is disclosed. The method comprises specifying a combination of one or more process parameters in a template associated with a tool, the process parameters associated with a process flow for a lot to be processed by the tool, and subsequent to the specifying, automatically retrieving by the tool the specified combination of process parameters at least one of when the lot arrives at the tool for processing, during processing of the lot by the tool, and after processing of the lot by the tool, wherein automatically retrieving includes retrieving the specified combination without human intervention. Other embodiments are also described.

Abstract: According to one aspect of the invention, a method for managing the storage of semiconductor material is provided. The method may include processing a plurality of semiconductor substrates with a first type of semiconductor substrate processing tool to create a plurality of a first type of semiconductor substrate, determining the contents of a plurality of storage devices, each storage device being connected to a second type of semiconductor substrate processing tool, and selecting a maximum number of the first type of semiconductor substrate to be stored in each storage device, the maximum number being less than a storage capacity of the respective storage device.