Abstract: A heat spreader and stiffener device has a stiffener portion extending towards a center of the heat spreader and stiffener device and mountable to a die-side surface of a substrate.

Abstract: Systems and methods for securing a mobile asset. In an implementation, a method includes receiving a user ID code associated with a user, receiving an asset ID code associated with a mobile asset, determining if the asset ID code is associated with the user ID code, and emitting an alarm indicator if the asset ID code is not associated with the user ID code.

Abstract: To decrease the thickness, or stack height, of an electronics package, the package includes a solderless compression connector between an integrated circuit (IC) package and a substrate such as a printed circuit board (PCB). In one embodiment, the IC package is mounted on the substrate using a land grid array arrangement. Corresponding lands on the IC package and substrate are coupled using a solderless compression connector. The compression connector includes a plurality of electrically conductive particles, and a thin, flexible apertured support that aligns the particles with corresponding lands on the IC package and substrate. A compression connector may also be used to electrically couple an IC to an IC package substrate. Methods of fabrication, as well as application of the package to an electronic assembly, an electronic system, and a data processing system, are also described.

Abstract: A process of making a reworkable thermal interface material is described. The reworkable thermal interface material is bonded to a die and a heat sink. The reworkable thermal interface material includes a phase-change polymer matrix material. Other materials in the reworkable thermal interface material can include heat transfer particles and low melting-point metal particles. The phase-change polymer matrix material includes a melting temperature below a selected temperature and the heat transfer particles have a melting temperature substantially above the selected temperature. The heat transfer particles act as a spacer limit, which holds the thermal interface material to a given bond-line thickness during use.

Abstract: To decrease the weight and the thickness, and to increase the flexibility, of an electronics package, the package includes an integrated circuit (IC) mounted on a flexible tape substrate. In an embodiment, an IC is mounted on a flexible tape substrate using a ball grid array arrangement; however, other arrangements, including lead bonding, can be used. The flexible tape substrate can comprise conductive traces, vias, and patterns of lands on one or more layers. Methods of fabrication, as well as application of the flexible tape package to an electronic assembly, an electronic system, and a data processing system, are also described.

Abstract: An electronic package with improved power delivery performance, lowering the impedance associated with the power delivery. The electronic package includes an integrated circuit die mounted on the substrate of the electronic package and decoupling capacitors placed underneath the substrate. The package further includes stand-offs placed underneath the substrate, sized for maintaining a distance between the capacitors and another substrate.

Abstract: An apparatus, comprising: a plurality of stacked computer components comprising; a vapor chamber, and a centerpoint force, wherein the centerpoint force is applied to the vapor chamber.

Abstract: An electronic package with improved power delivery performance, lowering the impedance associated with the power delivery. The electronic package includes an integrated circuit die mounted on the substrate of the electronic package and decoupling capacitors placed underneath the substrate. The package further includes stand-offs placed underneath the substrate, sized for maintaining a distance between the capacitors and another substrate.

Abstract: Arrangements are used to increase the structural rigidity of a semiconductor package.

Abstract: An apparatus that includes a number of stacked computer components such as a vapor chamber, and a centerpoint force, wherein the centerpoint force is applied to the vapor chamber.

Abstract: An apparatus, comprising: a plurality of stacked computer components comprising; a vapor chamber, and a centerpoint force, wherein the centerpoint force is applied to the vapor chamber.