Abstract: The integrated unmanned, affordable, microsystem in accordance with the present invention is used to deploy physical or chemical sensors for continuous monitoring of sea space over large time periods. The microsystem is capable of measuring ocean physical parameters over large time spans weeks, with higher accuracies and resolution and at significantly lower costs that the other sensors currently known in the art.

Abstract: The integrated unmanned, affordable, microsystem in accordance with the present invention is used to deploy physical or chemical sensors for continuous monitoring of sea space over large time periods. The microsystem is capable of measuring ocean physical parameters over large time spans weeks, with higher accuracies and resolution and at significantly lower costs that the other sensors currently known in the art.

Abstract: A structure and process for packaging RF MEMS and other devices employs a substrate of silicon, for example, and a cap of glass, for example, having cavities to receive the devices. MEMS or other devices are supported on an upper surface of the substrate, into which metal-filled blind vias are formed. The cap is attached to the substrate, so as to enclose designated MEMS or other devices in the cavities. The substrate is then thinned so as to expose the metal of the vias at a lower surface of the substrate. Electrical connecting elements such as solder balls are then applied to the metal of the vias. The resultant composite substrate is then divided to provide individual packaged devices.

Abstract: Compositions comprising nanoparticles, microparticles, and combinations thereof, the particles may be overcoated particles. Composite coatings and coated articles made therefrom, the coatings comprising mono or multi layers having a textured outer surface morphology, the layers may be continuous and/or discontinuous and may comprise different particle phases. Methods of making and using said compositions, coatings and coated articles.

Abstract: A microscale device provides for a nanoscale machining. A tool, similar to probes used in atomic force microscopy is attached to a micro-load gear and is powered by a micromotor. This very small tool allows a variety of nanostructures to be fabricated on a variety of substrates.

Abstract: A structure and process for packaging RF MEMS and other devices employs a substrate of silicon, for example, and a cap of glass, or example, having cavities to receive the devices. MEMS or other devices are supported on an upper surface of the substrate, into which metal-filled blind vias are formed. The cap is attached to the substrate, so as to enclose designated MEMS or other devices in the cavities. The substrate is then thinned so as to expose the metal of the vias at a lower surface of the substrate. Electrical connecting elements such as solder balls are then applied to the metal of the vias. The resultant composite substrate is then divided to provide individual packaged devices.