Abstract: An adherent coating for carbide and ceramic substrates employs a thin layer of hafnium nitride (HfN) between the substrate and a subsequent layer or layers. The thin layer may be employed without thermal cracking due to heat during use, such as for the insert of a cutting tool, because the upper layer or layers provide a gradual transition of material properties to a harder, less thermally conductive material on the outermost layer. A particular arrangement of layers on the carbide or ceramic substrate and hafnium nitride layer may be, from innermost to outermost layer, titanium carbide, aluminum oxide, and titanium nitride.

Abstract: A high-strength coating for dental and orthopedic implants utilizing hydroxyapatite (HAp) nanoparticles provides for a high level of osseointegration through a range of surface pore sizes in the micro- to nanoscale. Zinc oxide (ZnO) nanoparticles may be incorporated with the HAp nanoparticles to form a composite coating material, with ZnO providing infection resistance due to its inherent antimicrobial properties. A textured surface, consisting of “islands” of roughly square coating structures measuring about 250 ?m on a side, with spacing of 50-100 ?m therebetween, may further promote the osseointegration and antimicrobial properties of the implant coating.

Abstract: A method for patterning nanostructures in a semiconductor heterostructure, which has at least a first layer and a second layer, wherein the first layer has a first surface and an opposite, second surface, the second layer has a first surface and an opposite, second surface, and the first layer is deposited over the second layer such that the second surface of the first layer is proximate to the first surface of the second layer. The method includes the steps of making indentations in a pattern on the first surface of the first layer of the semiconductor heterostructure; bonding the semiconductor heterostructure to a support substrate such that the first surface of the first layer of the semiconductor heterostructure is faced to the support substrate; etching off the second layer of the semiconductor heterostructure; and depositing a third layer over the second surface of the first layer of the semiconductor heterostructure.

Abstract: A device having the capability for electrical, thermal, optical, and fluidic interconnections to various layers. Through-substrate vias in the interconnect device are filled to enable electrical and thermal connection or optionally hermetically sealed relative to other surfaces to enable fluidic or optical connection. Optionally, optical components may be placed within the via region in order to manipulate optical signals. Redistribution of electrical interconnection is accomplished on both top and bottom surfaces of the substrate of the interconnect chip.

Abstract: Methods for creating coatings composed of a single material or a composite of multiple materials, beginning with ESC to deposit the base layer and then using other methods for the binding step beyond CVI. Also, for certain materials and applications, some pre-processing or pre-treatment of the coating materials is necessary prior to deposition in order to achieve a satisfactory coating. This application discloses methods for pre-deposition treatment of materials prior to ESC deposition. It also discloses methods for post-processing that provide additional functionality or performance characteristics of the coating. Finally, this application discloses certain apparatus and equipment for accomplishing the methods described herein.

Abstract: An infinitely stackable interconnect device and method having the capability for electrical, thermal, optical, and fluidic interconnections to various layers. Through-substrate vias in the interconnect device are filled to enable electrical and thermal connection or optionally hermetically sealed relative to other surfaces to enable fluidic or optical connection. Optionally, optical components may be placed within the via region in order to manipulate optical signals. Redistribution of electrical interconnection is accomplished on both top and bottom surfaces of the substrate of the interconnect chip.

Abstract: Compositions comprising nanoparticles, microparticles, and combinations thereof, the particles may be overcoated particles. Composite coatings and coated articles made therefrom, the coatings comprising mono or multi layers having a textured outer surface morphology, the layers may be continuous and/or discontinuous and may comprise different particle phases. Methods of making and using said compositions, coatings and coated articles.

Abstract: A composition that includes solid lubricant nanoparticles and an organic medium is disclosed. Also disclosed are nanoparticles that include layered materials. A method of producing a nanoparticle by milling layered materials is provided. Also disclosed is a method of making a lubricant, the method including milling layered materials to form nanoparticles and incorporating the nanoparticles into a base to form a lubricant.

Abstract: An apparatus for nano-scale electric discharge machining of a conductive workpiece. In one embodiment, the apparatus includes a dielectric medium deposited on a surface of the workpiece to form a dielectric layer having a thickness, a positioning device capable of moving in three dimensions, an electrode having a nano-scaled tip and mounted to the positioning device, a power source electrically coupled with the electrode and the workpiece, and a controller in communication with the positioning device for generating a signal to cause the nano-scaled tip of the electrode to move to a desired position over the surface of the workpiece. In operation a biasing voltage over a threshold voltage is applied from the power source between the nano-scaled tip of the electrode and the surface of the workpiece such that an avalanche current is formed across the nano-scaled tip of the electrode and the surface of the workpiece to perform machining of the workpiece.

