Abstract: Proximity sensor devices are described that integrate a light emitting diode with a light sensor assembly in a single, compact package. The proximity sensor devices comprise a substrate having a surface. The light emitting diode and light sensor assembly are mounted to the substrate proximate to the surface. The light emitting diode is configured to emit electromagnetic radiation in a limited spectrum of wavelengths, while the light sensor assembly is configured to detect electromagnetic radiation in the limited spectrum of wavelengths emitted by the light emitting diode. An encapsulation layer is formed on the surface over the light emitting diode and light sensor assembly. A trench is formed in the encapsulation layer to receive electromagnetic radiation blocking material configured to block electromagnetic radiation in the limited spectrum of wavelengths to at least partially mitigate crosstalk between the light emitting diode and the light sensor assembly.

Abstract: Proximity sensor devices are described that integrate a light emitting diode with a light sensor assembly in a single, compact package. The proximity sensor devices comprise a substrate having a surface. The light emitting diode and light sensor assembly are mounted to the substrate proximate to the surface. The light emitting diode is configured to emit electromagnetic radiation in a limited spectrum of wavelengths, while the light sensor assembly is configured to detect electromagnetic radiation in the limited spectrum of wavelengths emitted by the light emitting diode. An encapsulation layer is formed on the surface over the light emitting diode and light sensor assembly. A trench is formed in the encapsulation layer to receive electromagnetic radiation blocking material configured to block electromagnetic radiation in the limited spectrum of wavelengths to at least partially mitigate crosstalk between the light emitting diode and the light sensor assembly.

Abstract: A package that electrically connects an integrated circuit to a printed circuit board includes a frame and a package body that encases a portion of the frame and the integrated circuit. The frame includes a mounting region that is connected to the printed circuit board, and a cantilevering region that cantilevers away from the mounting region. The cantilevering region retains the integrated circuit in a flexible fashion.

Abstract: An IC package including one or more z-axis interconnects for performing at least in part the fan-in/fan out interconnection for electrically coupling contacts of semiconductor die to external contacts of the package. The z-axis interconnect comprises a matrix of electrically conducting elements extending from the top to the bottom surface of the interconnect. Each conductive element is internally insulated from other conductive elements of the matrix. The semiconductor contacts may be electrically coupled to separate portions of the matrix by way of electrical connections to the top of the z-axis interconnect. Similarly, the external contacts of the package may be electrically coupled to the same separate portions of the matrix by way electrical connections to the bottom of the interconnect. The z-axis interconnect improves the miniaturization, integration, thermal and electrical performance of IC packages.

Abstract: A lead frame to support a semiconductor die within an encapsulating package. The lead frame includes a first rail and a second rail in a first plane, with the second rail parallel to and spaced apart from the first rail by more than the length of the package. A first bar and a second bar are connected perpendicularly to the first and second rails, with the second bar spaced apart from the first bar by more than the width of the package. A lead is connected perpendicularly to the first bar with an unconnected lead end extending toward the second bar and located to extend under the supported semiconductor die. A first support tab is connected perpendicularly to the first rail with a first unconnected tab end extending toward the second rail and located to extend under the supported semiconductor die. A second support tab is connected perpendicularly to the second rail with a second unconnected tab end extending toward the first rail and located to extend under the supported semiconductor die.