Abstract: A method of making a nanoparticulate based lubricant is disclosed. The method includes providing solid lubricant material with particles having a size less than or equal to about 500 nanometers, and treating the particles to create composite nanoparticles. The composite nanoparticles includes the solid lubricant material and at least a second material.

Abstract: The surface of a semiconductor material, e.g., gallium arsenide, is passivated by irradiating the surface with ultra-short laser pulses, until a stable passive surface is achieved. The passive surface so prepared is devoid of a superficial oxide layer.

Abstract: A structure and process for packaging RF MEMS and other devices employs a substrate of silicon, for example, and a cap of glass, for example, having cavities to receive the devices. MEMS or other devices are supported on an upper surface of the substrate, into which metal-filled blind vias are formed. The cap is attached to the substrate, so as to enclose designated MEMS or other devices in the cavities. The substrate is then thinned so as to expose the metal of the vias at a lower surface of the substrate. Electrical connecting elements such as solder balls are then applied to the metal of the vias. The resultant composite substrate is then divided to provide individual packaged devices.

Abstract: Methods for coating a substrate and methods of shaping a workpiece comprise formation and use, respectively, of a surface or substrate comprising a first phase selected from nitrides, carbides. carbonitrides, borides, sulphides, chalcogenides, oxides, and silicides, and a second phase selected from nitrides, carbides, carbonitrides, borides, sulphides, chalcogenides, oxides, and silicides, wherein said second phase comprises a multiplicity of discrete portions positioned into the first phase, with these multiplicity of portions comprising a continuous second phase, and made thereof, coating and articles, especially machining, cutting and shaping tools, wearparts, and methods of making and using the composition, coating and articles.

Abstract: A composition including a first phase selected from nitrides, carbides, carbonitrides, borides, sulphides, chalcogenides, oxides, and silicides, and a second phase selected from nitrides, carbides, carbonitrides, borides, sulphides, chalcogenides, oxides, and silicides, wherein said second phase comprises a multiplicity of discrete portions positioned into the first phase, with these multiplicity of portions comprising a continuous second phase, and made thereof, coatings and articles, especially, machining, cutting and shaping tools, wearparts, and methods of making and using the composition, coating and articles.

Abstract: Method and apparatus for seeding silicon substrates with diamond particles by electrostatic seeding. Method further includes either application of heat to form the particles into a layer, or chemical vapor deposition of diamond layer onto the particles. Disclosed products include silicon substrate having electrostatically affixed diamond particles, silicon substrate having particles at a density of at least 1012 particles per cm2, and silicon substrate having polycrystalline layer having nucleation density of at least 1012 particles per cm2.

Abstract: A composition including a first phase selected from nitrides, carbides, carbonitrides, borides, sulphides, chalcogenides, oxides, and suicides, and a second phase selected from nitrides, carbides, carbonitrides, borides, sulphides, chalcogenides, oxides, and suicides, wherein said second phase comprises a multiplicity of discrete portions positioned into the first phase, with these multiplicity of portions comprising a continuous second phase, and made thereof, coatings and articles, especially, machining, cutting and shaping tools, wearparts, and methods of making and using the composition, coating and articles.

Abstract: A method of processing a substrate by first processing the diamond surface with a laser operating at a first wavelength, and then by processing the diamond surface with a laser operating at a second wavelength.

Abstract: A method of processing a substrate by first processing the substrate surface with a laser operating at a first wavelength to both evaporate a portion of the substrate and structurally weaken the substrate surface, and then by processing the substrate surface with a laser operating at a second wavelength to remove the structurally weakened surface.

Abstract: Disclosed is an electroplating method and products made therefrom, which in one embodiment includes using a current density J.sub.O, to form a conductive metal layer having a surface roughness no greater than the surface roughness of the underlying member. In another embodiment of electroplating a substrate surface having peaks and valleys, the method includes electroplating a conductive metal onto the peaks to cover the peaks with the conductive metal, and into the valleys to substantially fill the valleys with the conductive metal.

Abstract: Disclosed are polished and planarized diamond films and a method and apparatus for polishing and planarizing diamond films. The method generally includes mechanical polishing of the diamond film against a ceramic surface in the presence of a treating agent of potassium nitrate and a polishing agent of potassium hydroxide. The produced films have an average surface roughness on the order of 0.05 microns, a planarization uniformity within eight percent, and are relatively free of process-induced contaminants.